JPS618341A - Printed circuit substrate with flexible resistance layer - Google Patents
Printed circuit substrate with flexible resistance layerInfo
- Publication number
- JPS618341A JPS618341A JP59127627A JP12762784A JPS618341A JP S618341 A JPS618341 A JP S618341A JP 59127627 A JP59127627 A JP 59127627A JP 12762784 A JP12762784 A JP 12762784A JP S618341 A JPS618341 A JP S618341A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- printed circuit
- resistance
- resistance layer
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 18
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 10
- 229910001887 tin oxide Inorganic materials 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 229920006162 poly(etherimide sulfone) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は可撓性基板上に、第一層目として抵抗層、更に
第二層目として導体層を設けた抵抗層付プリント回路基
板に関テる。更に詳しくは、ボリイミ”ドフィルムに代
表さ′れる耐熱性フィルム、わるいは金属箔上に耐熱性
樹脂を被覆した二層からなる可撓性基板上に、第一層目
として、酸化スズが主成分である抵抗層を設け、更に第
二層として導体層を設けた事を特徴とする抵抗層付プリ
ント回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board with a resistive layer, which has a resistive layer as a first layer and a conductor layer as a second layer on a flexible substrate. More specifically, a heat-resistant film such as a polyimide film, or a flexible substrate consisting of two layers of heat-resistant resin coated on metal foil, is coated with tin oxide as the first layer. The present invention relates to a printed circuit board with a resistive layer, characterized in that a resistive layer is provided as a component, and a conductor layer is further provided as a second layer.
従来“よシ抵抗層付プリント回路基板としては、印刷法
、無電解メッキ法、蒸着法等によって基板上に形成した
ものがあるが、いずれもガラスセラミックス等に代表さ
れる硬質基板上に形成されている。したがってこれらの
基板を用いて実装する際には、一様に平面的な場所が必
要で、凹凸面や、狭い平面上並びに曲面上の間隙部分に
実装する事は不可能である。そこで上記の欠点を補うた
めには、可撓性の優れた薄い基板を用いる事が必要にな
る。しかしながらこの様に可撓性のある基板に抵抗層を
設けた際の問題点は、ニクロムに代表される様に従来用
いられている抵抗体はいずれも硬度が大きいため、基板
の変形に伴ないクラックが生じ、抵抗体としての使用が
不可能であった。Conventional printed circuit boards with resistance layers have been formed on substrates by printing methods, electroless plating methods, vapor deposition methods, etc., but all of them are formed on hard substrates such as glass ceramics. Therefore, when mounting using these substrates, a uniformly flat location is required, and it is impossible to mount on an uneven surface, a narrow flat surface, or a gap on a curved surface. Therefore, in order to compensate for the above drawbacks, it is necessary to use a thin substrate with excellent flexibility.However, the problem with providing a resistance layer on such a flexible substrate is that As typified by the fact that all conventionally used resistors have high hardness, cracks occur as the substrate deforms, making it impossible to use them as resistors.
本発明は上記の問題点を解決したものであシ、可撓性基
板の変形に対して杜、抵抗体自体の伸びによってクラッ
クの発生を押さえ、種々の実装状態の使用にも耐え、か
つ抵抗体としてもニクロム以上の性能を有する抵抗層付
プリント基板を見出したものである。The present invention has solved the above-mentioned problems, and has the ability to withstand the deformation of a flexible substrate, suppress the occurrence of cracks due to the elongation of the resistor itself, and withstand use in various mounting conditions. We have discovered a printed circuit board with a resistive layer that has better physical performance than Nichrome.
従来より抵抗体の要求性能としては、比抵ｖＬｉ＝高く
、経時変化が少なく、かつ抵抗温度係数が小さい事が望
まれ、現在に至るまで多くの組成について検討されて来
た。本発明による酸化スズを主成分とする抵抗体の場合
には、ニクロムにッケル：クロムの重量比８０Ｓ ：
２０％）に比べ伸びが約６０倍に増加する事を見出した
。このため所望の抵抗値を得るために、種々の基板の変
形が伴なうエツチング加工を経ても、抵抗値に異常がな
い抵抗体パターンｄ！形成出来、更に種々の実装状態に
於いても、抵抗値変化が認められない、非宵に可撓性の
優れた抵抗層付プリント回路基板を得る事が出来た。又
本発明の酸化スズを主成分とする抵抗＃社、ニクロムに
比べ１０倍以上の比抵抗を有するため、パターン加工に
より、ニクロムに比べ広い抵抗値ｔＳの抵抗体を形成す
る事が可能になり、又抵抗体の小型化が容易になった。Conventionally, the required performance of a resistor is to have a high specific resistance vLi, little change over time, and a small temperature coefficient of resistance, and many compositions have been studied up to the present. In the case of the resistor based on tin oxide according to the present invention, the weight ratio of nichrome to chromium is 80S:
It was found that the elongation increased by about 60 times compared to 20%). Therefore, in order to obtain a desired resistance value, the resistor pattern d! has no abnormality in resistance value even after undergoing various etching processes that involve deformation of the substrate! It was possible to obtain a printed circuit board with a resistive layer that could be formed and had excellent flexibility, with no change in resistance observed even under various mounting conditions. In addition, the resistor made of tin oxide as the main component of the present invention has a specific resistance more than 10 times that of nichrome, so it is possible to form a resistor with a wider resistance value tS than nichrome through pattern processing. Also, it has become easier to downsize the resistor.
更に必要性能である経時変化や抵抗温度係数についても
、ニクロムと同等以上の性能を有する事を見出した。又
、最近の電子部品の高密度化に伴ない実装する抵抗体の
数も増加し、このため電極部分との接合に掛かる工数が
コストに大きな影響を与えている。しかし本発明による
抵抗層付プリント回路基板では、抵抗部分と電極部分が
一体化されているため、工程が省け、加工費の大巾な削
減が可能に々る。Furthermore, it was discovered that it has performance equivalent to or better than nichrome in terms of aging and temperature coefficient of resistance, which are required performances. Furthermore, with the recent increase in the density of electronic components, the number of resistors to be mounted has also increased, and therefore the number of man-hours required for bonding to the electrode portions has a significant impact on cost. However, in the printed circuit board with a resistive layer according to the present invention, since the resistor portion and the electrode portion are integrated, the process can be omitted and processing costs can be significantly reduced.
ここで電子材料に広く用いられているハンダによるリー
ド線との接合を酸化スズを主成分とする抵抗層に直接行
表った場合、ハンダ付着後の急激な応力によシ抵抗層に
クラックが生じ、使用しえｋい。If the lead wires are joined directly to a resistive layer mainly composed of tin oxide using solder, which is widely used in electronic materials, cracks will occur in the resistive layer due to the sudden stress after the solder is attached. It is not possible to use it.
これは、ハンダの冷却の際に生じる応力は、ハンダの破
断強度に等しい応力が抵抗層に直接かかり、−境界面付
近でクラックと云う形で応力緩和が計られるからである
。This is because the stress generated when the solder cools is equal to the breaking strength of the solder and is directly applied to the resistance layer, and the stress is relaxed in the form of cracks near the interface.
この点本発明によれば抵抗層上に導電層を形成し、この
導電層にノ・ンダ付をするため抵抗層を保護出来、安定
した７レキシプル抵抗体とをるものである。又、電子部
品として用いるために社各種環境下に於妙る長時間の安
定性が必要となるため導電ペースト、導電ゴムを用いた
電極付けでは、不安定になる。In this regard, according to the present invention, a conductive layer is formed on the resistive layer and solder is applied to the conductive layer, so that the resistive layer can be protected and a stable 7-lexiple resistor can be obtained. Furthermore, in order to use it as an electronic component, it must be stable for a long period of time under various industrial environments, so attaching electrodes using conductive paste or conductive rubber will result in instability.
特に本発明の目的である抵抗体として用いる場合には、
高温多湿の環境下や抵抗温度係数の点から、使用に耐え
ない。Especially when used as a resistor, which is the object of the present invention,
It cannot withstand use in hot and humid environments or due to the temperature coefficient of resistance.
以下に本発明を更に詳しく述べる。The present invention will be described in more detail below.
本発明に於ける基板について杜、充分な可撓性を有すれ
ば特に制約はないが、高温使用目的の際にはハンダ使用
にも耐える耐熱性に優れたポリイミド、ポリエーテルイ
ミド、ポリエーテルサルホン等のフィルムあるいはこれ
らの樹脂を金属箔上に接着した複合基板が最も望ましい
。Regarding the substrate of the present invention, there are no particular restrictions as long as it has sufficient flexibility, but for high-temperature use, polyimide, polyetherimide, and polyethersal, which have excellent heat resistance and can withstand soldering, may be used. The most desirable material is a composite substrate in which a film such as fluorine or a resin of these materials is bonded onto a metal foil.
特に基板として透明なポリエーテルイミド、ポリエーテ
ルサルホンフィルムを用いた場合、面スィッチ等に使用
出来る透明フレキシブル抵抗体となシ多くの応用が期待
出来る。In particular, when a transparent polyetherimide or polyethersulfone film is used as a substrate, many applications can be expected, such as a transparent flexible resistor that can be used for surface switches and the like.
次に抵抗層としては可撓性があり、化学的に安定カ酸化
スズを主成分とするものが良い。ここで酸化スズ以外の
成分表しては目的とする比抵抗によって異々るが、スズ
、アンチモン、カドミニウム、インジウム、アルミニウ
ム、チタン等あるいはこれらの酸化物が好ましい。又、
酸化スズの重量比は９０〜９８チである事が好ましい。Next, the resistance layer is preferably flexible and whose main component is chemically stable tin oxide. Here, the components other than tin oxide vary depending on the desired resistivity, but tin, antimony, cadmium, indium, aluminum, titanium, etc., or oxides thereof are preferable. or,
The weight ratio of tin oxide is preferably 90 to 98 inches.
これは９８チ以上になると絶縁物に近づき、比抵抗が余
シにも増大して一般的な抵抗体としては使用しえなくな
るためである。This is because when it becomes 98 inches or more, it becomes close to an insulator, and its specific resistance increases so much that it cannot be used as a general resistor.
又酸化スズを主成分とする抵抗層の膜厚は所望する抵抗
値や面積の制限により変化するが、比抵抗の°安定する
０、０３μ〜０，２μが望ましい。更に抵抗層上に形成
する導体層は導電性、加工性の上から鋼が望ましい。The thickness of the resistive layer containing tin oxide as a main component varies depending on the desired resistance value and area limitations, but it is preferably 0.03 to 0.2 μ so that the specific resistance is stable. Further, the conductor layer formed on the resistance layer is preferably made of steel in terms of conductivity and workability.
以下実施例により本発明を更に詳細に説明する。The present invention will be explained in more detail with reference to Examples below.
実施例１．２
５０μのポリイミドフィルム上並びに７５μ厚の銅箔上
にポリイミド樹脂をｌθμ被覆した基板の樹脂被膜上に
、抵抗層として主成分として酸化スズを９４ｗｔ％その
他の成分として酸化アンチモンを６ｗｔ％含む化合物を
スパッタ法により０．１μの厚みで形成し、更に導体層
として銅を連続的に５μの厚みにスパッタ法によシ形成
した抵抗層付プリント基板を用いて、回路中１００μ、
長さ８倒の薄膜抵抗体を化学的々エツチング法によシ形
、成した。この薄膜抵抗体の可撓性と、ニクロムに対し
ての比抵抗の高低を第−表に示す。尚第一表中に於ける
可撓性とは、加工時の変形に伴がう異常個所の有無並び
に半径１．５＋＋ｍ＋の曲率面を巻く様に実装した際の
抵抗値変化の有無によって示す。Example 1.2 On the resin coating of a substrate made of polyimide resin coated with lθμ on a 50μ polyimide film and a 75μ thick copper foil, a resistive layer was formed with 94wt% of tin oxide as the main component and 6wt of antimony oxide as other components. % to a thickness of 0.1μ by sputtering, and a conductive layer of copper continuously formed to a thickness of 5μ by sputtering.
A thin film resistor with a length of 8 increments was formed by chemical etching. Table 1 shows the flexibility of this thin film resistor and the specific resistance relative to nichrome. In addition, flexibility in Table 1 is indicated by the presence or absence of abnormal parts due to deformation during processing and the presence or absence of resistance value change when mounted so as to wrap around a curvature surface with a radius of 1.5++m+.
比較例１
５０μのポリイミドフィルムに、抵抗層としてニッケル
、クロムの重量比が８０％、２０％からなる合金をスパ
ッタ法によシ０．１μの厚みで形成し、更に導体層とし
て銅を連続的に５μの厚みにスパッタ法によシ形成した
抵抗層付プリント回路基板を用いて、同様な薄膜抵抗体
を形成したものの結果を第−表に示す。Comparative Example 1 An alloy consisting of nickel and chromium in a weight ratio of 80% and 20% by weight was formed as a resistance layer on a 50μ polyimide film to a thickness of 0.1μ, and copper was further continuously formed as a conductor layer. Table 1 shows the results of forming a similar thin film resistor using a printed circuit board with a resistive layer formed by sputtering to a thickness of 5 μm.
第−表で明らかな様に、本実施例による抵抗層付プリン
ト回路基板を用いて作成した薄膜抵抗体は、ニクロムに
比べ高い比抵抗を有し、かつ非常に優れた可撓性を示す
事がわかる。As is clear from Table 1, the thin film resistor fabricated using the printed circuit board with a resistive layer according to this example has a higher specific resistance than nichrome and exhibits extremely excellent flexibility. I understand.
Claims (3)
分である抵抗層を設け、更にその上に第二層目として導
体層を設けたことを特徴とするフレキシブル抵抗層付プ
リント回路基板。(1) With a flexible resistance layer characterized by providing a resistance layer mainly composed of tin oxide as a first layer on a flexible substrate, and further providing a conductor layer as a second layer on top of the resistance layer. printed circuit board.
である特許請求の範囲第（１）項記載の抵抗層付プリン
ト回路基板。(2) A printed circuit board with a resistive layer according to claim (1), wherein the flexible substrate is a heat-resistant resin film such as polyimide.
からなるものである特許請求の範囲第（１）項記載の抵
抗層付プリント回路基板。(3) A printed circuit board with a resistive layer according to claim (1), wherein the flexible substrate is made of two layers of metal foil coated with heat-resistant resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127627A JPS618341A (en) | 1984-06-22 | 1984-06-22 | Printed circuit substrate with flexible resistance layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127627A JPS618341A (en) | 1984-06-22 | 1984-06-22 | Printed circuit substrate with flexible resistance layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS618341A true JPS618341A (en) | 1986-01-16 |
| JPH047595B2 JPH047595B2 (en) | 1992-02-12 |
Family
ID=14964759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59127627A Granted JPS618341A (en) | 1984-06-22 | 1984-06-22 | Printed circuit substrate with flexible resistance layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS618341A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01232034A (en) * | 1988-03-11 | 1989-09-18 | Kanegafuchi Chem Ind Co Ltd | Flexible composite film |
-
1984
- 1984-06-22 JP JP59127627A patent/JPS618341A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01232034A (en) * | 1988-03-11 | 1989-09-18 | Kanegafuchi Chem Ind Co Ltd | Flexible composite film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH047595B2 (en) | 1992-02-12 |
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