JPS6184047A - Resin sealed module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed module in which a plurality of semiconductor chips are sealed with resin.

[Conventional technology]

Hereinafter, a resin-sealed power thyristor module in which two thyristor chips are sealed with resin will be described as an example.

FIG. 2(G) is a plan view showing a state of a conventional power thyristor module before resin sealing, and FIG. 2(B) is a sectional view taken along line B-IB of FIG.

In the figure, (1) is a heat sink made of a metal plate, (2) is an insulating substrate made of a ceramic plate fixed on a part of the upper surface of the heat sink (1), and (3a) and (3b) are metal plates, respectively. One end side is fixed on the right end side part and the left end side part of the top surface of the insulating substrate (2) with a space between them, and the other end side is fixed on the top surface of the insulating substrate (2). An anode drawer plate (4a) on which an anode plate of a thyristor chip, which will be described later, is brazed onto a portion that is bent into an L shape and is fixed to the upper surface of an insulating substrate (2) so as to extend upward from the right and left edges; and (4b) is a thyristor having a gate electrode formed in the center of one main surface, a cathode formed surrounding the gate electrode in a part other than the gate electrode forming part, and an anode formed in the other main surface. The chips (5a) and (5b) are each made of a molybdenum plate, and the upper surface is brazed to the anode of the thyristor chip (4al (4'b)), and the lower surface is an anode drawer plate (3a).
, (3b) are brazed on the part fixed to the insulating substrate (2), (6a) and (6b) are metal rods, respectively, and are connected to the gate electrodes of the thyristor chips (4a) and (4b). Gate leads with one end brazed; ('7a) and (7b) are each made of a metal plate, and the central part is brazed to the cathode of the thyristor chips (4a) and (4b), with both ends bent upward. The U-shaped cathode plates (8a) and (8b) are metal plates, respectively, and the left end of the cathode plate (7a) and the cathode plate (7b)
(9a) and (9b) are each made of an insulating material and are placed on the left outer part of the insulating substrate (2) on the upper surface of the heat sink (1). The thyristor chips (4a) + (4b) are fixed to each other so as to face each other with an interval in the direction perpendicular to the arrangement direction of the thyristor chips (4a) + (4b), and between the gate and cathode of the thyristor chip (4a) and between the gate and cathode of the thyristor chip (4b). a signal terminal board holding stand that holds a signal terminal board for applying an operating signal between the cathodes;
(loa) and (lla) are each made of a metal plate, with a space between them, and the lower end side is a signal terminal board holder (
The signal terminal board holder (9a) protrudes outward from the side opposite to the signal terminal board holder (9b) of 9a), and the upper end side is the signal terminal board holder (9a).
The signal terminal board holding stand (9a
) and connected to the gate lead (6a) and the cathode signal terminal plate connected to the cathode plate (7a), (1ob) and (llb) are the gate signal terminal plate (10a) and the cathode, respectively. Signal terminal board (11a)
Similarly, the gate signal terminal board held by the signal terminal board holder (9b) and connected to the gate lead (6b) and the cathode signal terminal board connected to the cathode board (7b), (12a) and (xzb) are Each is made of a fully bent thin wire, and one end is soldered to the gate lead (6a) and gate lead (6b), and the other end is a gate signal terminal board (LOA).
The first and second gate wiring f′L are soldered to the lower end of the gate signal terminal plate (lob), (1
3a) and (1-31:l) are the gate wiring (
12a) and (12b), one end is connected to the cathode plate (7).
a) and the left end of the cathode plate (7b), and the other end is soldered to the lower end of the cathode signal terminal plate (11a) and the lower end of the cathode signal terminal plate (111). The first and second cathode wires are soldered, the 0th station is the insulating substrate (2), the necessary parts of the anode drawer plates (3a) and (3b), the thyristor chips (4a) and (4b), and the anode plate (
5a), (5b), gate lead (6a), (6
b), cathode plate (7a).

(7b), Necessary parts of cathode pull-out plates (8a), (8b), Signal terminal board holder (9a), (9b), Necessary parts of gate signal terminal plates (10a), (10b), Cathode signal terminal board (1xa), (111'+), gate wiring (12a), (12b) and cathode wiring (x3a)
), (1zb), and its lower end surface is fixed to the upper surface of the heat sink (1).

This conventional power thyristor module is completed by injecting a sealing resin into the resin container α→ after assembling it in the state shown.

Since the conventional power thyristor module is configured as described above, the thyristor chip (4a) is activated by applying a gate signal between the gate signal terminal plate (LOA) and the cathode signal terminal plate (LLA). However, the thyristor chip (4b) is activated by applying a gate signal between the gate signal terminal board (xob) and the cathode signal terminal board (111).

[Problem that the invention seeks to solve]

In the conventional power thyristor module as mentioned above,
Since the lengths of the gate wiring (12a) and cathode wiring (13a) are long (for example, about 10 cm), these wirings (12a) and (13a) are connected to the thyristor chip (4 cm).
b), the anode φ of the thyristor chip (4b)
Wiring based on the main current flowing between the cathodes (x2a), (x3a
) The thyristor chip (4a) malfunctions due to electromagnetic induction into ). Still wiring (12a) +
In the process after wiring (x2 b ) r (x” a) + (13b), these wirings (1, 2a), (1
2b), (13a), (13b+), these wiring (1za), (12b), (13a), (1
3b) has the problem of poor reliability due to the risk of wire breakage. In addition, a signal terminal board holding stand (9a),
(9b) needs to be positioned and fixed onto the upper surface of the high-mounted substrate (2).

Furthermore, both ends of the gate wiring (12g, ), (12b) are positioned and soldered to the gate leads (6a), (6b) and gate signal terminal boards (10a), (10b), respectively, and the cathode wiring (13a) ), (13b) must be positioned and soldered to the cathode plates (7a), ('7b) and cathode signal terminal plates (lla), (1To), respectively, making assembly work extremely difficult. There was a problem.

The present invention has been made in order to solve these problems, and aims to provide a resin-sealed module that is highly reliable and has extremely good assembly workability. A resin container containing a plurality of semiconductor chips having a V pole and first and second main electrodes has a central portion buried in the container wall, and one end portion placed on and engaged with the control electrode of the semiconductor chip. A control electrode signal is formed such that the other end extends from the container wall into the resin container and extends above the resin container so that soldering can be performed, and an actuation signal is applied to the control electrode of the semiconductor chip. A terminal plate is provided on each of a plurality of semiconductor chips.

[Effect]

In this invention, even if the length of the control electrode signal terminal plate is long, the central part of the control electrode signal terminal plate is embedded in the container wall of the resin container. Since there is no risk that this control electrode signal terminal plate will come close to a semiconductor chip other than the one to which it is connected, the semiconductor chip to which this control electrode signal terminal plate is connected will not connect between the first and second main electrodes of the semiconductor chip other than this semiconductor chip. There is no malfunction due to electromagnetic induction caused by the flowing main current, and there is no risk of damage to the control electrode signal terminal plate and disconnection, resulting in improved reliability compared to the conventional device. Furthermore, since the signal terminal board holder and the wiring made of thin metal wires in the conventional device are no longer required, the assembly workability is much improved compared to the conventional device. A plan view showing the state before resin sealing of one embodiment, and FIG. 1(B) is a sectional view taken along the line IB-IB of FIG. Symbols indicate equivalent parts. (4a) and (41:l) are thyristor chips which are semiconductor chips in this example, (6a) and (6b) are gate leads which are control electrodes in this example, and (20a) and (2ob) are Each thyristor chip (4a
It is embedded in both container walls in the direction perpendicular to the arrangement direction of L (4b), and the right end extends to engage with the gate lead (6a) and gate lead (6b) and can be soldered, and the left end is formed so as to come out from the container wall part on the left outer side of the insulating substrate (2) of the resin container 0 fan into the resin container a → and extend above the resin container 04), and the gate lead (6a) and the gate lead (6b The first and second gate signal terminal plates, (21a) and (zxb), which are the control electrode signal terminal plates in this embodiment, to which the actuation signal to ) is applied, respectively correspond to the gate signal terminal plates (20a), ( Similarly to 20'b), the center portion is buried in the lower part of each of the gate signal terminal plate (20a) and the gate signal terminal plate (20b) in the container wall of the resin container U→ with a space between them. The right end engages with the right end of the cathode plate (7a) and the left end of the cathode plate (7b) and extends to enable soldering, and the left end extends to the container wall of the resin container α→. Gate signal terminal board (20a
) and the gate signal terminal plate (20b), the cathode plate (7) is formed so as to exit into the resin container α4) from the left side thereof and extend above the resin container αd.
a) and a first and second cathode signal terminal plate to which the actuation signal to the cathode plate (7b) is applied.

In the power thyristor module configured as described above, even if the gate signal terminal board (20a) and the cathode signal terminal board (21a) are long, these signal terminal boards (20a), ( Since the central part of the thyristor chip (zla) is buried in the wall of the resin container α4), there is no risk that these signal terminal boards (20a) and (21a) will come close to the thyristor chip (41:l). There is no risk of the thyristor chip (4a) malfunctioning due to electromagnetic induction caused by the main current flowing between the anode and cathode of the chip (4b), and the signal terminal board (20a) + (2xa
).

There is no fear of damage to (zob) and (21b) and disconnection, and reliability is improved compared to the conventional device.

Furthermore, the signal terminal plate holding stand (9a
), (9b/) and wiring (12a) made of thin metal wire
, (12b), (13a), and (13b) are no longer required, so the assembly workability is much improved compared to the conventional device described above.

In this embodiment, the cathode signal terminal plate (21a).

(211)), but these are not necessarily necessary, and these cathode signal terminal plates (21a) and (2xb) may be omitted. In this case, the cathode signal terminal board (21
a), instead of (21b), a cathode drawer plate (8a),
(8'b) may be used.

Further, in this embodiment, a resin-sealed power thyristor module has been described as an example, but the present invention is not limited to this, and can be applied to other devices such as a transistor chip having a control electrode and first and second main electrodes. It can also be applied to resin-sealed modules using semiconductor chips.

〔Effect of the invention〕

As explained above, the present invention has a central portion embedded in the container wall of a resin container that accommodates a plurality of semiconductor chips having a control electrode and first and second main electrodes, and one end portion of which contains semiconductor chips. The other end extends from the container wall into the resin container and extends above the resin container so that it can be engaged with and soldered to the control electrode, and is actuated to the control electrode of the semiconductor chip. Since a control electrode signal terminal plate to which a signal is applied is provided on each of the plurality of semiconductor chips,
Even if the length of the control electrode signal terminal plate is long, the central part of the control electrode signal terminal plate is embedded in the container wall of the resin container, so that the control electrode signal terminal plate can be connected easily. Since there is no risk that the semiconductor chip to which this control electrode signal terminal plate is connected will come close to a semiconductor chip other than the semiconductor chip, the pressure a flowing between the first and second main electrodes of the semiconductor chip other than this semiconductor chip will be reduced. There will be no malfunction due to electromagnetic induction caused by current, and there will be no damage to this control electrode signal terminal board! ! I? There is no risk of wires forming, and the reliability is better than in the case of the conventional device.Furthermore, since the signal terminal holder and wiring made of thin metal wires in the conventional device are no longer required, assembly work is easier than in the conventional device. It gets much better.

[Brief explanation of the drawing]

FIG. 1(4) is a plan view showing the state of one embodiment of the present invention before resin sealing, and FIG. 1(B) is iB- of FIG. 1(A).
2(A) is a cross-sectional view taken along the IB line; FIG.
In the figure, (1) is a heat sink, (2) is an insulating substrate, (4
a) and (4b) are semiconductor chips (thyristor chips), (6a) and (6b) are control electrodes (gate leads), and (20a) and (201)) are control electrode signal terminal boards (gate signal terminal boards). be. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A control electrode and a first
and a second main electrode, a plurality of semiconductor chips having
a resin container surrounding the insulating substrate and the plurality of semiconductor chips and having a lower end surface fixed to the upper surface of the heat sink;
A control electrode is provided corresponding to each of the plurality of semiconductor chips, a central portion thereof is embedded in the container wall of the resin container, and one end portion is engaged with the control electrode of the semiconductor chip so that soldering is possible. A control electrode signal terminal plate for applying an operating signal to the semiconductor chip is formed such that the other end extends from the container wall into the resin container and extends above the resin container. A resin-sealed module with