JPS6186887A - Identification card - Google Patents

Abstract

PURPOSE:To prevent the generation of cracks of an IC (identification) card despite application of the bending force, by using plural memory chips to form an information memory means for IC card using plural microprocessor chips to form an information processing means. CONSTITUTION:A memory chip which has about 5mm per side and the memory capacity necessary for the present IC card with a single unit is replaced with four memory chips 15a-15d of about 2mm per side which has 1/4 memory capacity. In the same way, a microprocessor is divided into three microprocessor chips 16a-16c. Thus the internal stress is scattered to each chip despite application of the bending force. This prevents the cracks of an IC card.

Description

[Detailed description of the invention] [Technical field of the invention]
- Concerning IC cards that are used/jj.

[Technique of invention 11: Background of i] From Jyoto, for example, finance (1.
As a data card for the 311 Ming, the surface of the synthetic resin cards I and L is coated with a magnetic stripe, and data such as the account number and recitation number g is recorded on this part, and the IS magnetic card is widely used. It is used.

Magnetic cards (3°) are widely used in the ISr industry because they are simple, highly durable, and suitable for large r1-3 production. Due to the small size of the magnetic notebook, only a very small amount of information can be recorded, and a large amount of information must be stored in separate recording means such as bankbooks used in financial institutions. It is necessary to record the data in a timely manner, and what is the negative impact on the high efficiency of information processing?

In addition, this magnetic cart has problems in terms of confidentiality and prevention of plagiarism because information (・11) can be read from the outside.

Under these circumstances, in recent years, a data card called an IC card has been developed, which has a built-in IC chip such as a memory and a microprocessor, and has dramatically increased storage capacity.

FIG. 4 is a plan view including a partially transparent view showing the structure of this IC card, and FIG. 5 is a horizontal four-sided view taken along the line /\-Δ'.

In these figures, reference numeral 1 indicates a flexible material made of polyimide resin, for example, which has a body pattern 2 formed on its surface and holes 1a, 1a formed in predetermined portions. The flexible substrate 1 is made of, for example, vinyl chloride (5411i!'l"IO), and is fixed to the H-side cover sheet 3, and has a memory chip 4 such as UV-f-:l"ROM and a microphone block. [11? There are 4511 tips 5 fixed to the front cover sheet 3 in the holes 1; ) One fully bent terminal 6 electrically connected to pattern 2 is protruding.

The memory chip 4 and the microprocessor chip 5 are bonded to each other using a gold wire 7, and the flexible substrate 1 has holes 8a, 8a of moderate size surrounding the L bonding part. For example, salt 1 hibinyl 481 fat C-7''n-1-
8 is fixed at 4.

Even more flexible! i! The temporary hole 1a, J3 inside 1a, the hole 8a of the center core sheet 8, and the inside of the center core sheet 8 are filled with a filling material 9 such as epoxy resin. Reinforcement consisting of temporary etc.) Through the cover sheet 10 -C back cover sheet 1
1 is fixed. 1 The IC card configured as described above is set in the card mounting section for predetermined processing, and the metal terminal 6 is inserted into the processing device...11
If you connect it to the terminal, you can read and write information divided by 1.

Incidentally, like the above-mentioned Bi-1 card, IC cards are often carried around all the time, and are required to have considerable durability against external forces.

Problems with the technology] However, in currently developed IC cards, the memory chip 4 and the microprocessor chip 51
; 1 required storage capacity and each necessary processing i (1) each individually ((l'i), so the - side size is about 5 mm, which is relatively large.

As a result, if a "bending" force is applied to the card and the resulting internal stress is transmitted to the chip, there is a risk that the chip may crack.

[Object of the Invention] The present invention has been made in consideration of these circumstances, and is a highly reliable IC which is considered to be an I4 structure in which the chip will not be damaged even if a single bending force is applied. Card presentation 11 E]
-1 target.

[Summary of r and Ming 1! The IC card of the present invention is provided with a means for storing ↑l'i (tl) and a means for processing each information on i';i of the card base material. Naru IC
In the card, the means for storing the above-mentioned information is composed of a plurality of memory chips, and the means for processing each of the above-mentioned information is composed of plural memory chips.・It is composed of 1 layer, 1 layer, and 1 layer.

Embodiments of the invention] 1.4 (Details of the invention are explained in the embodiments shown in the drawings.
r', rt Ming Jru.

Figure 1 shows the length of one embodiment of the present invention.
A plan view containing only one figure, the second figure is on the line B-B':1
) U (^ This is a diagram of 11 songs.

In these figures, 12 has 49 body patterns 1 on the surface.
3 is formed and holes 12a, 12a, . . . are formed in predetermined portions. 2:111
) is shown.

This flexible group (anti-12 is an example of polyvinyl chloride 15)
1. Front cover sheet 14 made of lubricant (thickness 0.05-0.
08 cliff), and the memory chips '15a to 15d such as U\/-1...P ROM etc. and the micro block...l
Lee chip 161]~16C is 1. sible group (anti-1
2 holes 12a, 12a,...Entry side cover sea;・1
・It is fixed at 1.

Each of the main parts 15a to 15d is an IC)j
- How much memory capacity is required fn (through 'ji' + 64
K ~ 11vl bytes) 1/4 notation! This is a tip that allows you to hang it right. In addition, each of the microprocessor chips 16a to 16c performs each necessary process.
65 with a microprocessor chip that was able to draw J-pictures independently.
For example, the microprocessor chip 1 (3a is the center 9JL i'J! !33f fil:, the microprocessor chip 16b is the 1 west exit processing I (jpi), and the microprocessor chip 16c is the control processing function, respectively. (
(These are the chips that were used.) These memory chips 15a~
15d and nike 1] Broset it boot 16a~
It is made into a relatively small chip of 16C (1) 2 + 5, and is mounted in a row with 11, 1, 1 spacing between the 11 and 2 side covers. A part of the sheet 14 is electrically connected to the conductive pattern 13 and is a metal terminal 17;
conductor pattern 13 and memory depth 15a --
15tl J5 and micropro are tree tip 16a
~16C is bonded with gold wire 18.

The luxiple board 12 includes memory chips 15a-115.
d. A center core sheet 19 made of, for example, vinyl vinyl resin, with rectangular holes 19a1'l')a having a size that at least surrounds the bonding portions at positions corresponding to the microprocessor chips 16a to 16c. (thickness 0.35~0.5 mm) is fixed on one side.

The insides of the holes 19a, 19a of the pink core sheet 19 are filled with a filler 20 such as epoxy resin.

Further, the other side of the rental core sheet 19 is a reinforcing material sheet 21 made of, for example, a copper plate, aluminum temporary, etc.
Back 11111 Cover Sea 1-22 (1','
A diameter of 0°05 to 0.085 m> is combined.

As mentioned above, Kino I11! ! The example IC card is the one used for the current (C card),
(The memory chip with approximately 5 holes on each side that was found in i-body is the 4th one.
Replaced with approximately 2111 memory chips per side/round with 1/4th storage capacity, requiring 1. Microprocessor J of about 22 5 liters
Since it has been replaced with three microphone processor chips of 2T per side, each chip has an independent function of 1!111, so even if a "bending" force is applied, each chip will not be damaged internally. The stress is dispersed (my heart feels like it's cracking!'1)
There is no pin.

FIG. 3 is a plan view including a partially transparent view showing another embodiment of the present invention. .

The IC card of this embodiment is the same as the previous embodiment.
The configuration is 15a to 15d +B.
and microb [:] 1 tsuzachitub 16a”, 1 C
'r+: is implemented unevenly on the left side of the card.

In this way, if each f-tube is placed in a position where the central part of the card is removed, "bending" force is applied and internal stress becomes difficult to transmit to each chip, which further reduces the probability of cracking. Improved reliability.

Note that in the embodiment described above (13-1), the memory chips are made up of four small chips and the microprocessor chips are made up of three small chips, but the present invention is not limited to this.

For example, the memory chip is 2.3 or more! :i There is no problem even if the microprocessor chip is composed of two, four or more small chips.

The smaller the size of each chip, the less likely it will be damaged due to bending, but this will also increase the manufacturing cost, so It is preferable to determine the optimum chip size 'J5 and the number σ from the above.It is effective to set the size of each chip to 13'23 wm or less, particularly 2!1111 or less per side.

Effects of the invention
1!4'' In the IC7J-de, the means for storing the 6rJ information is formed from the memory chips of the double rows, and the means for performing each αIp of the information. is the number of stages micro processor 76th: 31i
, %, so the [bending] force is applied t):
2. The internal stress transmitted to each chip is gentle, so there is no fear of cracks in the depth.

[Brief Description of the Drawings] Fig. 1 shows a combination of an embodiment of the present invention, and is partially transparent. FIG. 2 is a plan view including a simple diagram, FIG. 2 is a groove curved surface view taken along the line B-B', and FIG. 3 is a plan view including a partially perspective view showing the structure of another embodiment of the present invention. Figure 4 (of the conventional IC card)
Figure 5 is a plan view including a partial perspective view showing the 14 configuration, and is a cross-sectional view along the line 8-Δ'. ...Conductor pattern 3.14...Front cover sheet 11...Memory chip 5 (about 1 side or 5n)...< Microprocessor chip 6.17...metal terminal 7.18...gold wire~7 8.1...center core sheet 9.20...Jun II 3' 10.21...Reinforcement sheet] 22...Back cover sheet 1~''+5a~15d...(1 side is about 21) Memory chip'I 6a~16c =-(1 side is 2 Microprocessor chip cost 11 (one patent attorney, Sasa Suyama - Figure 1 Figure 2 Figure 3 Figure 4 Figure 5)

Claims (5)

[Claims] (1) In an IC card provided with a means for storing information and a means for performing each process on the information inside a card base material, the means for storing the information is composed of a plurality of memory chips, and the means for storing the information is configured to perform each process on the information. An IC card characterized in that the means for performing the above comprises a plurality of microprocessor chips. (2) Each of the plurality of memory chips has an outer shape smaller than that of a single memory chip that has the necessary storage capacity, and each of the plurality of microprocessor chips has the necessary processing functions by itself. 2. The IC card according to claim 1, wherein the IC card has an outer shape smaller than that of a microprocessor chip. (3) The IC card according to claim 1 or 2, wherein each of the plurality of memory chips and the plurality of microprocessor chips is mounted at a position outside the central portion of the card base material. (4) At least one of the plurality of memory chips and the plurality of microprocessor chips each has a side of 3 mm.
An IC card according to any one of claims 1 to 3, which is made into the following chip. (5) Each of the plurality of memory chips has UV-EPR
An IC card according to any one of claims 1 to 4, which is an OM chip.