JPS618990A - Electric circuit transferring method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial use parts] The present invention relates to an electric circuit transfer method.

[Conventional technology]

Conventionally, printed wiring for panel wiring, parts of electrical components such as resistors and coils, and masks for vapor deposition have been manufactured by photoetching. (As an example,
(Refer to Japanese Patent No. 2389) As shown in FIG. 4, a baking pattern having a shape that almost matches the perforation shape is provided on the resist film 8a on one side of the metal plate 7, and a pattern for baking is provided on the resist film 8b on the other side. In each of the resist films 8 a + , a baking pattern consisting of a synthesized pattern similar to the baking pattern and arranged in a predetermined manner so as to have apparently larger dimensions than the baking pattern is arranged. 8b, a photographic etching process comprising a step of baking the pattern, and a step of etching the resist-removed portion of the unexposed portion of the resist film on which the pattern is baked, from both sides of the metal plate to be drilled. It is the law.

[Problem that the invention seeks to solve]

However, in this conventional photographic etching method, the resist is baked and developed, the unexposed areas of the resist are removed, and etching is then carried out using an etching solution. There are problems in that the treatment of waste liquid is difficult due to pollution problems, and the etching treatment itself is expensive.

This invention was made by focusing on such conventional problems, and involves attaching a metallized foil onto a protective film, and forming an electric circuit pattern, etc. on the metallized foil using a photographic method or a printing method. However, the present invention aims to solve the above-mentioned problems by bringing this into contact with a base material coated with a binder, press-bonding it, and then peeling off the metal foil.

[Means for solving problems]

This invention involves attaching a metal vapor-deposited foil onto a protective film, forming an electric circuit pattern on it using a photographic method or a printing method,
The metal-deposited foil is brought into contact with and pressure-bonded onto a base material coated with a binder, and the metal-deposited foil is peeled off together with the protective film to obtain an electric circuit on the base material.

〔Example〕

The present invention will be explained below based on the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention.

j Since the foil 3 on which a metal such as aluminum or copper is vapor-deposited is very thin, it is pasted onto the protective film 5 with a suitable binder, and a photosensitive agent is applied thereon to form a photosensitive area. After the photosensitive area is dry, draw the desired characters, patterns, lines,
A photographic film of an electric circuit, etc. is brought into contact with the camera and exposed. Next, when the unexposed area is washed away, the exposed area remains and the electric circuit pattern 2 is formed. Even if the electrical circuit 2 is printed on the metal-deposited foil 3 by photographic method in this way,
Printing may be performed by a printing method.Next, a binder 7 is applied onto a transparent or opaque base material 1 made of epoxy resin, which is a heat-resistant material, placed on a table 6, and then printed using the photographic method or printing method described above. The electrical circuit pattern 2 formed by is brought into contact with the base material 1 and transferred by thermocompression bonding in the direction of the arrow 4. When the protective film 5 and unnecessary metal foil portions are peeled off, the electric circuit 18 and the like are formed on the base material 1.

〔Effect of the invention〕

As explained above, according to the present invention, a photograph is placed on the metal-deposited foil 3 stuck on the protective film 5.
7. , t″tF+]tF+] Printing method Air distribution wiring type 2 formation 5
・A very clear electrical wiring etc. can be obtained by a simple process of applying this onto the binder applied on the base material 1 and transferring it onto the base material 1 by heat-pressing it through a protective film. You can get the effect that you can. Further, it is possible to solve the problem of pollution such as the treatment of high waves by the W&corrosion method of harmful metals such as copper.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a diagram showing the state in which the retained plate is peeled off after hot pressing, and FIG. 3 is a plan view of printed wiring obtained by the method of the present invention. FIG. 4 is an explanatory diagram of the conventional photographic etching method. 1... Base 2... Electric circuit section 3... Metal evaporated foil top 5... Protective film 6... One unit 7... ...Metal plate, 8a, 8b...Resist film Fig. 3 Fig. 4 a

Claims (1)

[Claims] A metal vapor-deposited foil is pasted on the protective film, an electric circuit pattern etc. is formed on the metal vapor-deposited foil by a photographic method or a printing method, and a separate base material coated with a binder is placed on a table. An electric circuit transfer method characterized in that after the electric circuit pattern or the like is brought into contact and pressure-bonded, the metal vapor-deposited foil is peeled off together with the protective film.