JPS62105432A - 発光体チツプの基板への封止方法 - Google Patents

発光体チツプの基板への封止方法

Info

Publication number: JPS62105432A
Authority: JP; Japan
Prior art keywords: light; substrate; chip; emitting; shaping means
Prior art date: 1985-11-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP60245931A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0413803B2 (2

Inventor

Iesato Sato

佐藤　家郷

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Meisei Electric Co Ltd

Original Assignee

Meisei Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-11-01

Filing date

1985-11-01

Publication date

1987-05-15

1985-11-01 Application filed by Meisei Electric Co Ltd filed Critical Meisei Electric Co Ltd

1985-11-01 Priority to JP60245931A priority Critical patent/JPS62105432A/ja

1987-05-15 Publication of JPS62105432A publication Critical patent/JPS62105432A/ja

1992-03-10 Publication of JPH0413803B2 publication Critical patent/JPH0413803B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 title claims abstract description 32
238000007789 sealing Methods 0.000 title claims abstract description 16
238000000034 method Methods 0.000 title claims abstract description 10
238000007493 shaping process Methods 0.000 claims abstract description 32
239000000565 sealant Substances 0.000 claims description 23
239000004065 semiconductor Substances 0.000 claims description 4
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
239000011347 resin Substances 0.000 claims description 2
229920005989 resin Polymers 0.000 claims description 2
239000010409 thin film Substances 0.000 abstract description 3
229940125898 compound 5 Drugs 0.000 abstract 4
150000001875 compounds Chemical class 0.000 abstract 1
238000010586 diagram Methods 0.000 description 5
239000008393 encapsulating agent Substances 0.000 description 5
230000000694 effects Effects 0.000 description 2
239000004925 Acrylic resin Substances 0.000 description 1
229920000178 Acrylic resin Polymers 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000009472 formulation Methods 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000005259 measurement Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
230000010355 oscillation Effects 0.000 description 1

Landscapes

Led Device Packages (AREA)
Led Devices (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

JP60245931A 1985-11-01 1985-11-01 発光体チツプの基板への封止方法 Granted JPS62105432A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP60245931A JPS62105432A (ja)	1985-11-01	1985-11-01	発光体チツプの基板への封止方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP60245931A JPS62105432A (ja)	1985-11-01	1985-11-01	発光体チツプの基板への封止方法

Publications (2)

Publication Number	Publication Date
JPS62105432A true JPS62105432A (ja)	1987-05-15
JPH0413803B2 JPH0413803B2 (2)	1992-03-10

Family

ID=17140983

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60245931A Granted JPS62105432A (ja)	1985-11-01	1985-11-01	発光体チツプの基板への封止方法

Country Status (1)

Country	Link
JP (1)	JPS62105432A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH03204944A (ja) *	1989-12-07	1991-09-06	Matsushita Electric Ind Co Ltd	半導体チップの樹脂封止装置

1985
- 1985-11-01 JP JP60245931A patent/JPS62105432A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH03204944A (ja) *	1989-12-07	1991-09-06	Matsushita Electric Ind Co Ltd	半導体チップの樹脂封止装置

Also Published As

Publication number	Publication date
JPH0413803B2 (2)	1992-03-10

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Legal Events

Date	Code	Title	Description
2004-03-09	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-03-08	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-11-01	EXPY	Cancellation because of completion of term