JPS6199687A - Manufacture of electrocast electrode - Google Patents
Manufacture of electrocast electrodeInfo
- Publication number
- JPS6199687A JPS6199687A JP22004184A JP22004184A JPS6199687A JP S6199687 A JPS6199687 A JP S6199687A JP 22004184 A JP22004184 A JP 22004184A JP 22004184 A JP22004184 A JP 22004184A JP S6199687 A JPS6199687 A JP S6199687A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- reinforcing frame
- electrode plate
- resin
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は放電加工等に用いられる電鋳電極の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of manufacturing an electroformed electrode used in electrical discharge machining and the like.
(従来の技術)
従来使用されている電鋳電極としては、例えば第2図(
a)に示すようなものがある。この電鋳電極lは次のよ
うにして製造される。すなわち、第2図(blに示すよ
うな、図示しない前工程において母型2の型面にメッキ
された1143uの電極板3の上に、接着用樹脂を1〜
2IiI11の厚さに塗布し、その上にガラスクロスお
よび布等を貼付し、更にその上に樹脂を2〜:3mm+
の厚さに塗布する。そして、その上に更に前記ガラスク
ロスおよび布等と樹脂とを交互に5〜6眉ずつ積層し、
全体の厚さが10〜15mn+程度の第2図(clに示
すような電極板補強用の積層体4を形成する。(Prior art) As an electroforming electrode conventionally used, for example, the one shown in Fig. 2 (
There are some as shown in a). This electroformed electrode 1 is manufactured as follows. That is, as shown in FIG.
Apply to a thickness of 2IiI11, attach glass cloth, cloth, etc. on top of it, and then apply resin to a thickness of 2 to 3mm+.
Apply to a thickness of . Then, on top of that, the glass cloth, cloth, etc. and resin are alternately laminated by 5 to 6 layers,
A laminate 4 for reinforcing the electrode plate as shown in FIG. 2 (cl) having a total thickness of about 10 to 15 mm+ is formed.
次に、この積層体4の上に、第2図Fdlに示すような
、鉄パイプ5と鉄アングル6とを溶接して架構した補強
枠7を樹脂8で固定する(第3図参照)。その後、24
時間放置して各樹脂を完全に硬化させた後、母型2を基
準として?di強枠7に放電加工装置等に取付ける際の
取付面となる基準面9を樹脂によって形成する(第2図
fal参照)。次に、この基準面9をフライス加工等に
よって精密に仕上げた後、第3図に示すように補強枠7
を定器10に固定した上、大型の油圧ジ中ツキ11を使
用して母型2を電極板3から引き剥し、基準面樹脂層9
、補強枠7、積層体4および電極板3からなる電鋳電極
lを製造する。Next, a reinforcing frame 7 constructed by welding iron pipes 5 and iron angles 6 as shown in FIG. 2 Fdl is fixed on top of this laminate 4 with resin 8 (see FIG. 3). After that, 24
After leaving it for a while to completely cure each resin, use the mother mold 2 as a reference? A reference surface 9 is formed from resin on the di-strength frame 7 to serve as a mounting surface when it is attached to an electric discharge machining device or the like (see FIG. 2 fal). Next, after finishing this reference surface 9 precisely by milling etc., the reinforcing frame 7 is
The matrix 2 is fixed on the measuring device 10, and then the matrix 2 is peeled off from the electrode plate 3 using a large hydraulic tensioner 11, and the reference surface resin layer 9 is removed.
, an electroformed electrode 1 consisting of a reinforcing frame 7, a laminate 4, and an electrode plate 3 is manufactured.
(発明が解決しようとする問題点)
しかしながら、前述したような従来の電鋳電極にあって
は、多量の樹脂とガラスクロスおよび布等からなる厚い
積層体によって電極板を補強していたため、樹脂が硬化
歪を起して必要な精度を得難く、また、樹脂の経年変化
による歪によって精度の維持も難しいという問題点があ
った。更に、母型から電極板を剥離する際には、大型の
ジヤツキを使用して大きな力を加えなければ剥離するこ
とができないが、補強枠が鉄パイプと鉄アングルとを溶
接して架構したものであるため、そのような大きな負荷
に耐えきれず、補強枠から電鋳電極全体にまで歪が及ぶ
という問題点もあった。(Problems to be Solved by the Invention) However, in the conventional electroformed electrode as described above, the electrode plate was reinforced with a thick laminate made of a large amount of resin, glass cloth, cloth, etc. However, there were problems in that it was difficult to obtain the required accuracy due to curing distortion, and it was also difficult to maintain accuracy due to distortion due to aging of the resin. Furthermore, when peeling the electrode plate from the matrix, it cannot be peeled off unless a large jack is used and a large force is applied. Therefore, there was a problem in that the reinforcing frame could not withstand such a large load, and strain spread from the reinforcing frame to the entire electroformed electrode.
(問題点を解決するための手段)
この発明は、このような従来の問題点に着目してなされ
たもので、母型の型面に銅メンキして電極板を形成する
工程と、電極板を取付ける面に近似した形状の補強枠を
フルモールド鋳造により成形する工程と、母型の電極板
と補強枠の電極板取付面とを接着剤の薄い層を介して接
着する工程と、補強枠に基準面を加工する工程と、互い
に接着した補強枠と電極板とから母型を剥離する工程と
、を有する電鋳電極の製造方法を提供することにより、
上記問題点を解決しようとするものである。(Means for Solving the Problems) This invention was made by focusing on such conventional problems, and includes a step of forming an electrode plate by coating the mold surface of a matrix with copper, and A process of forming a reinforcing frame with a shape similar to the surface on which the reinforcing frame is mounted by full mold casting, a process of bonding the electrode plate of the matrix and the electrode plate mounting surface of the reinforcing frame through a thin layer of adhesive, and By providing a method for manufacturing an electroformed electrode, the method includes the steps of processing a reference surface, and peeling off a matrix from a reinforcing frame and an electrode plate that are bonded to each other.
This is an attempt to solve the above problems.
(実施例) 以下、この発明を図面に基づいて説明する。(Example) The present invention will be explained below based on the drawings.
第1図(a)〜U)は、この発明の方法の一実施態様を
示す図である。FIGS. 1(a)-U) are diagrams showing one embodiment of the method of the present invention.
まず、Ta1図に示すような母型22の型面に銅メッキ
した電極板詔を形成する。また、(b)、fC1図に示
すような電極板邪の補強枠の分割模型24a、24 b
を発泡スチロールで製造する。次に、fd1図に示すよ
うに、電極板詔の上に木綿布等25を貼り、これにシン
ナー等の溶剤26を十分に含浸させる。そして、前記発
泡スチロール製の7ホ強枠模型24 bを、(a1図に
示すように、木綿布等25の上から電極板23に5分間
程度押圧する。この電極板23への補強枠模型24 b
の押圧作業を、木綿布等25へ溶剤26を補給しながら
3〜4回繰り返すと、補強枠模型24 bの木綿布等2
5に接触している面は、溶剤26によって熔解され表面
が粗くなるとともに電極板四の表面形状に近似した形状
となる。次に、この発泡スチロール製の模型24 a
、 24 bを用いてフルモールドアルミ鋳造法により
、+f1図に示すような一体成形のアルミ補強枠27を
成形する。この補強枠27の電極板取付面、すなわち前
記模型24 bの溶剤によって溶解された面に対応する
面27a、は模型24 bの面形状が転写されて面粗度
が大きくなっている。First, a copper-plated electrode plate is formed on the mold surface of the master die 22 as shown in Figure Ta1. In addition, divided models 24a and 24b of the reinforcing frame of the electrode plate as shown in FIG.
is manufactured from Styrofoam. Next, as shown in Figure FD1, a cotton cloth 25 is pasted on the electrode plate, and is sufficiently impregnated with a solvent 26 such as thinner. Then, the 7-hole strong frame model 24 b made of expanded polystyrene is pressed against the electrode plate 23 from above the cotton cloth 25 for about 5 minutes (as shown in Figure a1). b
By repeating the pressing operation 3 to 4 times while replenishing the solvent 26 to the cotton cloth etc. 25, the cotton cloth etc. 2 of the reinforcing frame model 24b is
The surface in contact with the electrode plate 4 is melted by the solvent 26 and becomes rough, and has a shape similar to the surface shape of the electrode plate 4. Next, this Styrofoam model 24 a
, 24b is used to form an integrally molded aluminum reinforcing frame 27 as shown in Figure +f1 by a full mold aluminum casting method. The electrode plate attachment surface of the reinforcing frame 27, ie, the surface 27a corresponding to the surface of the model 24b that has been dissolved by the solvent, has a large surface roughness due to the transfer of the surface shape of the model 24b.
次に、(g1図に示すように、電極板23上に接着用樹
脂28を1〜2mm程度の厚さで均一に塗布し、そこに
補強枠27をその電極板取付面27aが電極板23の樹
脂塗布面に当接するようにして押圧する。その結果、前
記接着用樹脂28は余剰分が(h1図に示すように電極
板23と補強枠27との間から押し出されて、最大でも
1mm程度の厚さの極めて薄い眉となる。そこで、押し
出された余剰分の樹脂を除去した後、約24時間放デし
て樹脂28を完全に硬化させる。その際、樹脂28は前
述したように極めて少量であるため、硬化歪は無視し得
る程度しか生じない。樹脂28が完全に硬化した後、母
型22を基準としてtJ1図に示すように補強枠27に
フライス加工により基準面29を形成する。次に、従来
と同様に大型のジヤツキを使用して母型nを電極板23
から引き剥すことにより、薄い樹脂層を介して接着され
た電極板23と補強枠rとからなる、+11図に示すよ
うな、Ti鋳電極21が完成する。なお、母型22を電
極板詔から引き剥す際電鋳電極21には大きな負荷がか
かるが、補強枠27が一体成形されたアルミ鋳造品で高
い強度を有している上に、?lli強枠27の電極板取
付面27 aの面粗度が大きく、補強枠27と電極板詔
とが樹脂28を介して強固に接着されているため、電鋳
電極21にm度が狂う程の歪が生じることはない。更に
、1H脂28の母が少ないため、経年変化による歪も無
視し得る程度のもので、電鋳電極21の精度に影−はな
い。Next, as shown in Figure g1, adhesive resin 28 is uniformly applied on the electrode plate 23 to a thickness of about 1 to 2 mm, and the reinforcing frame 27 is attached so that the electrode plate mounting surface 27a is attached to the electrode plate 23. As a result, the excess adhesive resin 28 is pushed out from between the electrode plate 23 and the reinforcing frame 27 as shown in Figure h1, and the adhesive resin 28 is pushed out by at most 1 mm. Therefore, after removing the extruded excess resin, the resin 28 is left to completely harden for about 24 hours.At that time, the resin 28 is cured as described above. Since the amount is extremely small, the curing strain is negligible.After the resin 28 is completely cured, a reference surface 29 is formed on the reinforcing frame 27 by milling using the matrix 22 as a reference as shown in Figure tJ1. Next, as in the conventional case, use a large jack to attach the matrix n to the electrode plate 23.
By peeling it off, a Ti cast electrode 21 is completed, as shown in Figure 11, which consists of an electrode plate 23 and a reinforcing frame r bonded together via a thin resin layer. Although a large load is applied to the electroformed electrode 21 when the matrix 22 is peeled off from the electrode plate, the reinforcing frame 27 is an integrally formed aluminum cast product and has high strength. The surface roughness of the electrode plate mounting surface 27a of the strong frame 27 is large, and the reinforcing frame 27 and the electrode plate ridge are firmly bonded via the resin 28, so that the electroformed electrode 21 is slightly out of alignment. No distortion occurs. Furthermore, since there is little 1H fat 28, distortion due to aging is negligible, and there is no effect on the accuracy of the electroformed electrode 21.
第4図には他、の実施態様を示す。FIG. 4 shows another embodiment.
例えば第5図に示すような、電極板おが略円錐形状にな
っている電鋳電極31は、電極板33と補強枠羽とを接
着する際に、余剰分の樹脂を電極板33と補強枠37と
の間から押し出し難いという問題点がある。そのため、
第4図に示すように、補強枠37の電極板取付面の適宜
位置に樹脂抜き用の孔36を設け、補強枠ごと電極Fi
33とをクランプ装置39を用いて圧接することにより
、余剰な樹脂38aを孔36を介して十分に除去するこ
とができるようにしたものである。他の工程゛は前記第
2図の実施態様と同様である。For example, in an electroformed electrode 31 whose electrode plate has a substantially conical shape as shown in FIG. There is a problem in that it is difficult to push out from between the frame 37. Therefore,
As shown in FIG. 4, holes 36 for removing resin are provided at appropriate positions on the electrode plate mounting surface of the reinforcing frame 37, and the electrode plate is attached to the reinforcing frame 37.
33 using a clamping device 39, the excess resin 38a can be sufficiently removed through the hole 36. The other steps are similar to the embodiment shown in FIG. 2 above.
(発明の効果)
以上説明してきたようにこの発明によれば、母型の型面
に銅メッキして電極板を形成する工程と、電極板とを取
付ける面に近似した形状の補強枠をフルモールド鋳造に
より成形する工程と、母型の電極板と補強枠の電極板取
付面とを接着剤の薄い層を介して接着する工程と、補強
枠に基準面を加工する工程と、互いに接着した補強枠と
電極板とから母型を剥離する工程と、を有する電鋳電極
の製造方法によって、従来と比較して電鋳電極に使用す
る接着剤の量を著しく少なくし、補強枠自体の強度を著
しく高めた上に、電極板と補強枠とをより強固に接着す
ることができる。その結果、接着剤の硬化歪や経年変化
による歪は無視し得る程度のものとなり。(Effects of the Invention) As described above, according to the present invention, the step of forming an electrode plate by plating copper on the mold surface of the mother mold, and the reinforcing frame having a shape similar to the surface on which the electrode plate is attached are completely completed. A process of forming by mold casting, a process of adhering the electrode plate of the matrix and the electrode plate mounting surface of the reinforcing frame through a thin layer of adhesive, a process of processing a reference surface on the reinforcing frame, The manufacturing method for electroformed electrodes, which includes the process of peeling the matrix from the reinforcing frame and electrode plate, significantly reduces the amount of adhesive used for electroformed electrodes compared to conventional methods, and increases the strength of the reinforcing frame itself. In addition to significantly increasing the resistance, it is possible to bond the electrode plate and the reinforcing frame more firmly. As a result, the curing distortion of the adhesive and distortion due to aging becomes negligible.
母型とN極板とを引き剥す際に離型歪が生じることもな
いため、精度の高い電鋳電極を得ることができる。Since mold release strain does not occur when the mother mold and the N-electrode plate are peeled off, a highly accurate electroformed electrode can be obtained.
第1図(a)乃至U)はこの発明に係るMl電鋳電極製
造方法の一実施態様における各製造工程の説明図、第2
図(al乃至(dlは従来使用されていた電鋳電極を示
すもので、+a)は電鋳電極の全体斜視図、(blは電
極板と母型の斜視図、+C1は母型と電極板と電極板補
強用積層体の正面断面図、(d)はili強枠の斜視図
、第3図は第2図(alの電鋳電極の電極板を母型から
剥離している状態を示す説明図、第4図はこの発明に係
る電鋳電極の製造方法の他の実施態様を示す母型の電極
板と補強枠の断面説明図、第5図は第4図の実施態様で
製造するのに適した形状の電鋳電極の斜視図である。
21.31−・・・・・電鋳電極、
22・・−・・−母型、
詔、お・−・・−・電極板、
釘、37・・・−・−補強枠、
27 a −−一・−補強枠の電極板取付面、2B −
−−一接着剤(樹脂)、
29・・・・基準面。1(a) to U) are explanatory diagrams of each manufacturing process in an embodiment of the Ml electroformed electrode manufacturing method according to the present invention, and FIG.
Figures (al to (dl) indicate conventionally used electroformed electrodes, +a) is an overall perspective view of the electroformed electrode, (bl is a perspective view of the electrode plate and matrix, +C1 is the matrix and electrode plate) 3 is a front sectional view of the electrode plate reinforcing laminate, (d) is a perspective view of the ili strong frame, and FIG. 3 is a state in which the electrode plate of the electroformed electrode shown in FIG. An explanatory diagram, FIG. 4 is a cross-sectional explanatory diagram of a matrix electrode plate and a reinforcing frame showing another embodiment of the method for manufacturing an electroformed electrode according to the present invention, and FIG. It is a perspective view of an electroformed electrode having a shape suitable for 21.31--electroformed electrode, 22--matrix, edict, o--...-electrode plate, Nail, 37...--Reinforcement frame, 27 a--1.-Electrode plate mounting surface of reinforcement frame, 2B-
--1 Adhesive (resin), 29...Reference surface.
Claims (1)
をフルモールド鋳造により成形する工程と、母型の電極
板と補強枠の電極板取付面とを接着剤の薄い層を介して
接着する工程と、補強枠に基準面を加工する工程と、互
いに接着した補強枠と電極板とから母型を剥離する工程
と、を有することを特徴とする電鋳電極の製造方法。[Claims] A step of forming an electrode plate by plating the mold surface of the mother mold with copper, a step of forming a reinforcing frame having a shape similar to the surface on which the electrode plate is attached by full mold casting, and an electrode of the mother mold. A step of adhering the plate and the electrode plate mounting surface of the reinforcing frame through a thin layer of adhesive, a step of processing a reference surface on the reinforcing frame, and a step of peeling the matrix from the reinforcing frame and electrode plate that are bonded to each other. A method for manufacturing an electroformed electrode, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22004184A JPS6199687A (en) | 1984-10-18 | 1984-10-18 | Manufacture of electrocast electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22004184A JPS6199687A (en) | 1984-10-18 | 1984-10-18 | Manufacture of electrocast electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6199687A true JPS6199687A (en) | 1986-05-17 |
Family
ID=16744996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22004184A Pending JPS6199687A (en) | 1984-10-18 | 1984-10-18 | Manufacture of electrocast electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6199687A (en) |
-
1984
- 1984-10-18 JP JP22004184A patent/JPS6199687A/en active Pending
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