JPS6189400A - Paper - Google Patents

Paper

Info

Publication number
JPS6189400A
JPS6189400A JP21015384A JP21015384A JPS6189400A JP S6189400 A JPS6189400 A JP S6189400A JP 21015384 A JP21015384 A JP 21015384A JP 21015384 A JP21015384 A JP 21015384A JP S6189400 A JPS6189400 A JP S6189400A
Authority
JP
Japan
Prior art keywords
paper
mica
mixed
stock
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21015384A
Other languages
Japanese (ja)
Inventor
利一郎 家田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagara Seishi KK
Original Assignee
Nagara Seishi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagara Seishi KK filed Critical Nagara Seishi KK
Priority to JP21015384A priority Critical patent/JPS6189400A/en
Publication of JPS6189400A publication Critical patent/JPS6189400A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Paper (AREA)
  • Organic Insulating Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 発明の目的 (顔業」=の利用分野) この発明はプリント基板の素材等に使用される紙に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Application) This invention relates to paper used as a material for printed circuit boards, etc.

(従来の技術及び発明が解決しようとする問題点)従来
、プリント基板を製造する際には、ガラス繊維を含有す
る紙にフェノール樹脂を含浸させ、それを積層して固着
していた。ところが、この従来のプリント基板において
は、ガラス繊維が高価であるため、紙の製造コストが高
騰するという問題があった。又、ガラス繊維は疎水性で
あるため、通常の抄紙方法では抄紙しにくいという問題
があった。
(Prior Art and Problems to be Solved by the Invention) Conventionally, when manufacturing printed circuit boards, paper containing glass fibers was impregnated with phenol resin, and then the paper was laminated and fixed. However, in this conventional printed circuit board, there was a problem in that the manufacturing cost of paper increased because glass fiber was expensive. Further, since glass fiber is hydrophobic, there is a problem in that it is difficult to make paper using normal paper making methods.

発明の構成 (問題点を解決するための手段及び作用)上記の問題点
を解決するためにこの発明においては、紙料中にマイカ
を含有したもので抄紙している。それにより、電気絶縁
性に優れた紙を安価に提供でき、プリント基板等の素材
として有効に利用できる。
Structure of the Invention (Means and Effects for Solving the Problems) In order to solve the above problems, in the present invention, paper is made using paper stock containing mica. As a result, paper with excellent electrical insulation properties can be provided at low cost and can be effectively used as a material for printed circuit boards and the like.

(実施例) 以1・、この究明を具体化した実施例に一ノいて説明す
る。
(Example) Hereinafter, an explanation will be given with reference to an example that embodies this investigation.

さて、マイカを含有する紙料を製造する場合に)とを所
定の割合で混合して水中に分散させる。
Now, when producing a paper stock containing mica, mica is mixed in a predetermined ratio and dispersed in water.

次にその分散液にデノプン、アクリル酸エステル等から
なるバイツタ−を添加撹伴し、そのバイツタ−によりマ
イカと紙層構成材料とを結合してそれらを凝集させる。
Next, a bitter consisting of denopone, acrylic acid ester, etc. is added to the dispersion and stirred, and the bitter binds the mica and the material constituting the paper layer to cause them to coagulate.

又、前記バインダーと同時に、カチオン性のエボキノ化
ポリアミドボリアε−樹脂水溶液等からなる定着剤を添
加混合して紙層構成材料に対するバイ−・グー及びマイ
カの定着性を向上させる。上記の工程により製造した凝
集物すなオ〕も紙料をすき網(50〜100メツシユ)
でろ過することにより、電気絶縁性に優れたマイカ含有
紙を安価に製造することができる。又、抄紙に際してマ
イカ粉のみがすき網を通過して抄紙用循環水を陶らすお
それもない。
Further, at the same time as the binder, a fixing agent such as a cationic evoquinated polyamide borea ε-resin aqueous solution is added and mixed to improve the fixing properties of bi-goo and mica to the paper layer constituent materials. The aggregates produced by the above process are also passed through paper stock (50 to 100 mesh).
By filtration, mica-containing paper with excellent electrical insulation properties can be produced at low cost. Furthermore, there is no risk that only the mica powder will pass through the screen during paper making and pollute the circulating water for paper making.

なお、紙層構成材料の天然バルブとしては、木材バルブ
、@皮#l維1種毛繊維1葉la維を使用でき、紙層構
成材料の合成繊維及び無83繊維としては、ポリプロピ
レン、ポリエチレン、ガラス繊維。
In addition, as the natural bulb of the paper layer constituent material, wood bulb, @leather #l fiber 1 type hair fiber 1 leaf LA fiber can be used, and as the paper layer constituent material of the synthetic fiber and non-83 fiber, polypropylene, polyethylene, glass fiber.

ロックウール、カーボン繊維、アスベスト、アルミナ等
を使用できる。又、バインダーとしてはOSI述したも
のの他に、変性デンプン、植物ガム、カルボキシメチル
セルロース(CMC)、ポリビニルアルコール(Pvc
)、ポリアクリルアミド。
Rock wool, carbon fiber, asbestos, alumina, etc. can be used. In addition to those mentioned by OSI, binders include modified starch, vegetable gum, carboxymethylcellulose (CMC), polyvinyl alcohol (Pvc).
), polyacrylamide.

ゴパイトC8−Phlo8−Ph1o ;組成式に2M
g4(A 12814010 ) (0IL)4) 、
マスコバイト〔MH3c(Hite ;組成式に2A1
4(A1□5160□。)(OH)4)やL−フロゴパ
イト等を使用できる。
Gopite C8-Phlo8-Ph1o; 2M in the composition formula
g4(A 12814010) (0IL)4),
Muscovite [MH3c (Hite; composition formula is 2A1
4 (A1□5160□.) (OH)4), L-phlogopite, etc. can be used.

そして、前述した製造方法によれば、マイカと紙層構成
材料とがバインダー及び定着剤により強固に結合される
ため、マイカ含打率を高くしても、抄紙作業中において
、両者の比重差(マイカの比重;約2.85.木材パル
プの比重:Q、65〜0.7)に基づく分離層が形成さ
れたり、マイカ粉のみがすき網から流出して循環水を汚
濁さしたりするおそれはなく、抄紙性を向上させて強靭
な紙を製造することができる・さらに、抄紙後において
マイカが剥離したりする仁ともない。
According to the above-mentioned manufacturing method, mica and the paper layer constituent material are firmly bonded by the binder and the fixing agent, so even if the mica content is increased, the difference in specific gravity between the two (mica Specific gravity: approximately 2.85. There is a risk that a separation layer will be formed based on the specific gravity of wood pulp (Q, 65 to 0.7), or that only the mica powder will flow out from the plow net and pollute the circulating water. It is possible to improve paper-making properties and produce strong paper without any problems.Furthermore, there is no possibility of mica peeling off after paper-making.

叉、特に、バインダーとしてデンプン、アクリ酸エステ
ルを使用し、紙層構成材料として天然バルブを使用する
場合、分散液中で天然バルブは負に帯電され、かつni
I記バインダーの添加によって分散液中のI’ILが変
化することはないので、カチオン性のエポキノ化ポリア
ミドアミン(定着剤)を添加すれば、繊維分を効率よく
凝集させることができる。この場合、分散液のI’ll
調整のために硫酸アルミニウム水溶液を添加する必要も
ない。
In particular, when starch or acrylic ester is used as a binder and natural valve is used as a material constituting the paper layer, the natural valve is negatively charged in the dispersion, and ni
Since the I'IL in the dispersion does not change by adding the binder described in I, the fibers can be efficiently aggregated by adding a cationic epoxylated polyamide amine (fixing agent). In this case, I'll of the dispersion
There is no need to add an aqueous aluminum sulfate solution for adjustment.

また、紙層形成材料として木材パルプを使用する場合に
は、材料調整時にその111団q度を10〜20°SR
(ノヨツパーリグラー)程度にしておけば、抄紙後に吸
取り程度の多孔性を備えた紙が得られる。よって、その
紙に対するフェノール樹脂等の含浸性を向上させること
ができ、プリント基板の製造に際してより有利なものと
なる。
In addition, when using wood pulp as a paper layer forming material, the 111 group q degree should be adjusted to 10 to 20 degrees SR when preparing the material.
If the porosity is maintained at the level of (Noyotsu Parrigler), paper with porosity comparable to that of blotting after papermaking can be obtained. Therefore, it is possible to improve the impregnating property of the paper with phenol resin, etc., which is more advantageous in manufacturing printed circuit boards.

次に、具体的な実施例について説明する。Next, specific examples will be described.

この実施例ではN−BKI’(針葉樹晒クラフトバルブ
)を叩解度20°SRに予め調整し、このN−BKP 
20重量%とマイカ粉(S−フロゴパイ〒W−とを混合
してその混合物を分散濃度2.0%の割合で水中に分散
させ、スラリーを得た。次いで、攪拌器により50〜6
0 r、 p、nlの速度で攪拌しながら、前記スラリ
ーに対して3.0%のデンプン粉末を添加し、混合攪拌
した。更にアクリル酸エステルエマルジョノを2.0%
添加混合した。又、前述した定石処理を行うために、原
材料(バルブ及びマイカ粉)に対してエボキノ化ポリア
ミドポリアミン水溶液を固形分換算で0゜7%添加し、
20〜30「、■)、1nで攪拌混合し、斡団状のフロ
ック(電気的な力により凝集された粒子集合体)を形成
した。前記フロックを更に粗大化させるため、ノニオン
性のポリエチレンオキサイド樹脂水溶液(平均分子量3
0万〜50万。
In this example, N-BKI' (softwood bleached kraft valve) was adjusted to a beating degree of 20°SR in advance, and this N-BKP
20 wt.
While stirring at a speed of 0 r, p, nl, 3.0% starch powder was added to the slurry and mixed and stirred. Furthermore, 2.0% acrylic acid ester emulsion
Add and mix. In addition, in order to perform the above-mentioned regular treatment, an evoquinated polyamide polyamine aqueous solution was added to the raw materials (bulbs and mica powder) at 0°7% in terms of solid content.
20-30", ■) and 1N were stirred and mixed to form a floc (aggregate of particles aggregated by electric force). In order to further coarsen the floc, nonionic polyethylene oxide was added. Resin aqueous solution (average molecular weight 3
00,000 to 500,000.

粘度900〜8000 c、 p S)を原材料に対し
て30ppm添加して混合した。
30 ppm of viscosity 900-8000 c, pS) was added to the raw materials and mixed.

上記の処理によって得られた紙料を0.4%の抄紙濃度
に希釈し、通常のすき網でマイカ含有紙を抄紙した。そ
して、そのマイカ含有紙の紙厚、密度4比抵抗、比破裂
強さ等を測定した。その結果は表2に示すとおりである
。又、前記実施例において例示した混合率とは異なる混
合率を有する原材料を用いてマイカ含有紙を抄紙したが
、その混合率及び測定結果も同じく表2に示す。なお、
比抵抗は横開ヒユーレット・パッカード株式会社製の絶
縁抵抗計で測定し、測定可能範囲は100■で5X10
6〜2X 10”Ω−elnである。又、比破裂強さは
、ll5I’8112による方法で測定した。
The paper stock obtained by the above treatment was diluted to a papermaking concentration of 0.4%, and a mica-containing paper was made using a regular cloth screen. Then, the paper thickness, density 4 specific resistance, specific bursting strength, etc. of the mica-containing paper were measured. The results are shown in Table 2. In addition, mica-containing paper was made using raw materials having a mixing ratio different from the mixing ratio exemplified in the above example, and the mixing ratio and measurement results are also shown in Table 2. In addition,
The specific resistance was measured with a horizontal opening Hewlett Packard Co., Ltd. insulation resistance meter, and the measurable range was 5X10 at 100cm.
6 to 2×10” Ω-eln. The specific bursting strength was measured by the method according to 115I'8112.

らなみに、従来のガラス繊維含有紙の比抵抗は1x i
 o12Ω・cm程度であることから、このマイカ含有
紙をプリー・ト基板として使用するには、マイカ含有率
が40重爪形及至96重量形であるものが適している。
By the way, the resistivity of conventional paper containing glass fiber is 1x i
Since the mica-containing paper is about 12 Ω·cm, it is suitable to use mica-containing paper as a pleated substrate with a mica content of 40 to 96 weight type.

表1 マイカの化学組成(重h1°%)表2 マイカ含
有紙の物性
Table 1 Chemical composition of mica (weight h1%) Table 2 Physical properties of mica-containing paper

Claims (1)

【特許請求の範囲】 1 マイカを含有する紙料にて抄紙されたことを特徴と
する紙。 2 紙料中のマイカ含有率は40重量%〜96重量%で
あることを特徴とする特許請求の範囲第1項に記載の紙
。 3 紙層構成材料とマイカとを混合した混合紙料を水中
に分散し、その分散液中にバインダーを添加、攪拌して
前記紙層構成材料とマイカとを凝集させ、その凝集物に
より抄紙されたことを特徴とする特許請求の範囲第1項
に記載の紙。
[Claims] 1. A paper characterized by being made from a stock containing mica. 2. The paper according to claim 1, wherein the mica content in the paper stock is 40% to 96% by weight. 3 Disperse a mixed paper stock in which the paper layer constituent material and mica are mixed in water, add a binder to the dispersion, and stir it to aggregate the paper layer constituent material and mica, and make paper with the aggregate. The paper according to claim 1, characterized in that:
JP21015384A 1984-10-06 1984-10-06 Paper Pending JPS6189400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21015384A JPS6189400A (en) 1984-10-06 1984-10-06 Paper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21015384A JPS6189400A (en) 1984-10-06 1984-10-06 Paper

Publications (1)

Publication Number Publication Date
JPS6189400A true JPS6189400A (en) 1986-05-07

Family

ID=16584642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21015384A Pending JPS6189400A (en) 1984-10-06 1984-10-06 Paper

Country Status (1)

Country Link
JP (1) JPS6189400A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2610954A1 (en) * 1987-02-17 1988-08-19 Armstrong World Ind Inc WATER RESISTANT SILICATE AND POLYMER STRUCTURE MATERIAL AND METHOD OF MANUFACTURING THE SAME
CN106279927A (en) * 2016-09-07 2017-01-04 芜湖桑乐金电子科技有限公司 High intensity mica paper and preparation method thereof
CN106283843A (en) * 2016-09-07 2017-01-04 芜湖桑乐金电子科技有限公司 High intensity mica paper and preparation method thereof
CN106320060A (en) * 2016-09-07 2017-01-11 芜湖桑乐金电子科技有限公司 High-strength mica paper and method for preparing same
CN106320098A (en) * 2016-09-07 2017-01-11 芜湖桑乐金电子科技有限公司 Resin composite mica paper and preparation method thereof
CN106400604A (en) * 2016-09-07 2017-02-15 芜湖桑乐金电子科技有限公司 High-strength mica paper and preparation method thereof
CN106400607A (en) * 2016-09-07 2017-02-15 芜湖桑乐金电子科技有限公司 Resin composite mica paper and preparation method thereof
CN106436444A (en) * 2016-09-07 2017-02-22 芜湖桑乐金电子科技有限公司 High-strength mica paper and preparing method thereof
CN106436487A (en) * 2016-09-07 2017-02-22 芜湖桑乐金电子科技有限公司 Composite mica paper and preparing method thereof
CN106498811A (en) * 2016-09-07 2017-03-15 芜湖桑乐金电子科技有限公司 Combined mica paper and preparation method thereof
CN111145936A (en) * 2019-11-12 2020-05-12 南通中菱电力科技股份有限公司 High-performance high-temperature-resistant insulating paper

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598136U (en) * 1982-07-07 1984-01-19 月岡 康信 Chip plate used for inspection dispensing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598136U (en) * 1982-07-07 1984-01-19 月岡 康信 Chip plate used for inspection dispensing device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2610954A1 (en) * 1987-02-17 1988-08-19 Armstrong World Ind Inc WATER RESISTANT SILICATE AND POLYMER STRUCTURE MATERIAL AND METHOD OF MANUFACTURING THE SAME
BE1001197A3 (en) * 1987-02-17 1989-08-16 Armstrong World Ind Inc Structure of material based on silicate and polymer, water resistant, and manufacturing method thereof.
CN106279927A (en) * 2016-09-07 2017-01-04 芜湖桑乐金电子科技有限公司 High intensity mica paper and preparation method thereof
CN106283843A (en) * 2016-09-07 2017-01-04 芜湖桑乐金电子科技有限公司 High intensity mica paper and preparation method thereof
CN106320060A (en) * 2016-09-07 2017-01-11 芜湖桑乐金电子科技有限公司 High-strength mica paper and method for preparing same
CN106320098A (en) * 2016-09-07 2017-01-11 芜湖桑乐金电子科技有限公司 Resin composite mica paper and preparation method thereof
CN106400604A (en) * 2016-09-07 2017-02-15 芜湖桑乐金电子科技有限公司 High-strength mica paper and preparation method thereof
CN106400607A (en) * 2016-09-07 2017-02-15 芜湖桑乐金电子科技有限公司 Resin composite mica paper and preparation method thereof
CN106436444A (en) * 2016-09-07 2017-02-22 芜湖桑乐金电子科技有限公司 High-strength mica paper and preparing method thereof
CN106436487A (en) * 2016-09-07 2017-02-22 芜湖桑乐金电子科技有限公司 Composite mica paper and preparing method thereof
CN106498811A (en) * 2016-09-07 2017-03-15 芜湖桑乐金电子科技有限公司 Combined mica paper and preparation method thereof
CN111145936A (en) * 2019-11-12 2020-05-12 南通中菱电力科技股份有限公司 High-performance high-temperature-resistant insulating paper

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