JPS62118434U - - Google Patents

Info

Publication number
JPS62118434U
JPS62118434U JP1986004780U JP478086U JPS62118434U JP S62118434 U JPS62118434 U JP S62118434U JP 1986004780 U JP1986004780 U JP 1986004780U JP 478086 U JP478086 U JP 478086U JP S62118434 U JPS62118434 U JP S62118434U
Authority
JP
Japan
Prior art keywords
electronic component
wiring board
adhesive
terminal portion
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986004780U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986004780U priority Critical patent/JPS62118434U/ja
Publication of JPS62118434U publication Critical patent/JPS62118434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
図面はこの考案の一実施例を示したもので、第
１図は配線基板に半導体ペレツトを取付けた状態
の縦断側面図、第２図は配線基板と半導体ペレツ
トの斜視図、第３図は配線基板の半導体ペレツト
接着面に粗面処理を施している状態の配線基板の
断面図である。 １…半導体ペレツト、２…端子部、３…配線基
板、３ａ…基材、４…配線、４ａ…半導体ペレツ
ト接続端子部、５…箔接着剤、ａ…粗面、６…異
方導電性接着剤、６ａ…絶縁性接着剤、６ｂ…導
電性粒子、１０…ブラストノズル、１１…ブラス
ト粒子。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 一面に端子部を有する電子部品を、この電
    子部品の端子部と対応する部品接続端子部が形成
    された配線基板に両方の端子部を対向させて接着
    剤により接着接合する電子部品の接合構造におい
    て、前記配線基板の電子部品接着面を粗面とした
    ことを特徴とする電子部品の接合構造。 (2) 配線基板面の部品接続端子部は、基板面に
    箔接着剤によりラミネートした導電金属箔をエツ
    チングして形成されたものであり、配線基板の電
    子部品接着面は、前記導電金属箔をエツチング除
    去した部分に残つた前記箔接着剤をサンドブラス
    トにより除去すると同時に粗面化されたものであ
    ることを特徴とする実用新案登録請求の範囲第１
    項記載の電子部品の接合構造。 (3) 配線基板の電子部品接着面は、部品接続端
    子部の上面を含んで粗面化されていることを特徴
    とする実用新案登録請求の範囲第１項記載の電子
    部品の接合構造。 (4) 接着剤は、絶縁性接着剤中に導電性粒子を
    混入したものであることを特徴とする実用新案登
    録請求の範囲第１項ないし第３項のいずれか１つ
    に記載の電子部品の接合構造。
JP1986004780U 1986-01-17 1986-01-17 Pending JPS62118434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986004780U JPS62118434U (ja) 1986-01-17 1986-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986004780U JPS62118434U (ja) 1986-01-17 1986-01-17

Publications (1)

Publication Number Publication Date
JPS62118434U true JPS62118434U (ja) 1987-07-28

Family

ID=30785758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986004780U Pending JPS62118434U (ja) 1986-01-17 1986-01-17

Country Status (1)

Country Link
JP (1) JPS62118434U (ja)

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