JPS6188531A - Integrated circuit device cleaning apparatus - Google Patents

Abstract

PURPOSE:To improve working efficiency by automatically carrying IC having completed soldering process from a holding apparatus, followed by cleaning, dripping and drying process, and automatically accommodating it within a magazine. CONSTITUTION:When an IC1 supported by holding apparatus is supplied 5 and is then transferred from the rear side with a pin 9, it is carried from the holding apparatuses 3, 4, it is then sent onto a rail 11 of cleaning section 6 with the lead 2 positioned downward and is then dipped into a cleaning tank 14. A jet stream to the lower side of IC from a cleaning liquid nozzle 12 of rail 11 floats an IC and gives perfect cleaning effect to the entire part of IC. The air ejected from the nozzle 13 in the tank stirs the cleaning liquid. The rail 11 and tank 14 gradually become high in the traveling direction. Thereby, the cleaning liquid flows to the exit from the inlet, improving the cleaning effect. An IC is then sent to an accommodating section 8 with pin 9 along the upper and lower four round bars 16, 17. During such transfer, water is cut with blowing of high compressed air 18 and the IC is dried up with blowing of hot air 19, and thereby the entire part is dried up perfectly. The IC is well dried with the region other than the narrow contact region exposed to such hot air and is then accommodated in the magazine.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cleaning device for integrated circuit devices (hereinafter referred to as IC), and particularly to a dual innoline package type (hereinafter referred to as DIP type) IC. One part relates to equipment for cleaning the surfaces of leads and packages.

[Conventional technology]

Generally, in the manufacturing process of DIP type ICs, the external leads of the IC are pre-soldered in order to prevent oxidation of the external leads and to improve soldering properties when mounting the IC on a printed circuit board. . This soldering process consists of applying flux to the external leads, soldering to the external leads using a jet soldering bath, cleaning flux residue adhering to the external leads and IC package, draining with high pressure air, and drying with hot air. Conventionally, this soldering process is performed on IC package 1 as shown in Figure 5.
Both upper corners of the package 1 are supported from above by an upper holder 33, and the lower surface of the package 1 is supported from below by a lower holder 4.

[Problem that the invention seeks to solve]

However, since the surface area of the IC package covered by both holders 3.4 is large, the upper holding part 3 and lower holding part 4 get in the way when cleaning the IC. There was a drawback that the lower surface of the pack 2 and the interface between the external lead 2 and the package 1, which had a large amount of flux attached, could not be sufficiently cleaned. In particular, flux residue near the interface between the external lead 2 and the pan cage 1 may have a negative effect on the integrated circuit element, so either take a sufficient amount of time to clean it, or move the IC from the holder to another cleaning basket and disassemble it. The workability was very poor because it had to be cleaned in such a condition. Further, in the drying process, there is also a drawback that the surface of the package cannot be sufficiently dried.

In order to eliminate the above-mentioned drawbacks, the present invention provides a tC cleaning device that can automatically remove the IC from the holder after soldering to the external leads and perform sufficient cleaning and drying. It is something to do.

[Failure to solve the problem]

The present invention includes an IC supply section in which an integrated circuit device supported by a processing holder is mounted, a cleaning section for cleaning the integrated circuit device pulled out from the holder and carried out from the IC supply section, and a cleaning section for cleaning the integrated circuit device. a drying section that dries the dried integrated circuit device; an IC storage section that stores the dried integrated circuit device in a magazine; and a transport mechanism that feeds the integrated circuit device to pull it out from the holder and convey it along each section. It consists of
The cleaning section includes a cleaning tank containing a cleaning liquid, and a nozzle that supports the lower surface of the integrated circuit device at a height where the integrated circuit device is submerged in the cleaning liquid in the cleaning tank and sprays the cleaning liquid toward the lower surface of the integrated circuit device. A collector circuit C comprising a conveyor rail provided on the upper surface and a nozzle for agitating the cleaning liquid, and further comprising a rod-shaped guide installed in the drying section to support the integrated circuit device by line contact. Wash with cleaning equipment.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, the present invention apparatus includes an IC supply section 5 on which an IC package 1 supported by processing holders 3 and 4 is mounted, and a holder 3.4 for soldering as shown in FIG. A cleaning section 6 that cleans the IC package 1 pulled out and carried out from the supply section 5, a drying section 7 that dries the cleaned IC package 1, and an IC storage section that stores the dried IC package 1 in a magazine. 8, press the transport pin 9 against the rear of the IC package 1 and feed it to the IC package 1.
and a conveyance mechanism 10 for pulling out from the holders 3 and 4 and conveying them along each part.

As shown in FIG. 2.3, the cleaning section 6 has a slit 15 at the top for sliding the transport bin 9, and an I
Cleaning tank 1 with a square cross section that also serves as a guide for the C package 1
4, and a transport rail 1 that supports the lower surface of the package 1 at a height position where the IC pan cane 1 is submerged in the cleaning liquid 20 in the cleaning tank 14, and has a cleaning liquid spray nozzle 12 on its upper surface.
1 and a nozzle 13 for agitating the cleaning liquid.The bottom of the cleaning 'cb 14 and the conveyor rail 11 are inclined upward toward the drying section 7, and the cleaning liquid flows from the outlet side to the inlet side of the cleaning section 6. flows, and internal liquid circulation is performed in the same manner as in a cascade. A cleaning liquid is supplied to the cleaning tank 14 by a cleaning liquid supply pump 21 and drained through a drain pipe 22 .

The IC supply section 5 located upstream of the cleaning section 6 includes a cleaning tank 1.
It is equipped with a rectangular cylindrical guide having the same cross-sectional shape as 4, and a conveyance rail installed inside the guide to support the bottom surface of the IC package. The round angular cylindrical cleaning tank 14 and the conveyor rail of the supply section 5 are connected to the conveyance rail 11 of the cleaning section 6, respectively, while preventing leakage of the cleaning liquid in the cleaning tank 14 by appropriate means.

As shown in FIG. 4, in the drying section 7 located after the washing section 6, an IC is installed on the extension line of the conveyor rail 11 of the washing section 6.
4 with a small diameter and circular cross section that supports the package 1 from above and below.
Set the book rod guides 16, 16, 17, 17 horizontally!
e L/, the IC is supported by line contact with the guide. Further, an air outlet 18 for draining water and a hot air outlet 19 are installed above and below the guides 16 and 17.

In this embodiment, soldering is carried out by loading the IC package supported by the processing holder into the IC supply section 5 (((
0 and feeds the IC package 1 from the rear part of the IC package 1 using the transport bin, the IC package 1 is moved to the holder 3.
, 4, and the lead 2 is directed downward to the conveyance rail of the supply section 5, and the lower surface thereof is supported and guided by the rectangular cylindrical guide, and conveyed to the conveyance rail 11 of the cleaning section 6, It is immersed in the liquid in the cleaning tank 14. Transport rail 11
is provided with a plurality of cleaning liquid spray nozzles 12,
Since the cleaning liquid is constantly sprayed onto the lower surface of the IC package from the nozzle 12, the IC package floats due to the jet flow, and a film of cleaning liquid is constantly formed between the lower surface of the IC package and the transport rail 11. Add the cleaning solution as shown in Figure 4.
If the cleaning liquid is supplied so as to maintain the surface -a', all surfaces of the IC package 1 and the external leads 2 are completely in contact with the cleaning liquid during IC transportation, so that a good cleaning effect can be obtained. Moreover, a plurality of air injection nozzles 1 are installed inside the cleaning tank 14.
3 is provided, and the air injected from the nozzle moderately stirs the cleaning liquid inside the rectangular tubular cleaning tank to improve the distribution 9 of the cleaning liquid on the surface of the LC clothing, thereby increasing the cleaning effect. Therefore, the cleaning time is shortened, and the device configuration and the transport distance of the IC in the cleaning section are shortened, making the machine simpler. As shown in Figure 2, it has a slope that gradually increases in the direction of IC movement, and the cleaning liquid flows from the outlet side to the inlet side in the conveyor rail section of the cleaning section.
The internal circulation of the liquid is carried out in the same manner as in a cascade tank, and a good cleaning effect can be obtained.

Next, in the drying section of the cleaning apparatus shown in FIG. 5, the IC is transported to the IC storage section 8 by the transport bin 9 along four guides 16 and 17, each of which has a thin round bar shape, upper and lower. In the drying section, as shown in FIG. 1, the cleaning liquid adhering to the IC package 1 and the external leads 2 is dried by removing water using high-pressure air from the outlet 18 and drying by hot air from the outlet 19. Since the surface of the IC is exposed except for extremely narrow areas where it contacts the guides 16 and 17, effective drying work is possible.

Thereafter, the IC is stored in a magazine.

〔Effect of the invention〕

As described above, the cleaning device according to the present invention automatically carries out the IC from the holder after soldering and stores it in the magazine after passing through the cleaning, draining, and drying steps.
Work efficiency can be improved, and since the cleaning liquid completely contacts all IC package surfaces and external leads during cleaning, a sufficient cleaning effect can be obtained. Because it is completely exposed, the quality of the product is extremely effective.

[Brief explanation of drawings]

Fig. 1 is a schematic overall configuration diagram of a cleaning device that is an embodiment of the present invention, Fig. 2 is a partial cross-sectional perspective view of the cleaning section, Fig. 3 is a partial cross-sectional view of the conveyance rail of the cleaning section, and Fig. 4 is a partial cross-sectional view of the cleaning section. FIG. 5 is a cross-sectional view showing how the IC is held in the drying section, and FIG. 5 is a cross-sectional view showing how the IC is held by a conventional soldering holder. In addition, in the figure, 1...IC package, 2...IC
external lead, 3... upper holder, 4... lower holder, 5... IC supply section, 6... washing section, 7... drying section, 8... IC storage section, 9...Transportation bin, 10.
...Transportation mechanism, 11...Transportation rail, 12...Washing water injection nozzle, 13...Agitation nozzle, 14...Cleaning tank, 15...Slit, 16...Guide, 17...
・Guide, 18...Blowout outlet, 19...Blowout outlet, 2o・
...Cleaning liquid, 21...Cleaning liquid supply pump, 22...
Drain pipe, aa' - upper surface of cleaning liquid. Figure 1 Figure 3 Figure 14 Yumi Makasu

Claims (1)

[Claims] (1) An IC supply unit that mounts an integrated circuit device supported by a holder for soldering, and an IC supply unit that is pulled out from the holder and
A cleaning section that cleans the integrated circuit device carried out from the C supply section, a drying section that dries the cleaned integrated circuit device, an IC storage section that stores the dried integrated circuit device in a magazine, and an IC storage section that stores the dried integrated circuit device in a magazine. The integrated circuit device is comprised of a conveyor groove that feeds the parts and pulls them out of the holder and conveys them along each part; It supports the bottom surface of the device at a height position, and is composed of a transport rail having a nozzle on the top surface for spraying cleaning liquid toward the bottom surface of the integrated circuit device, and a nozzle for stirring the cleaning liquid. A cleaning device for an integrated circuit device, characterized in that a rod-shaped guide is installed to support the circuit device through line contact.