JPS62103253U - - Google Patents

Info

Publication number
JPS62103253U
JPS62103253U JP19508485U JP19508485U JPS62103253U JP S62103253 U JPS62103253 U JP S62103253U JP 19508485 U JP19508485 U JP 19508485U JP 19508485 U JP19508485 U JP 19508485U JP S62103253 U JPS62103253 U JP S62103253U
Authority
JP
Japan
Prior art keywords
separating
duct
cutting die
suction
inner duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19508485U
Other languages
Japanese (ja)
Other versions
JPH0342687Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19508485U priority Critical patent/JPH0342687Y2/ja
Publication of JPS62103253U publication Critical patent/JPS62103253U/ja
Application granted granted Critical
Publication of JPH0342687Y2 publication Critical patent/JPH0342687Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の分離装置の説明図、第2図は
従来の分離装置の説明図、第3図はリードフレー
ムの分離すべき部分に形成した切込みを示す図で
ある。 1……切断上型、2……切断下型、3……リー
ドフレーム、4……半導体素子、5……外側のダ
クト、6……内側のダクト、7……絞り。
FIG. 1 is an explanatory diagram of a separating device of the present invention, FIG. 2 is an explanatory diagram of a conventional separating device, and FIG. 3 is a diagram showing a cut formed in a portion of a lead frame to be separated. 1... Cutting upper die, 2... Cutting lower die, 3... Lead frame, 4... Semiconductor element, 5... Outer duct, 6... Inner duct, 7... Aperture.

Claims (1)

【実用新案登録請求の範囲】 (1) 樹脂封止済みの半導体素子をリードフレー
ムから分離する装置において、 切断用上型と対応する切断用下型の周囲に結合
した外側のダクトの内部に、該下型の局所吸引用
の内側のダクトを設けて、両ダクトを共通の吸引
装置に接続すると共に、上記内側のダクトの吸引
力を強くしたことを特徴とする半導体素子の分離
装置。 (2) 上記外側のダクトが絞りを具備するように
したことを特徴とする実用新案登録請求の範囲第
1項記載の半導体素子の分離装置。
[Claims for Utility Model Registration] (1) In a device for separating a resin-sealed semiconductor element from a lead frame, inside an outer duct connected around an upper cutting die and a corresponding lower cutting die, A device for separating semiconductor elements, characterized in that an inner duct for local suction of the lower mold is provided, both ducts are connected to a common suction device, and the suction force of the inner duct is increased. (2) The device for separating semiconductor devices according to claim 1, wherein the outer duct is provided with a diaphragm.
JP19508485U 1985-12-20 1985-12-20 Expired JPH0342687Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19508485U JPH0342687Y2 (en) 1985-12-20 1985-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19508485U JPH0342687Y2 (en) 1985-12-20 1985-12-20

Publications (2)

Publication Number Publication Date
JPS62103253U true JPS62103253U (en) 1987-07-01
JPH0342687Y2 JPH0342687Y2 (en) 1991-09-06

Family

ID=31152650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19508485U Expired JPH0342687Y2 (en) 1985-12-20 1985-12-20

Country Status (1)

Country Link
JP (1) JPH0342687Y2 (en)

Also Published As

Publication number Publication date
JPH0342687Y2 (en) 1991-09-06

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