JPS62116554U - - Google Patents

Info

Publication number
JPS62116554U
JPS62116554U JP1986003078U JP307886U JPS62116554U JP S62116554 U JPS62116554 U JP S62116554U JP 1986003078 U JP1986003078 U JP 1986003078U JP 307886 U JP307886 U JP 307886U JP S62116554 U JPS62116554 U JP S62116554U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
circuit device
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986003078U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986003078U priority Critical patent/JPS62116554U/ja
Publication of JPS62116554U publication Critical patent/JPS62116554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986003078U 1986-01-16 1986-01-16 Pending JPS62116554U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986003078U JPS62116554U (2) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986003078U JPS62116554U (2) 1986-01-16 1986-01-16

Publications (1)

Publication Number Publication Date
JPS62116554U true JPS62116554U (2) 1987-07-24

Family

ID=30782506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986003078U Pending JPS62116554U (2) 1986-01-16 1986-01-16

Country Status (1)

Country Link
JP (1) JPS62116554U (2)

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