JPS62138453U - - Google Patents

Info

Publication number
JPS62138453U
JPS62138453U JP1986026349U JP2634986U JPS62138453U JP S62138453 U JPS62138453 U JP S62138453U JP 1986026349 U JP1986026349 U JP 1986026349U JP 2634986 U JP2634986 U JP 2634986U JP S62138453 U JPS62138453 U JP S62138453U
Authority
JP
Japan
Prior art keywords
recess
heat sink
solder
plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986026349U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986026349U priority Critical patent/JPS62138453U/ja
Publication of JPS62138453U publication Critical patent/JPS62138453U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986026349U 1986-02-24 1986-02-24 Pending JPS62138453U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986026349U JPS62138453U (2) 1986-02-24 1986-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986026349U JPS62138453U (2) 1986-02-24 1986-02-24

Publications (1)

Publication Number Publication Date
JPS62138453U true JPS62138453U (2) 1987-09-01

Family

ID=30827351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986026349U Pending JPS62138453U (2) 1986-02-24 1986-02-24

Country Status (1)

Country Link
JP (1) JPS62138453U (2)

Similar Documents

Publication Publication Date Title
JPH0345653U (2)
JPH02114943U (2)
JPS60195163U (ja) 板状半田
JPS62103252U (2)
JPS6225906Y2 (2)
JPS6413146U (2)
JPS59132641U (ja) 半導体装置用基板
JPS6083249U (ja) 集積回路部品
JPS60174244U (ja) 混成集積回路
JPS6397241U (2)
JPH0233442U (2)
JPS59192850U (ja) 半導体装置
JPS59125833U (ja) 半導体装置
JPS61149354U (2)
JPS61168641U (2)
JPH044776U (2)
JPS61182036U (2)
JPS6183046U (2)
JPS6249241U (2)
JPH01140827U (2)
JPH0426547U (2)
JPH0361303U (2)
JPS6194358U (2)
JPS61182045U (2)
JPH03104721U (2)