JPS62145847A - 部分銀めつきリ−ドフレ−ムの製造方法 - Google Patents

部分銀めつきリ−ドフレ−ムの製造方法

Info

Publication number
JPS62145847A
JPS62145847A JP60287503A JP28750385A JPS62145847A JP S62145847 A JPS62145847 A JP S62145847A JP 60287503 A JP60287503 A JP 60287503A JP 28750385 A JP28750385 A JP 28750385A JP S62145847 A JPS62145847 A JP S62145847A
Authority
JP
Japan
Prior art keywords
plating
silver
lead frame
wave
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60287503A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455340B2 (2
Inventor
Satoshi Chinda
聡 珍田
Norio Okabe
則夫 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP60287503A priority Critical patent/JPS62145847A/ja
Publication of JPS62145847A publication Critical patent/JPS62145847A/ja
Publication of JPH0455340B2 publication Critical patent/JPH0455340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60287503A 1985-12-20 1985-12-20 部分銀めつきリ−ドフレ−ムの製造方法 Granted JPS62145847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60287503A JPS62145847A (ja) 1985-12-20 1985-12-20 部分銀めつきリ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60287503A JPS62145847A (ja) 1985-12-20 1985-12-20 部分銀めつきリ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS62145847A true JPS62145847A (ja) 1987-06-29
JPH0455340B2 JPH0455340B2 (2) 1992-09-03

Family

ID=17718183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60287503A Granted JPS62145847A (ja) 1985-12-20 1985-12-20 部分銀めつきリ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS62145847A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114807953A (zh) * 2022-04-20 2022-07-29 武汉大学 一种发电机空芯铜导线腐蚀产物脉冲-柔性酸洗系统及方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114807953A (zh) * 2022-04-20 2022-07-29 武汉大学 一种发电机空芯铜导线腐蚀产物脉冲-柔性酸洗系统及方法

Also Published As

Publication number Publication date
JPH0455340B2 (2) 1992-09-03

Similar Documents

Publication Publication Date Title
WO2016031482A1 (ja) リードフレーム及びその製造方法
CN106400070A (zh) 一种铁基材引线框架局部镀银的电镀方法
CN104152959B (zh) 镀膜制造方法
US4431707A (en) Plating anodized aluminum substrates
JP2014123760A5 (2)
JPS62145847A (ja) 部分銀めつきリ−ドフレ−ムの製造方法
JPS59145795A (ja) 被メツキステンレス鋼の前処理方法
US2195231A (en) Art of coating metals
JPH0553879B2 (2)
CN116426992A (zh) 半导体大功率陶瓷dpc自动电镀工艺及电镀设备
JPS6056073A (ja) セラミツク基板への部分厚付け金被覆方法
JPS5921392B2 (ja) プリント回路用銅箔の製造方法
JPS6340866B2 (2)
JPS58217693A (ja) 微小部分銀メツキ処理物及びそのメツキ方法
JPS63297590A (ja) 高速電流反転電解によるめつき方法
JPS6123790A (ja) ＮｉまたはＮｉ合金表面へのメツキ方法
TW202233899A (zh) 具備Ni電鍍皮膜之鍍敷結構體及含有該鍍敷結構體之引線框
JPH0148354B2 (2)
JPH03237750A (ja) 半導体集積回路用リードフレーム
JPS6218744A (ja) リ−ドフレ−ム
JPH0964264A (ja) リードフレームの部分めっき方法
CN109576766A (zh) 一种电泳-电沉积制备纳米TiO2增强Sn基微凸点的方法
JPS62235493A (ja) 銀メツキ方法
JPS60138090A (ja) 部分銀めつき方法
CN116463697A (zh) 一种半导体引线框架表面耐氧化耐腐蚀镀层处理工艺

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees