JPS62116800A - めつき装置 - Google Patents

めつき装置

Info

Publication number
JPS62116800A
JPS62116800A JP60254799A JP25479985A JPS62116800A JP S62116800 A JPS62116800 A JP S62116800A JP 60254799 A JP60254799 A JP 60254799A JP 25479985 A JP25479985 A JP 25479985A JP S62116800 A JPS62116800 A JP S62116800A
Authority
JP
Japan
Prior art keywords
anode
wafers
plating
treated
electrolytic cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60254799A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0568559B2 (2
Inventor
Seiichi Ichihara
誠一 市原
Keiji Miyamoto
宮本　圭二
Hiroaki Okudaira
奥平　弘明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP60254799A priority Critical patent/JPS62116800A/ja
Publication of JPS62116800A publication Critical patent/JPS62116800A/ja
Publication of JPH0568559B2 publication Critical patent/JPH0568559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP60254799A 1985-11-15 1985-11-15 めつき装置 Granted JPS62116800A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60254799A JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60254799A JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Publications (2)

Publication Number Publication Date
JPS62116800A true JPS62116800A (ja) 1987-05-28
JPH0568559B2 JPH0568559B2 (2) 1993-09-29

Family

ID=17270052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60254799A Granted JPS62116800A (ja) 1985-11-15 1985-11-15 めつき装置

Country Status (1)

Country Link
JP (1) JPS62116800A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157363A (ja) * 2022-04-14 2023-10-26 株式会社日立パワーソリューションズ めっき装置およびめっき方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55119199A (en) * 1979-03-07 1980-09-12 Ngk Insulators Ltd Surface treatment apparatus for metal, etc.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55119199A (en) * 1979-03-07 1980-09-12 Ngk Insulators Ltd Surface treatment apparatus for metal, etc.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157363A (ja) * 2022-04-14 2023-10-26 株式会社日立パワーソリューションズ めっき装置およびめっき方法

Also Published As

Publication number Publication date
JPH0568559B2 (2) 1993-09-29

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