JPS62131449U - - Google Patents

Info

Publication number
JPS62131449U
JPS62131449U JP1986019667U JP1966786U JPS62131449U JP S62131449 U JPS62131449 U JP S62131449U JP 1986019667 U JP1986019667 U JP 1986019667U JP 1966786 U JP1966786 U JP 1966786U JP S62131449 U JPS62131449 U JP S62131449U
Authority
JP
Japan
Prior art keywords
island
chip
heat radiation
package
radiation hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986019667U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986019667U priority Critical patent/JPS62131449U/ja
Publication of JPS62131449U publication Critical patent/JPS62131449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986019667U 1986-02-13 1986-02-13 Pending JPS62131449U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986019667U JPS62131449U (cs) 1986-02-13 1986-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986019667U JPS62131449U (cs) 1986-02-13 1986-02-13

Publications (1)

Publication Number Publication Date
JPS62131449U true JPS62131449U (cs) 1987-08-19

Family

ID=30814471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986019667U Pending JPS62131449U (cs) 1986-02-13 1986-02-13

Country Status (1)

Country Link
JP (1) JPS62131449U (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208755A (ja) * 1983-05-12 1984-11-27 Sony Corp 半導体装置のパツケ−ジ及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208755A (ja) * 1983-05-12 1984-11-27 Sony Corp 半導体装置のパツケ−ジ及びその製造方法

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