JPS6185151U - - Google Patents
Info
- Publication number
- JPS6185151U JPS6185151U JP16869484U JP16869484U JPS6185151U JP S6185151 U JPS6185151 U JP S6185151U JP 16869484 U JP16869484 U JP 16869484U JP 16869484 U JP16869484 U JP 16869484U JP S6185151 U JPS6185151 U JP S6185151U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- flexible sheet
- separation device
- sliding
- elevating stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図および第３図は従来の半導体ウエーハの分離
装置を示すもので、第２図は平面図、第３図は正
面図である。
図において、１は可撓性シート、２は半導体ウ
エーハ、２ａはペレツト、３は粘着膜、４ａ，４
ｂはクランパ、５は昇降ステージ、７は滑り面で
ある。なお、図中同一符号は同一または相当部分
を示す。
Figure 1 is a front view showing an embodiment of this invention, Figures 2 and 3 are conventional semiconductor wafer separation devices, Figure 2 is a plan view, and Figure 3 is a front view. . In the figure, 1 is a flexible sheet, 2 is a semiconductor wafer, 2a is a pellet, 3 is an adhesive film, 4a, 4
b is a clamper, 5 is a lifting stage, and 7 is a sliding surface. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
シング加工によつてペレツト状に分割している半
導体ウエーハを載置した可撓性シートと、この可
撓性シートを底面から押しあげてこれを面方向に
引き延ばす昇降ステージとを有するものにおいて
、上記可撓性シートの底面と接触する昇降ステー
ジの上面に摩擦係数の小さい滑り面を形成したこ
とを特徴とする半導体ウエーハの分離装置。 (2) 可撓性シートの上面に粘着膜を介して半導
体ウエーハを剥離自在に載置したことを特徴とす
る実用新案登録請求の範囲第１項記載の半導体ウ
エーハの分離装置。 (3) 滑り面を滑り摩擦係数の小さいフツ素樹脂
膜によつて形成したことを特徴とする実用新案登
録請求の範囲第１項記載の半導体のウエーハの分
離装置。 (4) 可撓性シートは、軟質合成樹脂板、または
軟質ゴム板を用いたことを特徴とする実用新案登
録請求の範囲第１項記載の半導体ウエーハの分離
装置。[Scope of Claim for Utility Model Registration] (1) A flexible sheet on which a semiconductor wafer is placed, the peripheral edge of which is fixed by a clamper and the upper surface of which is divided into pellets by dicing, and this flexible sheet. A semiconductor wafer having an elevating stage that pushes up from the bottom surface and stretches it in the surface direction, characterized in that a sliding surface with a small friction coefficient is formed on the upper surface of the elevating stage that comes into contact with the bottom surface of the flexible sheet. separation device. (2) The semiconductor wafer separation device according to claim 1, wherein the semiconductor wafer is releasably placed on the upper surface of a flexible sheet via an adhesive film. (3) The semiconductor wafer separation device according to claim 1, wherein the sliding surface is formed of a fluororesin film having a small coefficient of sliding friction. (4) The semiconductor wafer separation apparatus according to claim 1, wherein the flexible sheet is a soft synthetic resin plate or a soft rubber plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16869484U JPS6185151U (en) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16869484U JPS6185151U (en) | 1984-11-08 | 1984-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185151U true JPS6185151U (en) | 1986-06-04 |
Family
ID=30726455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16869484U Pending JPS6185151U (en) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185151U (en) |
-
1984
- 1984-11-08 JP JP16869484U patent/JPS6185151U/ja active Pending
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