JPS6195797A - 半田付け用フラツクス - Google Patents

半田付け用フラツクス

Info

Publication number
JPS6195797A
JPS6195797A JP21886184A JP21886184A JPS6195797A JP S6195797 A JPS6195797 A JP S6195797A JP 21886184 A JP21886184 A JP 21886184A JP 21886184 A JP21886184 A JP 21886184A JP S6195797 A JPS6195797 A JP S6195797A
Authority
JP
Japan
Prior art keywords
soldering
flux
robotization
wiring pattern
alcohol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21886184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0541356B2 (th
Inventor
Hiroyuki Iida
広之 飯田
Misae Hayashi
美佐江 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP21886184A priority Critical patent/JPS6195797A/ja
Publication of JPS6195797A publication Critical patent/JPS6195797A/ja
Publication of JPH0541356B2 publication Critical patent/JPH0541356B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP21886184A 1984-10-18 1984-10-18 半田付け用フラツクス Granted JPS6195797A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21886184A JPS6195797A (ja) 1984-10-18 1984-10-18 半田付け用フラツクス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21886184A JPS6195797A (ja) 1984-10-18 1984-10-18 半田付け用フラツクス

Publications (2)

Publication Number Publication Date
JPS6195797A true JPS6195797A (ja) 1986-05-14
JPH0541356B2 JPH0541356B2 (th) 1993-06-23

Family

ID=16726465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21886184A Granted JPS6195797A (ja) 1984-10-18 1984-10-18 半田付け用フラツクス

Country Status (1)

Country Link
JP (1) JPS6195797A (th)

Also Published As

Publication number Publication date
JPH0541356B2 (th) 1993-06-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees