JPS6184220A - Mold assembly for encapsulating electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a molding die device for sealing an electronic component attached to a lead frame.

[Background Art] Conventionally, when sealing and molding an electronic component, a transfer molding mold is used. In other words, the lead frame with the electronic components attached is placed in the open cavity between the upper and lower molds, the mold is lowered to - and the mold is clamped, and after the mold is clamped, the plunger is driven after confirming that the mold is clamped. The molding material is injected into the cavity using a pot. However, in the conventional method, it is necessary to drive the plunger after confirming that the mold has been clamped after the mold has been clamped, which has the drawback of requiring a lot of effort and time loss. There was a shortcoming in that the plunger was driven without checking that the mold was clamped, resulting in molding errors.

[Object of the Invention] The present invention has been made in view of the points described above, and the object of the present invention is to automatically drive the plunger after mold clamping to pour the molding material from the pot into the cavity. To provide a mold device for sealing and molding electronic components that can be injected, requires no effort in operation, does not cause time loss, and does not cause molding errors.

[Disclosure of the Invention] The electronic component sealing mold device of the present invention has an upper part that is vertically movable.
The die plate 29, the fixed upper second die plate 30, and the vertically movable upper third die plate 31 are arranged in order from the top on one side, and the mold clamping cylinders 32 are attached to the two upper first die plates. At the same time, the piston rod 34 of the mold clamping cylinder 32 is connected to the third die plate 31, and the upper third die plate 31 is connected to the third die plate 31.
An upper die 33 is attached to the lower surface of the die plate 31, a fixed lower die plate 35 is placed below, and a lower die 27 facing the upper die 33 is provided on the lower die plate 35, and the upper die 35 and the lower die A cavity 40 is formed between the lower mold 27 and the lower mold 27, and the pound 2 is connected to the cavity 40.
8, and the molding material 3 in the pot 28 is transferred to the cavity 40.
The plunger 42 for injecting into the first die is inserted into the lower die 27 so as to be movable downwardly, and the plunger 42 is connected to the plunger plate 36 disposed below the lower die plate 35. The plate 29 and the plantar plate 36 are connected by an interlocking rod 47,
'' The drawbacks of the conventional example were solved by configuring it in two series. In other words, when the mold is opened, cavity 4
When the mold clamping cylinder 32 is driven after placing the lead frame 2 in the mold 2 and supplying the molding material 3 to the bot 28, the upper third die plate 31 and the second mold 33 descend and collide with the lower mold 27 to be clamped. After the mold clamping, by further driving the mold clamping cylinder 32, the two first die plates rise together with the mold clamping cylinder, and the interlocking rod 47,
The plunger 42 is raised via the plunger plate 36 and the molding material 3 in the pot 28 is injected into the cavity 40. Since the molding material 3 can be injected, the operation does not require much effort as in the conventional method, there is no time loss in molding, and there are no molding mistakes.

The present invention will be explained in detail below with reference to Examples.

The continuous electronic component encapsulation molding device includes a conveyance device A, a lifting device B, an electronic component encapsulation mold device C of the present invention (hereinafter referred to as mold device C), a material supply device, and a runner cal separation device E. It is made up of.

First, the transport device A will be described. Conveying device A is shown in Fig. 1 and Fig. 2.
As shown in the figure, they are arranged at the front and rear of the apparatus of the present invention (the transport direction of the lead frame 2 is the front and the opposite direction is the rear). The conveyance device A has an upper roller 6 and a lower roller 7, and is configured to convey the long lead frame 2 by sandwiching it between the upper roller 6 and the lower roller 7. A conveyance motor 8 is disposed below either the front or rear conveyance device A, and a chain 9 is suspended between the conveyance motor 8 and the lower roller 7. It is designed to drive. The bending conveyance motor 8 is driven intermittently, and is adapted to convey the lead frame 2 by a certain length (the length to be molded at one time by the molding die device C described later). . In this embodiment, two lead frames 2 are conveyed in parallel.

Further, on the supply side, the lead frame 2 is wound into a hoop shape and then unwound and supplied.

An elevating device B is arranged below the conveying device A.

In this embodiment, this elevating device B mainly consists of an elevating cylinder 10. The lower end of the piston rod 10a of the lifting cylinder 10 is fixed to a base plate 11, and the upper end of the cylinder 10b of the lifting cylinder 10 is provided with a support part 12, and the upper roller 6 and the lower roller 7 are supported on the support part 12. It is. However, when the lifting cylinder 10 is driven, the first
As shown in the figure, the conveying device A rises and the lead frame 2
is raised, or as shown in FIG. 2, the conveying device A is lowered and the lead frame 2 is lowered.

A molding die device C of the present invention is arranged in front of the rear conveyance device A, and a material supply device is arranged on the side of the molding die device C. Next, this material supply device will be described. As shown in FIG. 3, a hopper 13 for storing the molding material 3 is provided at the top, and a shutter 14 for opening and closing the outlet at the bottom of the hopper 13 is provided at the bottom of the hopper 13.

A metering rotor 15 is disposed below the outlet, and the metering rotor 15 is provided with a metering section 16.

A metering adjustment plate 17 is movably installed at the bottom of the four metering parts 16, and an adjustment bolt 18 integrally connected to the metering adjustment plate 17 is screwed into the metering rotor 15 and the other end is extended outward. One lock nut is screwed onto the other end of the adjustment bolt 18. The amount to be measured can be adjusted by loosening the lock nut 19 and rotating the adjustment bolt 18 to adjust the metering adjustment plate 17. When the metering rotor 15 is rotated, a certain amount of the molding material 3 that has entered the metering section 16 is caused to fall downward. The metering rotor 15 is driven by, for example, converting the reciprocating motion of an air cylinder into a rotational motion. A conveying basin 20 is arranged below the weighing rotor 15, and this conveying basin 20 is connected to the first base plate 21.
It is attached to the top.

A shutter 22 that can be opened and closed is disposed at the bottom of the conveyance box 20, and the shutter 22 is opened and closed by a drive cylinder 23. A second base 24 is disposed below the first base 21, and the first base 21 is moved from side to side by a drive cylinder 25 disposed at the second base 24. . A drive cylinder 26 is arranged below the second base 24, and the drive cylinder 26 can drive the second base 24 and the first base 21 downward. When the molding material 3 falls from the metering rotor 15 as shown in FIG. At this time, the shutter 22 is closed.

Then, the drive cylinder 25 is driven, and as shown in FIG. 4 (1), the conveyor box 20 moves together with the first base 21 above the pot 28 of the lower die 27 of the molding die device C, which will be described later.
Next, the drive cylinder 26 is driven, and the transport box 20 is lowered together with the first base 21, as shown in FIG. 4(c), and the transport box 20 is positioned above the pot 28. In this state, the drive cylinder 23 is driven to open the shutter 22 as shown in FIG. 4(d), and the molding material 3 is supplied into the pot 28. The conveying box 20 is driven in the opposite direction to the above, and the weighing rotor 1
5 and perform the same operation as above again.

Next, the molding device C of the present invention will be described.

As shown in FIG. 5, an upper first die plate 29, an upper second die plate 30, and an upper third die plate 31 are arranged above. The upper first die plate 29 is vertically movable, and a mold clamping cylinder 32 is mounted on the upper first die plate 29. The upper second die plate 30 is fixed.

The upper third die plate 31 is vertically movable and has an upper mold 33 on the lower surface.
is attached to the piston rod 34 of the mold clamping cylinder 32. Lower die plate 35, plunger plate 36 and cylinder mounting plate 37
and is arranged. The lower die plate 35 is fixed,
A mounting stand 38 is mounted on the lower die plate 35, and the lower mold 27 is placed on the mounting stand 38''.

A pot 28 is provided in the center of two sides of the lower mold 27,
A plurality of runner grooves 39 are bored on the left and right sides so as to communicate with the pot 28, and an upper mold 33 is formed at the tip of the runner groove 39.
A cavity 40 is formed between the lower die 27 and the lower die 27.

A molding pressure regulating valve 41 is provided at a position corresponding to the pot 28 of the upper mold 33. A plunger 42 is passed through the lower mold 27 in the vertical direction at a position corresponding to the pot 28, and the lower end of the plunger 42 is connected to a plunger drive plate 43 which is vertically movable. A knockout bin 44 is vertically passed through the lower die 27 at a position corresponding to the cavity 40, and the lower end of the knockout bin 44 is connected to a knockout plate 45. Knockout plate 45 is located above plunger drive plate 43. ”1 The upper second die plate 30 and the lower die plate 35 are connected by a connecting iron 46,
The upper first die plate 29 and the plunger plate 36 are connected by an interlocking rod 47. Regarding the cylinder installation, a resistance/bundling cylinder 48 is attached to the plate 37, and a piston rod 49 of the resistance/bundling cylinder 48 is connected to the plunger plate 36. and the plunger drive plate 43 are connected by a connecting rod 50. The resistance/bundling cylinder 48 serves as a resistance for mold clamping and also performs a knockout function, and has a resistance valve 51 in a hydraulic piping 52 as shown in FIG. As shown in FIG. 5(a), the lead frame 2, which has not been sealed and molded in an open state in which the upper mold 33 is separated from the lower mold 27, is supplied to the cavity 40 and transported by the material supply device. The weighed molding material 3 is supplied from the basin 20 to the pot 28. From this state, as shown by the arrow in FIG. 6, hydraulic pressure is supplied to the upper chamber 53 of the mold clamping cylinder 32 and hydraulic pressure is discharged from the lower chamber 54, and the piston rod 34 descends together with the upper third die plate 31. The upper mold 33 is lowered and clamped as shown in FIG. 5(b). After the mold clamping is completed, the mold clamping cylinder 32 is further driven.

Then, since the lower die plate 35 is fixed, the upper first die plate 29 rises, the plunger plate 36 rises via the interlocking rod 47, the plunger 42 rises via the connecting rod 501 and the plunger drive plate 43, The molding material 3 in the pot 28 is injected into the cavity 40. At this time, the resistance/bundling cylinder 48 is not driven, but since the resistance valve 51 is in communication with the upper chamber 55, it becomes a resistance when the plunger plate 36 rises, and the output of the mold clamping cylinder 32 and the resistance/bundling cylinder 48 are not driven. Bundling cylinder 4
The difference in the resistance forces of 8 becomes a force that raises the plunger/I2, and this force injects the molding material 3 into the cavity 40. In other words, good molding is achieved by gradually injecting the material with a relatively weak force. In addition, fine adjustment of the injection pressure is possible using the molding pressure adjustment valve 4.
This will be done in 1.

When the molding material 3 is filled into the cavity 40 and molding is completed, the mold clamping cylinder 32 is driven in the opposite direction, and the upper mold 33 is raised together with the upper third die plate 31 to open the mold. At this time, a sixth
Hydraulic pressure is supplied as shown by the arrow in the figure, and the plunger plate 36 is driven upward as shown in FIG. 42 and the knockout bin 44 are driven upward, and the molded product 57 is ejected together with the runner 4 and cull 5. Next, the knockout bottle 44 and plunger 42 return to the lead frame 2.
The portion that has not been sealed is sent between the upper mold 33 and the lower mold 27, and is sealed in the same manner as described above. A runner cal separation device E is arranged in front of the molding die device C, and the runner cal separation device E will be described next.

A pair of gouers 58 that are long in the conveying direction of the lead frame 2 are arranged at intervals on the left and right, and a separation plate 59 is arranged above between the pair of gouers 58.
9 is connected to the drive cylinder 60. When the molded product 57 having the runner 4 and the cull 5 is sent onto the gouer 58, the drive cylinder 60 is driven and the five separation plates are lowered to separate the separation plate 59 and the gouer 58, as shown in FIG. The runner 4 and cull 5 are separated from the molded product 57 by cutting between them.

Next, the overall operation of the continuous electronic component sealing molding apparatus configured as described above will be explained. The lead frame 2 is unwound from the hoop-shaped state, and is conveyed while being sandwiched between an upper roller 6 and a lower roller 7 of the conveying device A. First tJ
As shown in Figure tJ1, the molding die apparatus C is opened and removed, and the upper die 33 is separated upward, and the separation plate 59 of the runner cal separation device ftfE is separated upward. In this state, the conveying device A is raised by the lifting cylinder 10 of the lifting device B, and the lead frame 2 is lifted upward, and the lead frame 2 is separated from the lower die 27 and the gougs 58. In this state, the drive motor 8 of the conveyance device A is driven, and the lead frame 2 is conveyed forward by the length of the molding die device C. Then, the lead frame 2 which is not sealed and molded is located above the lower die 27 of the molding mold device C, and the molded product 57, runner 4, and cull 5 that were sealed earlier are located above the gou 58 of the runner cal separation device E. Lead frame 2 with
It's coming. At this time, the conveying box 20 of the material supply device disposed on the side of the molding die device C
The molding material 3 is received from the conveying basin 20, and the conveying basin 20 moves above the pot 28 of the lower mold 27, and outside, the pot 2 is transferred from the conveying basin 20 to the pot 28.
The molding material 3 is supplied to 8. Then, the lifting cylinder 10 of the lifting device B is driven in the opposite direction, and the conveying device A is lowered, and the lead frame 2 is placed on the lower die 27 and the lead frame 2 is placed on the gouer 58. Then, in the molding die device C, the mold clamping cylinder 32 is driven, and the upper mold 33 is lowered to move the second mold.
As shown in the figure, the mold is clamped, and after the mold is clamped, the mold clamping cylinder 32 passes the upper first die plate 29, the interlocking rod 47, the plunger plate 36, the connecting rod 50, and the plunger drive plate 43 to the plunger. 42 is raised and the molding material 3 flows from the pot 28 into the runner groove 3.
9 and is injected into the cavity 40 and sealed.

On the other hand, at this time, in the runner cull separation device E, the separation plate 59 is lowered by the drive cylinder 60, and the molded product 57 is separated from the runner 4 and the cull 5 by cutting between the separation plate 59 and the gouer 58.

After sealing molding is performed in the molding die device C, the mold clamping cylinder 32 is driven in the opposite direction, and the upper mold 33 is raised to open the mold. Then, the resistance/ejection cylinder 48 is driven, and the plunger 42 and/or Tsukuau F-bin 44 are raised via the plunger plate 36, connecting rod 50, plunger drive plate 43, and aquaaud plate 45, thereby forming the mold. The product 57, runner 4, and cal 5 are pushed out in one direction.

At this time, the lead frames 2 are moved up and down by the lifting cylinder 10 of the lifting device B, and the molded product 57 is placed on one side of the lower die 27.
A lead frame 2 having a runner 4 and a cull 5 is located therein, and a lead frame 2 having only a molded product 57 is located above the gouer 58. Then, the drive motor 8 of the conveyance device A is driven to advance the lead frame 2 by the length of the molding die device C, and the lead frame 2 containing only the molded product 57 is taken out as a product in front of the runner cal separation device E. By repeating the above operations, a continuously sealed product is manufactured.

[Effects of the Invention] Since the present invention is configured as described above, a lead frame with an electronic component attached thereto is placed in the cavity with the upper mold positioned upward and the mold is opened, and a molding material is supplied to the pot. Then, when the mold clamping cylinder is driven, the upper mold descends together with the upper third die plate, hits the lower mold, and is clamped.After the mold is clamped, by driving the mold clamping cylinder further, the upper first die plate rises together with the mold clamping cylinder. death,
The plunger is raised via an interlocking rod and a plunger plate, and the molding material in the pot is injected into the cavity.The molding material is injected by the plunger after the mold is clamped by the drive of the mold clamping cylinder. This eliminates the hassle of operation and time loss in molding unlike conventional molds, and also eliminates molding errors such as injecting molding material with a plunger before clamping the mold.

[Brief explanation of the drawing]

FIG. 1 is an overall front view of an embodiment of the present invention, FIG. 2 is a front view in a different state from FIG. a) (b) (c) (d)
5(a), 5(b) and 5(c) are sectional views of the same forming die apparatus, and FIG. 6 is a schematic sectional view explaining the operation of the above forming die apparatus. FIG. 7 is a cross-sectional view of the same runner cal separation device, in which 3 is the molding material, 27 is the lower mold, 28 is the pot, and 2 are the 1st and 1st parts.
30 is an upper second die plate, 31 is an upper third die plate, 32 is a mold clamping cylinder, 33 is an upper mold, 34 is a piston rod, 35 is a lower die plate, 3
6 is a plunger plate, 40 is a cavity, 42 is a plunger, and 47 is an interlocking rod.

Claims (1)

[Claims] [1] Upper first die plate that is vertically movable and fixed upper second die plate.
A die plate and a third upper die plate which is movable up and down are arranged upward in order from the top, a mold clamping cylinder is attached to the upper first die plate, and a piston rod of the mold clamping cylinder is connected to the upper third die plate. , an upper mold is attached to the lower surface of the upper third die plate, a fixed lower die plate is placed below, and a lower mold is provided on the lower die plate to face the upper mold, and there is a space between the upper mold and the lower mold. A cavity is formed in the mold, and a pot communicating with the cavity is provided in the lower mold.
A plunger for injecting the molding material in the pot into the cavity is inserted into the lower mold so as to be able to move up and down, and the plunger plate placed below the lower die plate is connected to the plunger, and the plunger is connected to the upper first die plate. An electronic component sealing mold device characterized by connecting a plunger plate with an interlocking rod.