JPS6187314A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPS6187314A JPS6187314A JP12140084A JP12140084A JPS6187314A JP S6187314 A JPS6187314 A JP S6187314A JP 12140084 A JP12140084 A JP 12140084A JP 12140084 A JP12140084 A JP 12140084A JP S6187314 A JPS6187314 A JP S6187314A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- solid electrolytic
- anode
- conductor layer
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 32
- 239000007787 solid Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013071 indirect material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（技術分野）
本発明は固体電解コンデンサおよびその製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.
（従来技術）
従来の固体電解コンデンサおよびその製造方法は第１図
に示すようなアルミニウム板などの帯状の導電板１にタ
ンタルなどの弁作用金属からなる陽極体２から突設した
陽極リード３を溶接して等間隔に接続させた後、陽極体
２の表面上に順次、陽極酸化層、半導体層、陰極導体層
（図示省略）を形成してコンデンサ素子４を形成する。(Prior Art) A conventional solid electrolytic capacitor and its manufacturing method, as shown in FIG. 1, include an anode lead 3 protruding from an anode body 2 made of a valve metal such as tantalum on a band-shaped conductive plate 1 such as an aluminum plate. After welding and connecting at equal intervals, an anodized layer, a semiconductor layer, and a cathode conductor layer (not shown) are sequentially formed on the surface of the anode body 2 to form the capacitor element 4.
次に第２図で示すように陽極外部リードとなる第１の突
設部５と陰極外部リードとなる段差部を先端に有する第
２の突設部６１ｒ：対向して設け、フレーム部７．７間
を平坦な支持板７ａで橋絡させて形成したリードフレー
ムを用い、第３図で示すようにコンデンサ素子４（以後
素子と略称）から導出した陽極リード３を第１の突設部
５に溶接して接続する一方、素子４の表面に被着形成し
た陰極導体層を第２の突設部６の段差部と接触させて配
置し、半田または導電ペーストなどで接続する。次にモ
ールド成形型を用いて素子４を樹脂９で絶縁外装し、こ
の絶縁外装した表面に捺印を施す。次にリードフレーム
８を切断線ａ、ｂのそれぞれで切断した後、外装面に沿
って折曲げて第４図のチップ型固体電解コンデンサを形
成していた。このような、従来固体電解コ／デンザおよ
びその製造方法には次のような欠点があった。Next, as shown in FIG. 2, a first protruding part 5 serving as an anode external lead and a second protruding part 61r having a stepped part at its tip serving as a cathode external lead are provided facing each other, and a frame part 7. As shown in FIG. 3, the anode lead 3 led out from the capacitor element 4 (hereinafter referred to as element) is connected to the first protruding part 5 using a lead frame formed by bridging the spaces between the capacitor elements 4 and 7 with a flat support plate 7a. At the same time, the cathode conductor layer formed on the surface of the element 4 is placed in contact with the stepped part of the second protrusion 6, and the connection is made with solder or conductive paste. Next, the element 4 is insulated and covered with resin 9 using a mold, and a mark is applied to the insulated surface. Next, the lead frame 8 was cut along cutting lines a and b, and then bent along the exterior surface to form the chip type solid electrolytic capacitor shown in FIG. Such conventional solid electrolytic co/densers and their manufacturing methods have the following drawbacks.
ビ）陽極体を吊持する間接材料の導電板を必要とする。B) A conductive plate of indirect material is required to suspend the anode body.
（ロ）半導体層被着工程で半導体層が導電板まで這い上
り短絡することをさけるためコスト高の弁作用金属の陽
極リードを長く必要とする。(b) In order to prevent the semiconductor layer from creeping up to the conductive plate and causing a short circuit during the semiconductor layer deposition process, a long anode lead made of an expensive valve metal is required.
（ハ）素子を形成した後に陽極リードを切断して陽極外
部リードと接続する工程を必要とする。(c) After forming the element, a step of cutting the anode lead and connecting it to the anode external lead is required.
（発明の目的）
本発明の目的は、かかる従来欠点を解消した固体電解コ
ンデンサおよびその製造方法を提供することにある。(Objective of the Invention) An object of the present invention is to provide a solid electrolytic capacitor and a method for manufacturing the same which eliminates such conventional drawbacks.
（発明の構成）
本発明によればコンデンサ素子から導出した陽極リード
が弁作用を有する第１の金属板と、半田付は性を有する
第２の金属板を導電密着させた積層金属板と接続され、
かつコンデンサ素子の外周面に設けた陰極導体層に陰極
外部リードを接続して導出し、上記両接続部を含めてコ
ンデンサ素子を絶縁外装させたことを特徴とする固体電
解コンデンサが得られる。また本発明によれば等間隔に
フレーム部から突設させた少なくとも先端部の表面が弁
作用金属からなる突設部を設け、前記突設部の先端部を
除く、少なくとも片面に半田付は性を有する導電板を導
電密着させたくしの刃状体を形成する工程と、上記突設
部の先端部と弁作用金属陽極体から導出した陽極リード
を接続する工程と、上記陽極体の表面に陽極酸化層、半
導体層。(Structure of the Invention) According to the present invention, an anode lead derived from a capacitor element is connected to a laminated metal plate in which a first metal plate having a valve action and a second metal plate having a soldering property are brought into close conductive contact. is,
A solid electrolytic capacitor is obtained, characterized in that a cathode external lead is connected to and led out from a cathode conductor layer provided on the outer peripheral surface of the capacitor element, and the capacitor element including both of the connection parts is insulated. Further, according to the present invention, there are provided protruding portions protruding from the frame portion at equal intervals, the surfaces of at least the tip portions of which are made of valve metal, and soldering is not possible on at least one side of the protruding portions except for the tip portions. a step of forming a comb-like blade by bringing a conductive plate having a conductive plate into conductive contact; a step of connecting the tip of the protrusion with an anode lead led out from the valve metal anode body; Oxide layer, semiconductor layer.
陰極導体層を順次形成してコンデンサ素子を形成する工
程と、上記コンデンサ素子の陰極導体層に陰極外部リー
ドを接続しコンデンサ素子を絶縁外装する工程とを含む
ことを特徴とする固体電解コノデンサの製造方法が得ら
れる。さらには、上記第１の金属板にアルミニウムを用
いたことをも特徴とする固体電解コンディサおよびその
製造方法も得られる。Manufacturing a solid electrolytic conodesensor comprising the steps of sequentially forming cathode conductor layers to form a capacitor element, and connecting a cathode external lead to the cathode conductor layer of the capacitor element to insulate and sheath the capacitor element. method is obtained. Furthermore, a solid electrolytic condenser and a method for manufacturing the same are also obtained, characterized in that aluminum is used for the first metal plate.
（実施例）
以下、本発明の一実施例を第５図〜第９図を参照して説
明する。(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 5 to 9.
第５図で示すようにアルミニタム板などの帯状の弁作用
金属板１１の少なくとも片面の一部に半田付は性が良い
洋白などの帯状４電板１２を少なくとも帯状弁作用金属
板の一方の端部が表面露出するように導電密着させたク
ラツド材１３を用いて、第６図で示すようにフレーム部
１４から等間隔に突設させた陽極外部リードとなる突設
部１５を設け、その突設部１５の先端に弁作用金属の表
面露出部１５ａを設け、かつ片面に導電板１５ｂ’Ｔｈ
導電密着させたくしの刃状の陽極リードフレーム１６を
形成する。次に、陽極リードフレーム１６の突設部１５
の先端に設けた弁作用金属の表面露出部１５ａにタンタ
ルなどの弁作用金属からなる陽極体２から突設した陽極
リード３を溶接して等間隔に接続させた後、陽極体２の
周面上に順次陽極酸化層、半導体層、陰極導体層（図示
省略）を被着形成して素子４を形成する。本案ではリー
ドフレーム１６の表面露出部１５ａが弁作用金属である
ため陽極酸化層形成時に表面露出部１５ａにも陽極酸化
層を形成できるので半導体層形成時に半導体の這い上り
が生じても陽極体と半導体層の短絡が防止できる。次に
第７図で示すように、陰極外部リードとなる段差部を先
端に有する突設部１７ａをフレーム部１７ｂから等間隔
に突設させて形成した陰極リードフレーム１７を用い、
素子４０表面に被着形成した陰極導体１〜を陰極リード
フレーム１７の突設部１７ａの段差部と接触させて配置
し、半日または導電ペーストなどで接続する。次に、モ
ールド成形型を用いて素子４５ｒ樹脂９で絶縁外装し、
この絶縁外装した表面に品種・定格・極性などの捺印を
施す。次に陽極リードフレーム１６と陰極リードフレー
ム１７を切断ｉａ、ｂで切断した後、外装面に沿って折
曲げて第８図のチップ型固体電解コンデン？を形成する
。As shown in FIG. 5, a strip-shaped four-electrode plate 12 made of nickel silver or the like having good soldering properties is attached to at least a part of one side of a strip-shaped valve action metal plate 11 such as an aluminum plate. Using the cladding material 13 which is electrically bonded so that the end portion is exposed on the surface, protruding portions 15 which serve as anode external leads are provided and protruded from the frame portion 14 at equal intervals as shown in FIG. A valve metal surface exposed portion 15a is provided at the tip of the protruding portion 15, and a conductive plate 15b'Th is provided on one side.
A comb-shaped anode lead frame 16 is formed to be electrically conductive and in close contact with each other. Next, the protruding portion 15 of the anode lead frame 16
The anode leads 3 protruding from the anode body 2 made of a valve metal such as tantalum are welded and connected at equal intervals to the exposed surface portion 15a of the valve metal provided at the tip of the anode body 2. The element 4 is formed by sequentially depositing an anodized layer, a semiconductor layer, and a cathode conductor layer (not shown) thereon. In this case, since the surface exposed portion 15a of the lead frame 16 is made of valve metal, the anodized layer can also be formed on the surface exposed portion 15a when forming the anodic oxide layer, so even if the semiconductor creeps up when forming the semiconductor layer, the anode body is not removed. Short circuits in the semiconductor layer can be prevented. Next, as shown in FIG. 7, using a cathode lead frame 17 formed by protruding from a frame portion 17b at equal intervals, protrusions 17a having stepped portions at the tips serving as cathode external leads,
The cathode conductors 1 to 1 formed on the surface of the element 40 are placed in contact with the stepped portions of the protruding portions 17a of the cathode lead frame 17, and connected by half-width or conductive paste. Next, the element 45r is insulated and covered with resin 9 using a mold,
The type, rating, polarity, etc. are stamped on the insulated surface. Next, after cutting the anode lead frame 16 and the cathode lead frame 17 at cuts ia and b, they are bent along the exterior surface to form a chip-type solid electrolytic capacitor as shown in FIG. form.
なお、突設部の両面に半田付は性を有する導電板を導電
密着でせた陽極リードフレームを用いて第９図で示すよ
うな樹脂浸漬による絶縁外装自立型の固体電解コンデン
サを形成することもできる。In addition, a solid electrolytic capacitor with a self-supporting insulating exterior by immersion in resin as shown in Fig. 9 can be formed by using an anode lead frame in which solderable conductive plates are attached to both sides of the protruding part in a conductive manner. You can also do it.
（効果） 以上、本発明により次の効果がある。(effect) As described above, the present invention has the following effects.
（１） コンデンサ素子を吊持する導電板などの間接
材料を必要としない。(1) No indirect materials such as conductive plates for suspending the capacitor element are required.
（１１）陽極外部リードとなる突設部の弁作用金属の表
面露出部が陽極リードの機能をはたすので、コスト高の
弁作用金属の陽極リードを短くすることができる。(11) Since the surface exposed portion of the valve metal of the protrusion serving as the anode external lead functions as the anode lead, the costly anode lead of the valve metal can be shortened.
（曲 陽極外部リードを接続した状態でコノデフす素子
を形成することができるので素子形成後に陽極リードを
切断して外部リードを接続する従来工程を必要としない
。(Curved) Since the cono-def device can be formed with the anode external lead connected, there is no need for the conventional process of cutting the anode lead and connecting the external lead after forming the device.
第１図、第２図、第３図は従来例の固体電解コンデンサ
の製造工程の斜視図。第４図は従来例の固体電解コンデ
ンサの断面図。第５図、第６図。
第７図は本発明の固体電解コンデンサの製造工程の斜視
図。第８図は本発明による第１の実施例の固体電解コン
デンサの断面図。第９図は本発明による第２の実施例の
固体電解コンデンサの斜視図。
ｌ・・・・・・４電板、７・・・・・・フレーム部％
１４・・・・・・フレーム部、２・・・・・・陽極体、
８・・・・・・リードフレーム、１５・・・・・・突設
部、３・・・・・・陽極リード、９・・・・・・絶縁ｍ
脂、ｘ６・・・・・・陽極リードフレーム、４・・・・
・・コンデンサ素子、１１・・・・・・弁作用金属板、
１７・・・・・・陰極リードフレーム、５・・−・・・
第１の突設部、１２・・・・・・導電板、６・・・・・
・第２の突設部、１３・・・・・・クラツド材。
にン1, 2, and 3 are perspective views of the manufacturing process of a conventional solid electrolytic capacitor. FIG. 4 is a sectional view of a conventional solid electrolytic capacitor. Figures 5 and 6. FIG. 7 is a perspective view of the manufacturing process of the solid electrolytic capacitor of the present invention. FIG. 8 is a sectional view of a solid electrolytic capacitor according to a first embodiment of the present invention. FIG. 9 is a perspective view of a solid electrolytic capacitor according to a second embodiment of the present invention. l...4 electric board, 7...frame part%
14... Frame part, 2... Anode body,
8...Lead frame, 15...Protrusion part, 3...Anode lead, 9...Insulation m
Grease, x6... Anode lead frame, 4...
... Capacitor element, 11 ... Valve metal plate,
17...Cathode lead frame, 5...
First protruding portion, 12... Conductive plate, 6...
-Second protrusion, 13... cladding material. Nin
Claims (2)
を有する第１の金属板と、半田付け性を有する第２の金
属板を導電密着させた積層金属板と接続され、かつコン
デンサ素子の外周面に設けた陰極導体層に陰極外部リー
ドを接続して導出し、前記両接続部を含めてコンデンサ
素子を絶縁外装させたことを特徴とする固体電解コンデ
ンサ。(1) The anode lead led out from the capacitor element is connected to a laminated metal plate in which a first metal plate with a valve action and a second metal plate with solderability are brought into conductive contact, and the outer peripheral surface of the capacitor element A solid electrolytic capacitor, characterized in that a cathode external lead is connected to and led out from a cathode conductor layer provided in the cathode conductor layer, and a capacitor element including both of the connection parts is insulated and sheathed.
端部の表面が弁作用金属からなる突設部を設け、前記突
設部の先端部を除く、少なくとも片面に半田付け性を有
する導電板を導電密着させたくしの刃状体を形成する工
程と、前記突設部の先端部と弁作用金属陽極体から導出
した陽極リードを接続する工程と、前記陽極体の表面に
陽極酸化層、半導体層、陰極導体層を順次形成してコン
デンサ素子を形成する工程と、前記コンデンサ素子の陰
極導体層に陰極外部リードを接続しコンデンサ素子を絶
縁外装する工程とを含むことを特徴とする固体電解コン
デンサの製造方法。(2) A conductive plate having protrusions protruding from the frame part at equal intervals, the surface of at least the tip of which is made of valve metal, and having solderability on at least one side, excluding the tip of the protrusion. a step of forming a comb blade-like body in which conductive contact is made, a step of connecting the tip of the protrusion with an anode lead led out from the valve metal anode body, and a step of forming an anodized layer and a semiconductor on the surface of the anode body. A solid electrolytic capacitor comprising the steps of: forming a capacitor element by sequentially forming a cathode conductor layer and a cathode conductor layer; and connecting a cathode external lead to the cathode conductor layer of the capacitor element to insulate and sheath the capacitor element. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12140084A JPS6187314A (en) | 1984-06-13 | 1984-06-13 | Manufacture of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12140084A JPS6187314A (en) | 1984-06-13 | 1984-06-13 | Manufacture of solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6187314A true JPS6187314A (en) | 1986-05-02 |
Family
ID=14810243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12140084A Pending JPS6187314A (en) | 1984-06-13 | 1984-06-13 | Manufacture of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6187314A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010287912A (en) * | 2010-08-25 | 2010-12-24 | Panasonic Corp | Solid electrolytic capacitor and solid electrolytic capacitor manufacturing method |
| US12148286B2 (en) | 2020-05-21 | 2024-11-19 | Mitutoyo Corporation | Precision length measuring device |
-
1984
- 1984-06-13 JP JP12140084A patent/JPS6187314A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010287912A (en) * | 2010-08-25 | 2010-12-24 | Panasonic Corp | Solid electrolytic capacitor and solid electrolytic capacitor manufacturing method |
| US12148286B2 (en) | 2020-05-21 | 2024-11-19 | Mitutoyo Corporation | Precision length measuring device |
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