JPS62126836U - - Google Patents

Info

Publication number
JPS62126836U
JPS62126836U JP1986011799U JP1179986U JPS62126836U JP S62126836 U JPS62126836 U JP S62126836U JP 1986011799 U JP1986011799 U JP 1986011799U JP 1179986 U JP1179986 U JP 1179986U JP S62126836 U JPS62126836 U JP S62126836U
Authority
JP
Japan
Prior art keywords
pellet
terminal portion
wiring board
connecting terminal
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986011799U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986011799U priority Critical patent/JPS62126836U/ja
Publication of JPS62126836U publication Critical patent/JPS62126836U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図〜第４図はこの考案の一実施例を示した
もので、第１図は配線基板と半導体ペレツトの断
面図、第２図は配線基板のペレツト接続端子部を
凹入させる方法を示すプレス装置と配線基板の断
面図、第３図は異方導電性接着剤により配線基板
に半導体ペレツトを接合した状態の断面図、第４
図は絶縁性接着剤により配線基板に半導体ペレツ
トを接合した状態の断面図である。第５図はこの
考案の他の実施例を示す配線基板と半導体ペレツ
トの断面図である。 Ａ…半導体ペレツト、ａ…端子部、１…配線基
板、１ａ…フイルム基材、２…配線、２ａ…ペレ
ツト接続端子部、２ｂ…凹入部、３…箔接着剤、
４…異方導電性接着剤、４ａ…絶縁性接着剤、４
ｂ…導電性粒子、５…絶縁性接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトの主面外周部に配列されている
    端子部と対応するペレツト接続端子部を有し、前
    記半導体ペレツトをその端子部を前記ペレツト接
    続端子部に対向させて接着接合する配線基板にお
    いて、前記ペレツト接続端子部の半導体ペレツト
    外側縁部と対応する部分を凹入させ、この凹入部
    から先端側のペレツト接続端子部を前記半導体ペ
    レツトの端子部に対する接続部としたことを特徴
    とする配線基板。
JP1986011799U 1986-01-31 1986-01-31 Pending JPS62126836U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986011799U JPS62126836U (ja) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986011799U JPS62126836U (ja) 1986-01-31 1986-01-31

Publications (1)

Publication Number Publication Date
JPS62126836U true JPS62126836U (ja) 1987-08-12

Family

ID=30799342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986011799U Pending JPS62126836U (ja) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPS62126836U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132120U (ja) * 1988-03-01 1989-09-07
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法
JP2023023434A (ja) * 2021-08-05 2023-02-16 富士電機株式会社 半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132120U (ja) * 1988-03-01 1989-09-07
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法
JP2023023434A (ja) * 2021-08-05 2023-02-16 富士電機株式会社 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPS62126836U (ja)
JPH031540U (ja)
JPS62107443U (ja)
JPS62107444U (ja)
JPS6384941U (ja)
JPS6276562U (ja)
JPS59116006U (ja) 医用シ−ト電極
JPS6117751U (ja) テ−プキヤリア半導体装置
JPS58142210U (ja) 断熱材
JPS6286011U (ja)
JPS63187330U (ja)
JPS601013U (ja) スパイラルアンテナ
JPS5892746U (ja) 半導体圧力変換器
JPS59164241U (ja) セラミツクパツケ−ジ
JPS62193757U (ja)
JPH022835U (ja)
JPS6245876U (ja)
JPS58147250U (ja) パツケ−ジ
JPS6255368U (ja)
JPS61151273U (ja)
JPS63132433U (ja)
JPS5850947U (ja) 熱記録ヘツド
JPS62120379U (ja)
JPS5842940U (ja) 混成集積回路装置