JPS6185444A - Production of flame-retardant phenolic resin laminate - Google Patents
Production of flame-retardant phenolic resin laminateInfo
- Publication number
- JPS6185444A JPS6185444A JP20653984A JP20653984A JPS6185444A JP S6185444 A JPS6185444 A JP S6185444A JP 20653984 A JP20653984 A JP 20653984A JP 20653984 A JP20653984 A JP 20653984A JP S6185444 A JPS6185444 A JP S6185444A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- flame
- reaction
- halogen
- alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003063 flame retardant Substances 0.000 title claims abstract description 31
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 28
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 20
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 20
- 150000002367 halogens Chemical class 0.000 claims abstract description 20
- 239000002966 varnish Substances 0.000 claims abstract description 10
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000003118 aryl group Chemical group 0.000 claims abstract description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 3
- 125000002270 phosphoric acid ester group Chemical group 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 20
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 15
- -1 tricresyl phosphate Chemical class 0.000 abstract description 14
- 150000002148 esters Chemical class 0.000 abstract description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003054 catalyst Substances 0.000 abstract description 4
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 3
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 abstract 2
- USVZNQFSITUTTE-UHFFFAOYSA-N (2,4,6-tribromophenyl)methanol Chemical compound OCC1=C(Br)C=C(Br)C=C1Br USVZNQFSITUTTE-UHFFFAOYSA-N 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229910000027 potassium carbonate Inorganic materials 0.000 abstract 1
- 235000015320 potassium carbonate Nutrition 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 229910019142 PO4 Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000010452 phosphate Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 6
- 238000001879 gelation Methods 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- DBHODFSFBXJZNY-UHFFFAOYSA-N 2,4-dichlorobenzyl alcohol Chemical compound OCC1=CC=C(Cl)C=C1Cl DBHODFSFBXJZNY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 2
- 229960004698 dichlorobenzyl alcohol Drugs 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- MUMDGZCWRBIKDZ-UHFFFAOYSA-N (2,6-dibromophenyl)methanol Chemical compound OCC1=C(Br)C=CC=C1Br MUMDGZCWRBIKDZ-UHFFFAOYSA-N 0.000 description 1
- WKKHCCZLKYKUDN-UHFFFAOYSA-N (2,6-dichlorophenyl)methanol Chemical compound OCC1=C(Cl)C=CC=C1Cl WKKHCCZLKYKUDN-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- DGSQMAWMWINPRH-UHFFFAOYSA-N 1-bromo-1-phenylethanol Chemical compound CC(O)(Br)C1=CC=CC=C1 DGSQMAWMWINPRH-UHFFFAOYSA-N 0.000 description 1
- VGGVQMAYBVNPST-UHFFFAOYSA-N 1-chloro-2-(2-chloro-2-hydroxy-2-phenylethoxy)-1-phenylethanol Chemical compound ClC(COCC(Cl)(C1=CC=CC=C1)O)(O)C1=CC=CC=C1 VGGVQMAYBVNPST-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 206010034962 Photopsia Diseases 0.000 description 1
- DYAHQFWOVKZOOW-UHFFFAOYSA-N Sarin Chemical compound CC(C)OP(C)(F)=O DYAHQFWOVKZOOW-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229910000065 phosphene Inorganic materials 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- OHRVKCZTBPSUIK-UHFFFAOYSA-N tridodecyl phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OCCCCCCCCCCCC OHRVKCZTBPSUIK-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- FDGZUBKNYGBWHI-UHFFFAOYSA-N trioctadecyl phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC FDGZUBKNYGBWHI-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- LKOCAGKMEUHYBV-UHFFFAOYSA-N tris(3-bromo-3-chloropropyl) phosphate Chemical compound ClC(Br)CCOP(=O)(OCCC(Cl)Br)OCCC(Cl)Br LKOCAGKMEUHYBV-UHFFFAOYSA-N 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は難燃性紙−フェノール樹脂積層板(銅張り積層
板を含む)の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for producing flame-retardant paper-phenolic resin laminates (including copper-clad laminates).
最近絶縁材料特に通信機および電子機器に使用される積
層板は加工設備の自動化、省エネルギーの観点から常温
または若干それより高い温度で打抜可能であることが要
求されて(・る。従りて通常低温打抜可能積層板用樹脂
には各棟のアルキルフェノールをフェノールと併用し、
乾性油等で可塑化したフェノール4tJ脂が使われてい
る。Recently, insulating materials, especially laminates used for communication equipment and electronic equipment, are required to be punchable at room temperature or slightly higher temperature from the viewpoint of automation of processing equipment and energy saving. Normally, the resin for low-temperature punchable laminates uses alkylphenols of each type in combination with phenol.
Phenol 4tJ fat plasticized with drying oil is used.
しかしながら、絶縁材料に使用される積層機に対して安
全性重視の観点から難燃化の要求が強くなっており、難
燃化という観点からみれば打抜加工性の改良のため使用
する乾性油等の可塑剤は難燃化をいっそう困難かつ複雑
化している。However, there is a growing demand for flame retardancy for laminating machines used for insulating materials from the perspective of safety, and from the perspective of flame retardancy, drying oil used to improve punching processability is becoming more and more important. These plasticizers make flame retardation even more difficult and complicated.
積層板の難燃化にはフェノール樹脂に勲燃剤を添加する
方法がとられている。難燃剤には難燃元素としてSb、
As、 B、 N、ハロゲン、Pなどを含有する化合
物が多く用いられている。時に重要な元素には酸素の遮
断、有機物の炭化、炭化被膜の形成に効果を示すリンと
反応性の高いラジカルをトラップするのに効果があるハ
ロゲンがある。しかもこれらは互いに相乗効果を示すこ
とから、分子内にリン、ハロゲンを含有する化合物が望
まれている。A method of making laminates flame retardant is to add a flame retardant to phenolic resin. The flame retardant contains Sb as a flame retardant element,
Compounds containing As, B, N, halogen, P, etc. are often used. Sometimes important elements include phosphorus, which is effective in blocking oxygen, carbonizing organic matter, and forming a carbonized film, and halogen, which is effective in trapping highly reactive radicals. Furthermore, since these compounds exhibit a synergistic effect with each other, compounds containing phosphorus and halogen in the molecule are desired.
含ハロゲン−リン系難燃剤にはトリス−(β−クロロエ
チル)ホスフェ−)、トIJス(−ジブロモプロピル)
ホスフェート、トリス−(ジクロロプロピル)ホスフェ
ート、トリス−(2゜3−ジブロモプロピル)ホスフェ
ート、トリス−(ブロモクロロプロピル)ホスフェート
などの含ハロゲンリン酸エステル類がある。しかし。Halogen-containing phosphorus flame retardants include tris(β-chloroethyl)phosphate) and tris(-dibromopropyl).
There are halogen-containing phosphate esters such as phosphate, tris-(dichloropropyl) phosphate, tris-(2°3-dibromopropyl) phosphate, and tris-(bromochloropropyl) phosphate. but.
これらの含ハロゲンリン酸エステル類はハロゲンが脂肪
族炭化水素に結合しているなめに、積層板あるいは銅張
り積層板に通用した場合、ハンダ耐熱性、気中耐熱性な
どの耐熱性の低下の原因となる。These halogen-containing phosphate esters have halogens bonded to aliphatic hydrocarbons, so when used in laminates or copper-clad laminates, they may cause a decrease in heat resistance such as solder heat resistance and air heat resistance. Cause.
本発明は耐熱性に優れた難燃性紙−フェノール樹脂積層
板を提供しようとするもので8る。The present invention aims to provide a flame-retardant paper-phenolic resin laminate with excellent heat resistance.
本発明はリン酸エステル類とハロゲン含有芳香族アルコ
ール類を反応させて得られる反応生成物を難燃剤として
配合したフェノール樹脂ワニスを所定量含浸付着させた
紙基材を加熱成形することを特徴とするものである。The present invention is characterized in that a paper base material impregnated with a predetermined amount of phenolic resin varnish containing a reaction product obtained by reacting phosphoric acid esters and halogen-containing aromatic alcohols as a flame retardant is heat-formed. It is something to do.
リン酸エステル類とハロゲン含有芳香族アルコール類と
のエステル交換反応を考えると、前者ri3個の反応点
をもち、後者は1個の反応点しかないため、最高3モル
までエステル交換反応が可能であり、ハロゲン含有量を
種々変化させることができる。ハロゲンが芳香族環に結
合したアルコールを用いることによって前述の含ハロゲ
ン−リン酸エステルの欠点である耐熱性の低下を防止す
ることができる。しかも、リン原子とハロゲン原子が一
定の割合で、均一にフェノール樹脂に分布させることが
可能になり難燃性を効果的に向上させるのに効果がある
。Considering the transesterification reaction between phosphoric acid esters and halogen-containing aromatic alcohols, the former has 3 reaction points, and the latter has only 1 reaction point, so transesterification is possible up to 3 moles. Yes, and the halogen content can be varied. By using an alcohol in which a halogen is bonded to an aromatic ring, it is possible to prevent a decrease in heat resistance, which is a drawback of the above-mentioned halogen-containing phosphate ester. Furthermore, it is possible to uniformly distribute phosphorus atoms and halogen atoms in a constant ratio in the phenol resin, which is effective in effectively improving flame retardancy.
本発明をさらに詳しく説明すると、リン酸エステル類と
ハロゲン含有蓋′4i族アルコール類な塩基性触媒の存
在下、無浴媒もしくは浴媒中で加熱してエステル交換反
応を起こさせ難燃剤反応生成物を得る。リン酸エステル
類としては一般式(1)で示されるような化合物が用い
られる。To explain the present invention in more detail, in the presence of a basic catalyst such as a phosphoric acid ester and a halogen-containing lid group 4i alcohol, transesterification is caused by heating in a bath medium or without a bath medium to generate a flame retardant reaction. get something As the phosphoric acid ester, a compound represented by the general formula (1) is used.
本発明に使用できるリン酸エステル(1,1にはトリク
レジルホスフェート(TCP)、クレジルジフェニルホ
ス7エー)(CDP)、トIJフェニルホスフェート(
TPP )、ジンエニルオクチルホスフエート、トリブ
チルホスフェート。Phosphate esters that can be used in the present invention (1,1 include tricresyl phosphate (TCP), cresyl diphenyl phosphatide) (CDP), toIJ phenyl phosphate (
TPP), enyl octyl phosphate, tributyl phosphate.
キシレルジフェニルホスンエー)(XDP)。xyleldiphenylphosn-A) (XDP).
トリス(−β−クロロエチル)ホス2エート、トリス−
(ジブロモプロピル)ホスアエーh、)リス(−ブロモ
クロロプロピル)ホスフェート。Tris(-β-chloroethyl)phos 2ate, tris-
(dibromopropyl)phosa h,) lis(-bromochloropropyl)phosphate.
トリエチルホスフェート、トリメチルホス2エート、ト
リエチルホスフェート、トリオクチルホスフェート、ト
リプトキシエチルホスフェート、トリラウリルホスフェ
ート、トリセシルホスフエード、トリステアリルホスフ
ェート、トリキシレニルホスフェートなどかめる。Triethyl phosphate, trimethyl phosphate, triethyl phosphate, trioctyl phosphate, triptoxyethyl phosphate, trilauryl phosphate, triceyl phosphate, tristearyl phosphate, trixylenyl phosphate, etc.
ハロゲン含有芳香族アルコール類としては一般式(II
)および(III)に示されるような化合物が単独又は
併用して用いられる。As the halogen-containing aromatic alcohol, general formula (II
) and (III) are used alone or in combination.
ハロゲン含有芳香族アルコールm 11.11)には。For halogen-containing aromatic alcohol m11.11).
2.4.6−トリブロモフェニル−β−ヒドロキシエチ
ルエーテル、2,4.6〜トリフロモフェニルーβ−ヒ
ドロキシプロピルエーテル、2゜4−ジブロモフェニル
−β−ヒドロキシエチチルエーテル、2.4−ジブロモ
フェニル−β−ヒドロキシグロビルエーテル、2.6−
ジブクモフェニル−β−ヒドロキシエチルエーテル。2.4.6-tribromophenyl-β-hydroxyethyl ether, 2,4.6-tribromophenyl-β-hydroxypropyl ether, 2゜4-dibromophenyl-β-hydroxyethyl ether, 2.4- Dibromophenyl-β-hydroxyglobyl ether, 2.6-
Dibucumophenyl-β-hydroxyethyl ether.
2.6− ジブロモフェニル−β−ヒドロキシプロピル
エーテル、モノブロモフェニル−β−ヒドロキシエチル
エーテル、モノブロモフェニル−β−ヒドロキシプロピ
ルエーテル、ジエチレングリコール−モノ−2,4−6
−ドリプロモフエニルエーテル、シフロピレンクリコー
ルーモノ−2,4,6−ドリブロモフエニルエーテル、
2,4゜6−トリクロロフェニル−β−ヒドロキシエチ
ルエーテル、λ4,6−)ジクロロフェニル−β−ヒド
ロキシエチルエーテル、ジクロロフェニル−β−ヒドロ
キシエチルエーテル、モノクロロフェニル−β−ヒドロ
キシエチルエーテルなどがあり、(1)には2.4.6
−ドリプロモベンジルアルコール、2.4−シフ’ロモ
ペンジルアルコール、2.6−ジブロモベンジルアルコ
ール、モノブロモベンジルアルコール、2,4.6−)
ジクロロベンジルアルコール、2.4−ジクロロベンジ
ルアルコール、2.6−ジクc2czベンジルアルコー
ル、モノクロロベンジルアルコール、β−2、4,6−
トIJ ブロモフェニルーエタノール、β−ジブロモフ
ェニルエタノール、β−モノブロモフェニルエタノール
ナトカアル。2.6-Dibromophenyl-β-hydroxypropyl ether, monobromophenyl-β-hydroxyethyl ether, monobromophenyl-β-hydroxypropyl ether, diethylene glycol-mono-2,4-6
- dolibromophenyl ether, cyfropylene glycol-mono-2,4,6-dolibromophenyl ether,
2,4゜6-trichlorophenyl-β-hydroxyethyl ether, λ4,6-)dichlorophenyl-β-hydroxyethyl ether, dichlorophenyl-β-hydroxyethyl ether, monochlorophenyl-β-hydroxyethyl ether, etc. ) for 2.4.6
-Dolipromobenzyl alcohol, 2,4-Schif'romopenzyl alcohol, 2,6-dibromobenzyl alcohol, monobromobenzyl alcohol, 2,4.6-)
Dichlorobenzyl alcohol, 2,4-dichlorobenzyl alcohol, 2,6-dichlorobenzyl alcohol, monochlorobenzyl alcohol, β-2,4,6-
ToIJ Bromophenyl-ethanol, β-dibromophenylethanol, β-monobromophenylethanolnatocal.
反応温度は化合物(1)、〔…〕、(1113が均一に
溶解する温度以上であればよく約80〜250℃で特に
130〜170℃が好ましい。80℃未満で鉱反応が遅
いため、反応時間が長くなる。The reaction temperature may be at least the temperature at which compounds (1), [...], (1113) are uniformly dissolved, and is approximately 80 to 250°C, preferably 130 to 170°C. Below 80°C, the mineral reaction is slow, so the reaction It takes longer.
一方250℃を越えると(1)あるいは〔■〕〔副の分
解反応も同時に進行してしまうためでろる。On the other hand, if the temperature exceeds 250°C, this is likely due to (1) or [■] because the secondary decomposition reaction also proceeds at the same time.
上記(1)と(If) (fit)のエステル又洟反応
に使用される触媒にはKxCOs、 NazCOs、
CaCO5,MgQ)sなどの炭酸塩、トリエチルアミ
ン、ジエチルアミン、ベンジルジメチルアミンなどの有
機塩基性化合物、 KF、 NaF、 CsF など
の弗化物などが用いられる。Catalysts used in the ester matasho reaction of (1) and (If) (fit) above include KxCOs, NazCOs,
Carbonates such as CaCO5, MgQ)s, organic basic compounds such as triethylamine, diethylamine, and benzyldimethylamine, and fluorides such as KF, NaF, and CsF are used.
触媒量は反応化合物CI)、 (n)または(IID
の総重量に対して(101〜2%が好ましく、0.01
%未満では反応が遅く、2%を越えると触媒による母材
樹脂の特性低下をひき起す。The catalytic amount is the reaction compound CI), (n) or (IID
(preferably 101 to 2%, 0.01% to the total weight of
If it is less than 2%, the reaction will be slow, and if it exceeds 2%, the properties of the base resin will deteriorate due to the catalyst.
溶剤は化合物(1)、 (It)または(III)を
溶解するものなら何でもよいが、出来るだけ無溶剤で反
応を進めた方がよい。というのは反応中もしくは反応終
了後、リン酸エステル類から副生底したアルコール類、
フェノール類を減圧下で留去し易くするためである。Any solvent may be used as long as it dissolves compound (1), (It) or (III), but it is better to proceed with the reaction as solvent-free as possible. This is because alcohols, which are by-produced from phosphoric esters during or after the reaction, are
This is to make it easier to distill off phenols under reduced pressure.
反応貴に関してはCI) / (It)または〔■〕=
1/Q、3〜115(モル比)が好ましく紙−フェノー
ル積層板の難燃法および、積層板の特性を考慮して、適
宜変化させて使用することができる。CI) / (It) or [■] =
1/Q, 3 to 115 (mole ratio) is preferred, and can be changed as appropriate in consideration of the flame retardant method of the paper-phenol laminate and the properties of the laminate.
以上述べた方法で合成したハロゲン、リン含有難燃剤を
添加する紙−フェノール積層板用フェノール樹脂は通常
紙−フェノール積層板に用いられてし・るものなら伺で
も使用できる。例えば低温打抜性を改良するための乾性
油変性フェノール樹脂、乾性油ならびに芳香族炭化水素
。The phenolic resin for paper-phenol laminates to which a halogen- and phosphorus-containing flame retardant synthesized by the method described above is added can be used as long as it is normally used for paper-phenol laminates. For example, drying oil-modified phenolic resins, drying oils and aromatic hydrocarbons to improve cold punchability.
ホルムアルデヒド樹脂変性フェノール樹脂、ポリブlジ
エン変性フェノールm脂、アルキルフェノール変性フェ
ノ〜ル樹脂、エポキシ化植物油変性フェノール樹脂など
が挙げられる。Examples include formaldehyde resin-modified phenol resin, polybutiene-modified phenol resin, alkylphenol-modified phenol resin, and epoxidized vegetable oil-modified phenol resin.
また、不発明で用(・るハロゲン・リン含有作燃剤は、
ハロゲン系難燃剤、リン系維燃剤あるいは窒素系難燃剤
、三酸化アンチモン哨化ホウ素などの無機系難燃剤と併
用することもできる。In addition, flaming agents containing halogens and phosphorus are
It can also be used in combination with inorganic flame retardants such as halogen flame retardants, phosphorus fiber flame retardants, nitrogen flame retardants, and antimony trioxide and boron trioxide.
難燃剤の添加量は積層金層フェノール類脂の原料フェノ
ール類100重量部に対して好ましくは30〜200重
量部用いられる。難燃剤を添加する時期は特に規定する
ものではないが。The flame retardant is preferably added in an amount of 30 to 200 parts by weight based on 100 parts by weight of the raw material phenol for the laminated metal layer phenolic fat. There is no particular restriction on the timing of adding the flame retardant.
リン酸エステル類からフェノール類が副生するものに関
してはフェノールを反応系に残したまま、積層板用フェ
ノール側腹の合成時にfJ≦加し。For products in which phenols are by-produced from phosphoric acid esters, fJ≦ should be added during the synthesis of the phenol side for laminates, while leaving phenol in the reaction system.
レゾール化すれば減圧でフェノールを留去する工程が省
けるのでコスト的には有利である。Resol formation eliminates the step of distilling off phenol under reduced pressure, which is advantageous in terms of cost.
この反応生成物を離燃剤として配合したフェノール樹脂
ワニスを所定量含浸付着させた紙基材を必要に応じ銅箔
とともに加熱成形して紙−フエノール樹脂積層板とする
。A paper base material impregnated with a predetermined amount of phenolic resin varnish containing this reaction product as a flame release agent is heat-formed together with copper foil as necessary to form a paper-phenolic resin laminate.
以下、実施例を示して具体的にB51明する。 Hereinafter, B51 will be explained in detail by showing examples.
難燃剤台成例1
攪拌機、温度計、冷却管を備えた21の三ツロフラスコ
K、2,4.6−)リプクモフェニル−β−ヒドロキシ
エチルエーテル750g(2モル)、)リフェニルホス
フエー)652g(2モル)、無水KzCO37,01
gを入れ、150℃に上げ8時間反応させた。七のめと
170℃に昇温し、減圧して副生じたフェノールを留去
した。次いでフラスコから生成物をバットに注ぎ込んで
冷却してから粉砕して難燃剤■とした。Flame retardant stand preparation example 1 21 three-turn flasks K equipped with stirrer, thermometer, condensing tube, 750 g (2 mol) of 2,4.6-) lipcumophenyl-β-hydroxyethyl ether, ) liphenyl phosphene) 652g (2 mol), anhydrous KzCO37,01
g was added, the temperature was raised to 150°C, and the reaction was carried out for 8 hours. The temperature was raised to 170° C. and the pressure was reduced to distill off the by-produced phenol. Next, the product was poured from the flask into a vat, cooled, and crushed to obtain flame retardant (2).
臭素含有1ji39.5i[i%ザリン有35.1 f
i量%離燃剤合成例2
上記と同様のフラスコにジブロモフェニル−β−ヒドロ
キシエチルエーテル888g(3モル)、トリフェニル
ホスフェート652g(2モル)無水に2CO37,7
gを入れ170℃で10時間反応させた。その温度を保
ちながら減圧下に副生じたフェノールを留去した。フェ
ノールの留出が止まった時点でフラスコ内の反応生成物
をバットに注ぎ込んで冷却した。固化し几生成物を粉砕
して難燃剤■とした。臭素含有量3aO重量%リン含有
量4.9乗黛%
難燃剤合成例6
合成例1と同様のフラスコにトリエチレングリコールー
モ/−2,4,6−)リプロモフェニルエーテル(AJ
926 (2モル)、クレジルジフェニルホスフェ−
) CB〕3411 g k 1モル)CsF 1.2
7 gを入れ150℃で8時間反応させた。反応混合物
を難燃剤■とした。(A)の反応率は98%(B)の反
応率は100%であった。Bromine-containing 1ji39.5i [i% Zarin-containing 35.1f
Synthesis Example 2 of i amount % flame retardant 888 g (3 moles) of dibromophenyl-β-hydroxyethyl ether and 652 g (2 moles) of triphenyl phosphate were added to anhydrous 2CO37,7 in the same flask as above.
g was added thereto and reacted at 170°C for 10 hours. While maintaining the temperature, the by-produced phenol was distilled off under reduced pressure. When the distillation of phenol stopped, the reaction product in the flask was poured into a vat and cooled. The solidified product was pulverized to obtain flame retardant (2). Bromine content: 3aO wt% Phosphorus content: 4.9% by weight Flame retardant synthesis example 6 In a flask similar to synthesis example 1, triethylene glycol mo/-2,4,6-)lipromophenyl ether (AJ
926 (2 mol), cresyl diphenyl phosphate
) CB] 3411 g k 1 mol) CsF 1.2
7 g was added and reacted at 150°C for 8 hours. The reaction mixture was used as flame retardant ■. The reaction rate of (A) was 98%, and the reaction rate of (B) was 100%.
難燃剤■はそのま瓦次の積層板用フェノール樹脂の合成
に用いた反応混合物の臭素含有f37゜9重量%リン含
有量2.4Mk%
フェノール樹脂の合成例1(フェノール細線■)攪拌機
、冷却器、温度計を備えた51のフラスコに桐油100
0g、m壷p−クレゾール2000g、PT51gを入
れ100℃で2時間反応させた。次いで、パラホルム8
33g、メタノール250 g、アンモニア水120g
を入れ80℃で反応させた。160℃の熱板上でのゲル
化時間で反応を追跡しゲル化時間か6号になった時点で
減圧下に脱水濃縮した。反応液が透明+(なう疋ところ
で、反応を終了し、トルエン250gメタノール250
gを投入しワニスとした。樹脂分7070ゲル化時間2
分45秒であった。The flame retardant ■ is the reaction mixture used to synthesize the phenolic resin for the laminated board next to the tile. Bromine content f37°9% by weight Phosphorus content 2.4Mk% Phenol resin synthesis example 1 (phenol thin wire ■) Stirrer, cooling 100 tung oil in 51 flasks equipped with a thermometer and a thermometer.
2,000 g of p-cresol and 51 g of PT were placed in a m pot and reacted at 100° C. for 2 hours. Then paraform 8
33g, methanol 250g, ammonia water 120g
was added and reacted at 80°C. The reaction was monitored by the gelation time on a hot plate at 160°C, and when the gelation time reached No. 6, the mixture was dehydrated and concentrated under reduced pressure. By the way, after finishing the reaction, add 250 g of toluene and 250 g of methanol.
g was added to make a varnish. Resin content 7070 Gelation time 2
It was minutes and 45 seconds.
フェノール凋脂の合成例2(フェノール樹脂■)攪拌機
、冷却器、温度計を備えた24のフラスコに桐油250
g、nrp−クレゾール500g、PTSα25gを入
れ100℃で2時間反応させた。次いで難燃剤合成例3
で合成した難燃剤■を617g、パラホルム243 g
、メタノール70g、アンモニア水30gを入れ80℃
で反応させた。ゲル化時間が6分になりだ時点で減圧下
に脱水濃縮した。反応液が:i1に明になったところで
反応を終了し、トルエン130gメタノール130gを
設入レワニスとした。樹脂分69.5%ゲル化時間2分
40秒であった。Synthesis example 2 of phenol resin (phenol resin ■) 250 ml of tung oil was added to 24 flasks equipped with a stirrer, cooler, and thermometer.
g, 500 g of nrp-cresol, and 25 g of PTSα were added and reacted at 100° C. for 2 hours. Next, flame retardant synthesis example 3
617g of flame retardant ■ synthesized with
, add 70g of methanol and 30g of ammonia water and bring to 80°C.
I reacted with When the gelation time reached 6 minutes, the mixture was dehydrated and concentrated under reduced pressure. The reaction was terminated when the reaction solution became clear to i1, and 130 g of toluene and 130 g of methanol were added to the reactor. The resin content was 69.5% and the gelation time was 2 minutes and 40 seconds.
前記の@成した難燃剤、フェノール樹脂を用いて表1に
示す配合で積層板用フェノール樹脂ワニスを調整した。A phenolic resin varnish for laminates was prepared using the above-mentioned flame retardant and phenolic resin in the formulation shown in Table 1.
そして、予め水溶性フェノール樹脂を含浸したクラフト
紙に表1のワニスを樹脂分50%に調整してから含浸さ
せ2乾燥してプリプレグを作成した。Then, kraft paper impregnated with a water-soluble phenolic resin in advance was impregnated with the varnish shown in Table 1 after the resin content was adjusted to 50%, and dried for two hours to prepare a prepreg.
該プリプレグを所定枚数重ね工、片面に接着剤性の銅箔
を重ねて150℃、100kg/an’の圧力で70分
間加圧して厚さ1.6關の銅張積層板を作成した。A predetermined number of sheets of the prepreg were stacked, adhesive copper foil was layered on one side, and pressure was applied at 150° C. and 100 kg/an' for 70 minutes to produce a copper-clad laminate having a thickness of 1.6 mm.
比較例としてトリスクロロエチルホスフェートをフェノ
ール樹脂に添加してワニスを作成し同じ様にグリプレグ
、それから銅張積層板を作成した。As a comparative example, a varnish was prepared by adding trischloroethyl phosphate to a phenolic resin, and a Gripreg and a copper-clad laminate were prepared in the same manner.
銅張積層板t’;jJ l5−C−6481,0L−9
4記載の測定法に準じて特性を測定した。その結果を表
1に示す。Copper clad laminate t';jJ l5-C-6481,0L-9
The characteristics were measured according to the measurement method described in 4. The results are shown in Table 1.
本発明で得られた紙−フエノール鋼Vc積層板はJjん
だ耐熱性、気中l′it#1性が改良された。The paper-phenolic steel Vc laminate obtained in the present invention has improved heat resistance and in-air resistance.
Claims (1)
類を反応させて得られる反応生成物を難燃剤として配合
したフェノール樹脂ワニスを所定量含浸付着させた紙基
材を加熱成形することを特徴とする難燃性紙−フェノー
ル樹脂積層板の製造方法。 2、リン酸エステル類が芳香族環を有するリン酸エステ
ル類である特許請求の範囲第1項記載の難燃性紙−フェ
ノール樹脂積層板の製造方法。[Claims] 1. A paper base material impregnated with a predetermined amount of a phenolic resin varnish containing a flame retardant containing a reaction product obtained by reacting a phosphoric acid ester and a halogen-containing aromatic alcohol is heated and formed. A method for producing a flame-retardant paper-phenolic resin laminate, characterized by: 2. The method for producing a flame-retardant paper-phenolic resin laminate according to claim 1, wherein the phosphoric acid ester is a phosphoric acid ester having an aromatic ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20653984A JPS6185444A (en) | 1984-10-02 | 1984-10-02 | Production of flame-retardant phenolic resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20653984A JPS6185444A (en) | 1984-10-02 | 1984-10-02 | Production of flame-retardant phenolic resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185444A true JPS6185444A (en) | 1986-05-01 |
Family
ID=16525044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20653984A Pending JPS6185444A (en) | 1984-10-02 | 1984-10-02 | Production of flame-retardant phenolic resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185444A (en) |
-
1984
- 1984-10-02 JP JP20653984A patent/JPS6185444A/en active Pending
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