JPS6185007U - - Google Patents

Info

Publication number
JPS6185007U
JPS6185007U JP1984170363U JP17036384U JPS6185007U JP S6185007 U JPS6185007 U JP S6185007U JP 1984170363 U JP1984170363 U JP 1984170363U JP 17036384 U JP17036384 U JP 17036384U JP S6185007 U JPS6185007 U JP S6185007U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
light emitting
large number
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984170363U
Other languages
English (en)
Other versions
JPS6346972Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984170363U priority Critical patent/JPS6346972Y2/ja
Publication of JPS6185007U publication Critical patent/JPS6185007U/ja
Application granted granted Critical
Publication of JPS6346972Y2 publication Critical patent/JPS6346972Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案を自動車の尾灯に適用した場合
の一実施例を示す一部破断斜視図、第２図は要部
拡大断面図、第３図は回路図、第４図は本考案の
他の実施例を示す要部拡大断面図である。 １…尾灯、２…バツクカバー、３…前面レンズ
、４…灯体、５…プリント基板、６…発光ダイオ
ード、１４…放熱体、１７…抵抗体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 灯体内に配設したプリント基板に多数の発光ダ
    イオードを配設してなる車輛用灯具において、前
    記プリント基板に多数の放熱体を配設してその両
    端部を該基板の表裏面側にそれぞれ突出させ、前
    記プリント基板の表面側に突出する前記各放熱体
    の表面に前記発光ダイオードをダイオード点灯用
    の抵抗体を介して配設したことを特徴とする車輛
    用灯具。
JP1984170363U 1984-11-12 1984-11-12 Expired JPS6346972Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984170363U JPS6346972Y2 (ja) 1984-11-12 1984-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984170363U JPS6346972Y2 (ja) 1984-11-12 1984-11-12

Publications (2)

Publication Number Publication Date
JPS6185007U true JPS6185007U (ja) 1986-06-04
JPS6346972Y2 JPS6346972Y2 (ja) 1988-12-05

Family

ID=30728070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984170363U Expired JPS6346972Y2 (ja) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPS6346972Y2 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116510U (ja) * 1990-03-08 1991-12-03
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2006128265A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 発光素子用配線基板ならびに発光装置
JP2006332234A (ja) * 2005-05-25 2006-12-07 Hitachi Aic Inc 反射機能を有するｌｅｄ装置
JP2006344771A (ja) * 2005-06-09 2006-12-21 Hitachi Aic Inc Ｌｅｄ装置用反射体およびその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116510U (ja) * 1990-03-08 1991-12-03
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2006128265A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 発光素子用配線基板ならびに発光装置
JP2006332234A (ja) * 2005-05-25 2006-12-07 Hitachi Aic Inc 反射機能を有するｌｅｄ装置
JP2006344771A (ja) * 2005-06-09 2006-12-21 Hitachi Aic Inc Ｌｅｄ装置用反射体およびその製造方法

Also Published As

Publication number Publication date
JPS6346972Y2 (ja) 1988-12-05

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