JPS6181152U - - Google Patents

Info

Publication number
JPS6181152U
JPS6181152U JP1984166661U JP16666184U JPS6181152U JP S6181152 U JPS6181152 U JP S6181152U JP 1984166661 U JP1984166661 U JP 1984166661U JP 16666184 U JP16666184 U JP 16666184U JP S6181152 U JPS6181152 U JP S6181152U
Authority
JP
Japan
Prior art keywords
heat sink
exposed
lead
semiconductor chip
lead portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984166661U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984166661U priority Critical patent/JPS6181152U/ja
Publication of JPS6181152U publication Critical patent/JPS6181152U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示し、aは斜視図
、bは要部断面図、第2図は従来の高損失集積回
路の斜視図、第3図は第1図に用いられているヒ
ートシンクの斜視図、第4図は別の実施例の斜視
図、第5図はヒートシンクの別の実施例の斜視図
である。 1:半導体チツプ、2:リード部、21:足、
3:マウント部、4:樹脂体、5:ヒートシンク
、51:端面。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームの半導体チツプマウント部がヒ
    ートシンクの一方の端面上に固定され、半導体チ
    ツプの端子電極がリードフレームのリード部の一
    端に接続され、前記ヒートシンクおよび前記リー
    ド部の他端が樹脂体より露出し、前記リード部の
    露出部の先端が前記ヒートシンクの露出方向と異
    なる方向に延ばされたことを特徴とする集積回路
JP1984166661U 1984-11-02 1984-11-02 Pending JPS6181152U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984166661U JPS6181152U (ja) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984166661U JPS6181152U (ja) 1984-11-02 1984-11-02

Publications (1)

Publication Number Publication Date
JPS6181152U true JPS6181152U (ja) 1986-05-29

Family

ID=30724471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984166661U Pending JPS6181152U (ja) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPS6181152U (ja)

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