JPS6286747A - High-density mounting parts - Google Patents
High-density mounting partsInfo
- Publication number
- JPS6286747A JPS6286747A JP22670185A JP22670185A JPS6286747A JP S6286747 A JPS6286747 A JP S6286747A JP 22670185 A JP22670185 A JP 22670185A JP 22670185 A JP22670185 A JP 22670185A JP S6286747 A JPS6286747 A JP S6286747A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- density mounting
- resin
- mounting parts
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はセラミック基板を使用したハイブリッドＩＣ，
ａ−Ｃ複合部品などの高密度実装部品Ｅこ関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a hybrid IC using a ceramic substrate,
Related to high-density mounting parts such as a-C composite parts.
セラミック基板を使用した高密度実装部品は、搭載部品
の耐湿性を向上させるためＦこ、フェノール系樹脂をコ
ーティングした後、ワックスを含浸させて搭載部品を保
護している。High-density mounting components using ceramic substrates are coated with phenolic resin to improve the moisture resistance of the mounted components, and then impregnated with wax to protect the mounted components.
しかし、ワックス含浸樹脂でコーティングされた高密度
実装部品は、磁気バブルメモリボード製造工程での半田
付は時の熱でワックスが溶出し、部品の耐湿性が低下す
る。また半田付は後、フラックス及び早出ボール除去の
ため、洗浄液（）Ｖオン’ｒＢｓ）＋こより全面洗浄す
ると、前記のように半田付は時の熱番こよって溶出した
ワックスにフレオンが接触し、セラミックス基板のラン
ド部及びワックス含浸樹脂に不透明物が生成し、外観不
良となる。However, when high-density mounting components coated with wax-impregnated resin are soldered during the manufacturing process of magnetic bubble memory boards, the wax melts due to the heat, reducing the moisture resistance of the components. In addition, after soldering, in order to remove flux and prematurely released balls, the entire surface is cleaned with cleaning solution (Von'rBs). Opaque substances are formed on the land portions of the ceramic substrate and the wax-impregnated resin, resulting in poor appearance.
本発明の目的は、信頼性及び商品価値の高い高密度実装
部品を提供することにある。An object of the present invention is to provide a high-density mounting component with high reliability and commercial value.
ワックス含浸樹脂の表面に更Ｅこワックス溶出防止用樹
脂をコーティングしてなる。これｌこより、半田付け、
洗浄を行なった場合、ワックス溶出及び不透明変色が防
止される。The surface of the wax-impregnated resin is further coated with a resin for preventing wax elution. From this point on, soldering,
Washing prevents wax elution and opaque discoloration.
以下、本発明の一実施例を図１こより説明する。 An embodiment of the present invention will be described below with reference to FIG.
セラミック基板１の両面にはＡｇ−Ｐｄ導体２が形成さ
れ、この導体２上ｆこは、一方の面ｌこチップ積層セラ
ミックコンデンサ３が半田４で接続され、他方の面ｌこ
印刷抵抗体５が設けられ、この印刷抵抗体５は保護ガラ
ス６で覆われている。またセラミック基板１の端部には
偏平リード７が半田８で接続されている。そして、偏平
リード７の一部を残して全体がワックス含浸樹脂９でコ
ーティングされ、セラミック基板１への搭載部品が保護
されている。前記ワックス含浸樹脂９の表面ｌこは、更
につＶタン、エポキシ、シリコン等よりなるワックス溶
出防止用樹脂１０がコーティングされている。Ag-Pd conductors 2 are formed on both sides of the ceramic substrate 1, and on this conductor 2, a chip multilayer ceramic capacitor 3 is connected with solder 4 on one side, and a printed resistor 5 is connected on the other side. The printed resistor 5 is covered with a protective glass 6. Furthermore, flat leads 7 are connected to the ends of the ceramic substrate 1 with solder 8. The entire flat lead 7, except for a part, is coated with a wax-impregnated resin 9 to protect the components mounted on the ceramic substrate 1. The surface of the wax-impregnated resin 9 is further coated with a wax elution-preventing resin 10 made of V-tan, epoxy, silicone, or the like.
このようｌこ、ワックス含浸樹脂９の表面にはワックス
溶出防止用樹脂１０がコーティングされているので、磁
気バブルメモリ装置への半田付は工程５こおいて、ワッ
クスが溶出して耐湿性が低下するのが防止される。また
洗浄によって不透明変色が生ずるのが防止される。In this way, since the surface of the wax-impregnated resin 9 is coated with the wax elution prevention resin 10, the soldering to the magnetic bubble memory device is done in step 5, and the wax elutes and the moisture resistance decreases. This will prevent you from doing so. It also prevents opaque discoloration from occurring due to washing.
以上の説明から明らかなようｌこ、本発明によれば、耐
湿性及び外観品質が向上し、製品としての信頼性及び商
品価値が向上する。As is clear from the above description, according to the present invention, the moisture resistance and appearance quality are improved, and the reliability and commercial value of the product are improved.
図は本発明の一実施例を示す断面図である。
１・・・セラミック基板、 ３・・・チップ積層セ
ラミックコンデンサ、 訃・・印刷抵抗体、７・・
・偏平リード、 ９・・・ワックス含浸樹脂、１０
・・・ワックス溶出防止用樹脂。The figure is a sectional view showing one embodiment of the present invention. 1... Ceramic substrate, 3... Chip multilayer ceramic capacitor, 2... Printed resistor, 7...
・Flat lead, 9... Wax impregnated resin, 10
...Resin for preventing wax elution.
Claims (1)
ワックス含浸樹脂をコーテイングしてなる高密度実装部
品において、前記ワックス含浸樹脂の表面にワックス溶
出防止用樹脂をコーテイングしたことを特徴とする高密
度実装部品。To protect the components mounted on the ceramic substrate,
A high-density mounting component coated with a wax-impregnated resin, characterized in that the surface of the wax-impregnated resin is coated with a resin for preventing wax elution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22670185A JPS6286747A (en) | 1985-10-14 | 1985-10-14 | High-density mounting parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22670185A JPS6286747A (en) | 1985-10-14 | 1985-10-14 | High-density mounting parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6286747A true JPS6286747A (en) | 1987-04-21 |
Family
ID=16849289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22670185A Pending JPS6286747A (en) | 1985-10-14 | 1985-10-14 | High-density mounting parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286747A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5057457A (en) * | 1989-09-13 | 1991-10-15 | Kabushiki Kaisha Toshiba | Multimold semiconductor device and the manufacturing method therefor |
-
1985
- 1985-10-14 JP JP22670185A patent/JPS6286747A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5057457A (en) * | 1989-09-13 | 1991-10-15 | Kabushiki Kaisha Toshiba | Multimold semiconductor device and the manufacturing method therefor |
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