JPS62166629U - - Google Patents

Info

Publication number
JPS62166629U
JPS62166629U JP1986053810U JP5381086U JPS62166629U JP S62166629 U JPS62166629 U JP S62166629U JP 1986053810 U JP1986053810 U JP 1986053810U JP 5381086 U JP5381086 U JP 5381086U JP S62166629 U JPS62166629 U JP S62166629U
Authority
JP
Japan
Prior art keywords
pellet
substrate
heating jig
attachment part
substrate heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986053810U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986053810U priority Critical patent/JPS62166629U/ja
Publication of JPS62166629U publication Critical patent/JPS62166629U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図は、本考案の実施例による基板加熱治具
を用いたペレツトボンデイング時の断面図、第2
図は、本考案の実施例による基板加熱治具の平面
図、第3図aは、従来の基板加熱治具の平面図、
第3図bは従来の基板加熱治具の断面図である。 図中1は、本考案の基板加熱治具、1′は従来
の基板加熱治具、2はリードフレームのリード部
、3はリードフレームのアイランド部、4はペレ
ツト、5はコレツトである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板を加熱し金一シリコン共晶合金によりペレ
    ツトを基板のペレツト取付部に固着するペレツト
    ボンデイング装置において、基板加熱治具表面の
    ペレツト取付部位置周囲に溝を有することを特徴
    とする基板加熱治具。
JP1986053810U 1986-04-09 1986-04-09 Pending JPS62166629U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986053810U JPS62166629U (ja) 1986-04-09 1986-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986053810U JPS62166629U (ja) 1986-04-09 1986-04-09

Publications (1)

Publication Number Publication Date
JPS62166629U true JPS62166629U (ja) 1987-10-22

Family

ID=30880215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986053810U Pending JPS62166629U (ja) 1986-04-09 1986-04-09

Country Status (1)

Country Link
JP (1) JPS62166629U (ja)

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