JPS6183041U - - Google Patents

Info

Publication number
JPS6183041U
JPS6183041U JP1984168804U JP16880484U JPS6183041U JP S6183041 U JPS6183041 U JP S6183041U JP 1984168804 U JP1984168804 U JP 1984168804U JP 16880484 U JP16880484 U JP 16880484U JP S6183041 U JPS6183041 U JP S6183041U
Authority
JP
Japan
Prior art keywords
semiconductor element
sandwiched
joined
base material
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984168804U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984168804U priority Critical patent/JPS6183041U/ja
Publication of JPS6183041U publication Critical patent/JPS6183041U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/381Auxiliary members

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図は従来の半導体素子とダイ・アタツチ部
を示した図、第2図は本考案の一実施例を示した
ものでチツプをはさんで接合したことを示す図、
第3図は第1図にクラツクの状態を加えた図、第
4図は第2図にクラツクの状態を加えた図である
。 尚、図において、1……ダイ・アタツチ部、2
……半導体素子、3……ろう材、4……ダミーチ
ツプ、5……クラツク。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と該半導体素子が接合される部分と
    の間に該半導体素子と同様の基材で作られたチツ
    プをはさんで接合させたことを特徴とする半導体
    装置。
JP1984168804U 1984-11-07 1984-11-07 Pending JPS6183041U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984168804U JPS6183041U (ja) 1984-11-07 1984-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984168804U JPS6183041U (ja) 1984-11-07 1984-11-07

Publications (1)

Publication Number Publication Date
JPS6183041U true JPS6183041U (ja) 1986-06-02

Family

ID=30726567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984168804U Pending JPS6183041U (ja) 1984-11-07 1984-11-07

Country Status (1)

Country Link
JP (1) JPS6183041U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420727U (ja) * 1987-07-27 1989-02-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420727U (ja) * 1987-07-27 1989-02-01

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