JPS6181141U - - Google Patents

Info

Publication number
JPS6181141U
JPS6181141U JP1984166660U JP16666084U JPS6181141U JP S6181141 U JPS6181141 U JP S6181141U JP 1984166660 U JP1984166660 U JP 1984166660U JP 16666084 U JP16666084 U JP 16666084U JP S6181141 U JPS6181141 U JP S6181141U
Authority
JP
Japan
Prior art keywords
semiconductor chip
resin
recess
fixed
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984166660U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984166660U priority Critical patent/JPS6181141U/ja
Publication of JPS6181141U publication Critical patent/JPS6181141U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を樹脂を除いて示し
、ａは平面図、ｂは断面図、第２図は従来例を樹
脂を除いて示し、ａは平面図、ｂは正面図、第３
図は第１図に示した実施例のチツプ固着前におけ
る斜視図である。 １：マウント部、２：外部リード部、３：半導
体チツプ、４：ボンデイングワイヤ、５：樹脂、
７：凹部、７：傾斜面、７２：底面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属よりなるマウント部上に半導体チツプが固
    着され、半導体チツプの上面の電極と外部リード
    部とがボンデイングワイヤにより接続され、半導
    体チツプが樹脂により被覆されるものにおいて、
    マウント部に階段状の傾斜面に囲まれた底面を有
    する凹部が形成され、該凹部の底面上に半導体チ
    ツプが固着されたことを特徴とする樹脂封止型半
    導体装置。
JP1984166660U 1984-11-02 1984-11-02 Pending JPS6181141U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984166660U JPS6181141U (ja) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984166660U JPS6181141U (ja) 1984-11-02 1984-11-02

Publications (1)

Publication Number Publication Date
JPS6181141U true JPS6181141U (ja) 1986-05-29

Family

ID=30724470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984166660U Pending JPS6181141U (ja) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPS6181141U (ja)

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