JPS618992A - Moistureproof electronic circuit wiring board - Google Patents
Moistureproof electronic circuit wiring boardInfo
- Publication number
- JPS618992A JPS618992A JP59130306A JP13030684A JPS618992A JP S618992 A JPS618992 A JP S618992A JP 59130306 A JP59130306 A JP 59130306A JP 13030684 A JP13030684 A JP 13030684A JP S618992 A JPS618992 A JP S618992A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- wiring board
- electronic circuit
- circuit wiring
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は湿度による電子回路配線板の信頼性の低下を防
止した防湿電子回路配線板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a moisture-proof electronic circuit wiring board that prevents deterioration in reliability of the electronic circuit wiring board due to humidity.
従来例の構成とその問題点
洗濯機、冷蔵庫、衣類および食器乾燥機などの電子化に
伴ない、高湿度の雰囲気下で使用されるこれらの家庭機
器の電子回路配線板（以下基板と称する）には高度な防
湿性が要求されている。この要求に対し基板をポリウレ
タン系樹脂やポリアクリル系樹脂で被覆して防湿されて
いるのが現状である。しかしながらポリウレタン系樹脂
は塗膜性が劣シ、細かい部分での被覆が十分でないとい
う問題点を有し、またポリアクリル系樹脂は塗膜が硬い
上密着性に劣るため、クラックを生ずるという問題点が
あり、いずれも十分な信頼性を有しているとはいえなか
った。Conventional configurations and their problems With the electronicization of washing machines, refrigerators, clothing, tableware dryers, etc., electronic circuit wiring boards (hereinafter referred to as substrates) for these household appliances that are used in high humidity environments have become necessary. requires a high degree of moisture resistance. In response to this demand, the current situation is to coat the substrate with polyurethane resin or polyacrylic resin to make it moisture-proof. However, polyurethane resins have the problem of poor coating properties and insufficient coverage of small areas, and polyacrylic resins have hard coatings and poor adhesion, resulting in cracks. However, none of them could be said to have sufficient reliability.
したがって、塗膜で基板の防湿を行なうためには、例え
ば、エポキシ系樹脂−ボリプタジエン系樹脂−ポリウレ
タン系樹脂、ボリウレｊ ン系樹脂−ポリプタジエン系
樹脂、エポキシ系樹脂−ポリウレタン系樹脂、エポキシ
系樹脂−ポリブタジェン系樹脂など、複数の樹脂の塗膜
により防湿している。複数層の塗膜を形成させるために
は、１回１回硬化させねばならず、このため装置も大き
くなり、コストも高いものとなっている。Therefore, in order to moisture-proof a substrate with a coating film, for example, epoxy resin-polyptadiene resin-polyurethane resin, polyurethane resin-polyptadiene resin, epoxy resin-polyurethane resin, epoxy resin- It is moisture-proofed by a coating of multiple resins, including polybutadiene resin. In order to form a multi-layered coating film, the coating must be cured one time at a time, which increases the size and cost of the equipment.
これに対し電子部品の埋込みなどに用いられている注型
（ポツティングということもある）は、信頼性も高ぐ防
湿には好ましい方法である。しかし、注型は完全に基板
の回路形成面等を覆ってしまうため、製品となった後の
部品の取替などのサービス性に劣るため、あまり用いら
れていない。On the other hand, casting (sometimes called potting), which is used for embedding electronic components, is highly reliable and is a preferred method for moisture proofing. However, since casting completely covers the circuit-forming surface of the board, serviceability such as parts replacement after the product is manufactured is inferior, so it is not widely used.
発明の目的
本発明は上記従来の欠点をなくし、防湿性に優れた信頼
性の高い基板を提供するものである。OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned conventional drawbacks and provides a highly reliable substrate with excellent moisture resistance.
発明の構成
本発明は、高度の防湿性を備えるために、防湿性に最も
富むポリブタジェン系樹脂で基板を被覆したものであり
、被覆方法としては注型を採用し更にサービス性の向上
のために、前記ポリブタジェン系樹脂を引裂抵抗値の低
いものとしたものである。また、引裂抵抗値の低いポリ
ブタジェン系樹脂を用いるため、組立時にぶつけられた
り、強い衝撃では裂けるが、これを防ぐために、外装容
器中に収納したものである。Structure of the Invention The present invention covers a substrate with polybutadiene resin, which has the highest moisture resistance, in order to provide a high degree of moisture resistance.Casing is used as the coating method, and furthermore, in order to improve serviceability. , the polybutadiene resin has a low tear resistance value. In addition, since polybutadiene-based resin with low tear resistance is used, it is likely to be hit during assembly or torn due to strong impact, but to prevent this, it is housed in an outer container.
この様にすれば、汎用樹脂中では最も防湿性に富むポリ
ブタジェン系樹脂に完全に覆われた基板になり高度の防
湿性を有する。更にサービス性については、外装容器か
らポリブタジェン系樹脂に覆われた基板をはずし、引裂
抵抗値の低いポリブタジェン系樹脂であることから、取
替部分をナイフ等で切裂き、部品の交換が可能である。In this way, the substrate is completely covered with polybutadiene resin, which has the highest moisture resistance among general-purpose resins, and has a high degree of moisture resistance. Furthermore, regarding serviceability, parts can be replaced by removing the board covered with polybutadiene resin from the outer container and cutting the replacement part with a knife, etc., since the polybutadiene resin has low tear resistance. .
また、ポリブタジェン系樹脂は常温あるいはドライヤー
で温める程度の熱で硬化するタイプのものもあり、その
場で切裂いた部分の修復も可能である。これをもとの外
装樹脂中に収納するというサービス性に冨んだものであ
る。Additionally, there are types of polybutadiene resins that harden at room temperature or with heat such as heating with a hair dryer, making it possible to repair torn areas on the spot. It is highly serviceable as it is housed inside the original exterior resin.
実施例の説明 本発明の防湿基板の構成を断面図をもって説明する。Description of examples The structure of the moisture-proof substrate of the present invention will be explained with reference to a cross-sectional view.
外装容器１中にポリブタジェン系樹脂２で注型された電
子部品３，４を装着した基板５が収納されている。６は
外装容器１中の防湿基板５の押え蓋である。７は半田で
ある。A substrate 5 on which electronic components 3 and 4 cast with polybutadiene resin 2 are mounted is housed in an outer container 1. Reference numeral 6 denotes a lid holding down the moisture-proof substrate 5 in the outer container 1. 7 is solder.
上記の構成において、まず、防湿基板５金外装
゛１容器１中に入れ、蓋６で固定する。この状態
で製品として組込まれる。したがって、引裂抵抗値の低
いポリブタジェン系樹脂２を注型材としても外装容器１
で保護され、組立時の衝撃などにより裂けたシすること
はない。この状態で例えば、電子部品４が不良となシ取
替えたいとすると、まず蓋６′ｔ−はずし防湿基板６を
取出す。次に電子部品４の足につけられている半田７を
覆っている部分のポリブタジェン系樹脂４１Ｌ’（ｚナ
イフ等で切取る。In the above configuration, first, the moisture-proof substrate 5 gold exterior
゛1 Place in container 1 and secure with lid 6. In this state, it is incorporated into a product. Therefore, even if the polybutadiene resin 2 with low tear resistance value is used as the casting material, the outer container 1
It is protected against damage caused by shock during assembly. In this state, for example, if the electronic component 4 is defective and you want to replace it, first remove the lid 6't- and take out the moisture-proof board 6. Next, the portion of the polybutadiene resin 41L' covering the solder 7 attached to the legs of the electronic component 4 is cut off with a z knife or the like.
そして半田７をはずし電子部品４を引抜く。この際にポ
リブタジェン系樹脂２の引裂抵抗値の低さが有用となる
。次に替りの電子部品を差込み新たに半田付をした後、
修復用のポリブタジェン系樹脂を先程切取ったポリブタ
ジェン系樹脂４ａの部分に流し込み硬化させる。これを
外装容器１に入れ蓋６により防湿基板５を固定する。Then, the solder 7 is removed and the electronic component 4 is pulled out. In this case, the low tear resistance value of the polybutadiene resin 2 is useful. Next, after inserting the replacement electronic parts and soldering them again,
A polybutadiene resin for repair is poured into the polybutadiene resin 4a that was cut out earlier and is hardened. This is placed in an outer container 1 and the moisture-proof substrate 5 is fixed with a lid 6.
なお、外装容器１は単なる防湿基板６の収納だけを目的
とせず、ビス穴等を設けて、その使用機器の取付用とす
ることも可能である。Note that the outer container 1 is not intended only to simply store the moisture-proof substrate 6, but may also be provided with screw holes or the like for attachment of equipment to be used.
また、今回の実施例に用いた引裂抵抗値の低いポリブタ
ジェン系樹脂としては、倉敷紡績（株）製のＭＮｌｌｏ
を用いたが、透明性と防湿性および引裂抵抗値の低さが
目的にかなうものであれば、とくにポリブタジェン系樹
脂にこだわらなくてもよい。ただし、防湿性と基板５か
らのはがしやすさ、コストなどの観点からすれば、ポリ
ブタジェン系樹脂が最も好ましい。In addition, the polybutadiene resin with low tear resistance used in this example was MNllo manufactured by Kurashiki Boseki Co., Ltd.
However, as long as transparency, moisture resistance, and low tear resistance value meet the purpose, there is no need to be particular about the polybutadiene resin. However, from the viewpoint of moisture resistance, ease of peeling from the substrate 5, cost, etc., polybutadiene resin is most preferable.
発明の効果
上記実施例からあきらかなように、本発明の防湿基板は
、最も防湿性の高い引裂抵抗値の低いポリブタジェン系
樹脂に被覆されたものであり、高度の防湿性とサービス
性の良さを兼備したものである。更に外装容器中に収納
したことによシ組立時の衝撃等にも強くなった。Effects of the Invention As is clear from the above examples, the moisture-proof substrate of the present invention is coated with polybutadiene-based resin, which has the highest moisture-proofing property and a low tear resistance value, and has a high degree of moisture-proofing and good serviceability. It has both. Furthermore, by storing it in an outer container, it is resistant to shocks during assembly.
したがって高湿度下で使用される家庭電化機器の電子化
に大きく役立つものである。Therefore, it will be of great help in the electronicization of home appliances used under high humidity conditions.
図は本発明の実施例の防湿基板を示す断面図である。
１・・・・・・外装容器、２・・・・・・ポリブタジェ
ン系樹脂、３．４・・・・・・電子部品、５・・・・・
・基板。The figure is a sectional view showing a moisture-proof substrate according to an embodiment of the present invention. 1...Outer container, 2...Polybutadiene resin, 3.4...Electronic components, 5...
·substrate.
Claims (2)
品配設面を引裂抵抗値の低いポリブタジエン系樹脂で被
覆されてなる防湿電子回路配線板。(1) A moisture-proof electronic circuit wiring board in which at least the circuit forming surface and the component mounting surface of the electronic circuit wiring board are coated with a polybutadiene resin having a low tear resistance value.
配線板を外装容器内に収納せしめてなる特許請求の範囲
第１項記載の防湿電子回路配線板。 （２）ポリブタジエン系樹脂で被覆された防湿電子回路
配線板の被覆方法が注型法である特許請求の範囲第１項
または第２項記載の防湿電子回路配線板。(2) A moisture-proof electronic circuit wiring board according to claim 1, which comprises a moisture-proof electronic circuit wiring board coated with a polybutadiene resin and housed in an outer container. (2) A moisture-proof electronic circuit wiring board according to claim 1 or 2, wherein the coating method for the moisture-proof electronic circuit wiring board coated with a polybutadiene resin is a casting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59130306A JPS618992A (en) | 1984-06-25 | 1984-06-25 | Moistureproof electronic circuit wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59130306A JPS618992A (en) | 1984-06-25 | 1984-06-25 | Moistureproof electronic circuit wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS618992A true JPS618992A (en) | 1986-01-16 |
Family
ID=15031165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59130306A Pending JPS618992A (en) | 1984-06-25 | 1984-06-25 | Moistureproof electronic circuit wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS618992A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62172171U (en) * | 1986-04-23 | 1987-10-31 | ||
| JPH0621281U (en) * | 1992-08-10 | 1994-03-18 | 株式会社小糸製作所 | Circuit board |
-
1984
- 1984-06-25 JP JP59130306A patent/JPS618992A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62172171U (en) * | 1986-04-23 | 1987-10-31 | ||
| JPH0621281U (en) * | 1992-08-10 | 1994-03-18 | 株式会社小糸製作所 | Circuit board |
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