JPS6218089A - Electronic component positioning mechanism for slope sectionof electronic component inserter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Table of contents] - Overview - Field of industrial application (Figure 7) - Prior art - Problems to be solved by the invention - Means, action, and implementation for solving the problems Example (Figures 1.2, 3, 4, 5.6) Effects of the invention [Summary] An electronic component with a lead (10) is installed in the middle part of the inclined guide rail (31) that constitutes the inclined part (30). Intermittent feed mechanism (3
5) and a positioning mechanism (36) at the lower end, it is possible to reliably and accurately position the electronic components (10) individually with a simple structure.

[Industrial application field]

The present invention relates to an electronic component insertion device for inserting a large number of the same type of IC onto a printed circuit board in order to perform heating tests on leaded electronic components such as ICs (integrated circuit components), and in particular, to an electronic component insertion device for inserting a large number of the same type of IC onto a printed board. This invention relates to a mechanism for positioning electronic components on a slope that slides downward by its own weight.

For example, an IC as an example of an electronic component with leads is the seventh
It has a lead 11 as shown by the reference numeral 10 in the figure, and is formed with the ambient temperature set to a maximum of 60 to 70°C as its function guarantee temperature, but of course there is a certain degree of safety in practice at this temperature. It is formed with a certain rate (margin). However, among a large number of ICs, there may be a mixture of defective products or near-defective products with some kind of defect or low authenticity. Therefore, before an IC is actually mounted on a printed board, it is often subjected to a high temperature heating test (commonly known as a burn-in test) in order to reliably confirm the quality of the IC.

This high-temperature heating test is conducted under adverse conditions by housing a large number of ICs of the same type in a constant temperature chamber. That is,
A large number of ICs (for example, 100 ICs) are inserted directly or through sockets onto a test printed board, and the printed boards are housed in multiple stages (for example, 10 ICs) in a box-shaped shelf. Then, these shelves (usually multiple shelves) are stacked and housed in a thermostatic oven, and the connectors of each printed board are fitted and connected to the connectors provided in the thermostatic oven, and then the temperature inside the thermostatic oven is adjusted to a predetermined level. The temperature is raised to a high temperature (e.g. 120°C), and each IC is applied with a voltage equivalent to that during actual use (e.g. 50°C).
A high temperature heating test is performed by applying V) to cause the IC itself to generate heat and maintaining this state for a predetermined period of time (for example, 72 hours or 48 hours). As a result of this high-temperature heating test, ICs with some defects are broken or damaged and become defective products. After this heating test, each IC is functionally tested by a tester to determine whether it is good or bad, and only good products are mounted on the printed board.

C. Prior Art] Conventionally, when conducting high-temperature heating tests on a large number of leaded electronic components such as ICs of the same type, in most cases workers wear a grounding band to connect the ground. bird,
ICs were manually inserted one by one directly into the test printed board or into a large number of sockets mounted on the printed board.

[Problem that the invention seeks to solve]

In the above conventional technology, one IC is mounted on the test printed board.
Since the insertion is performed manually one by one, a lot of time is required for insertion, and there is a problem that efficiency is very low.

The present invention was created in view of these problems, and has a simple structure that reliably feeds electronic components with leads one by one from an inclined section and accurately positions them on the inclined surface at the lower end of the inclined section. An object of the present invention is to provide an electronic component positioning mechanism in an inclined portion of an electronic component insertion device that can contribute to smooth automatic insertion of electronic components.

[Means for solving problems]

In order to solve the above problems, in the present invention, the stick stock part 20 of the stick 22 that accommodates the same type of leaded electronic component 10 is arranged in communication with the stock part 20, and the electronic component 10 is slid downwardly. Slope part 30 of
and a hand portion 4 disposed adjacent to the lower side of the inclined portion 30.
0, the inclined part 30 is inclined at a predetermined inclination angle, and its upper end communicates with the stick stock part 20, and its lower end is a guide disposed adjacent to the hand part 40. rail 31
and an electronic component intermittent feeding mechanism 3 in the middle part of the guide rail 31.
5, and an electronic component positioning mechanism 3 is provided at the lower end of the guide rail 31.
Provided is an electronic component positioning mechanism in an inclined portion of an electronic component insertion device, characterized in that an electronic component insertion device is provided with an electronic component positioning mechanism.

[Function] The electronic components with leads (10) that are continuously fed out from the Tesic stock section 20 to the guide rail 31 can be reliably fed out one by one by the intermittent feeding mechanism 35, and the electronic components that have been sent out can be fed out one by one. The positioning mechanism 36 allows accurate positioning on the sloped surface of the upper end of the guide rail 31.

〔Example〕

1 to 6 are diagrams for explaining an embodiment of the present invention. FIG. 1 is a side view of the embodiment of the present invention, FIG. 2 is an explanatory diagram of the operation of the embodiment of the present invention, and FIG. A schematic side view of an electronic component insertion device equipped with an embodiment of the present invention, FIG. 4 is an external perspective view of the electronic component insertion device of FIG. 3, and FIG. 5 is a printed board for testing (
15), the plan view of FIG. 6 shows I as an electronic component with leads.
It is a figure which shows the side view (a) and end view (b) of the stick (22) for accommodating C (10). In addition, when looking at Figure 1, the left hand side is the rear side of the device and each part, the right hand side is the front side, and when looking from the front side to the rear side, the left hand side is the left side (corresponding to the front side in the figure), and the right hand side. will be referred to as the right side, and the same applies to other drawings.

First, the overall structure and operation of this insertion device will be briefly explained with reference to FIGS. 3-4. This device basically consists of a stick stock section 20 provided at the rear of the device, an inclined section 30 for feeding an IC (electronic component) provided at the front side of this stock section 20, and this inclined section 30. A hand part 40 provided on the lower end side (front side), and an XY table part 5 provided from the lower part of this hand part 40 to the front side.
0, an elevator section 60 provided on the front side of this XY table section 50, and a printed board operating section 70 provided on the front side of this elevator section 60.

The stick stock section 2o includes a plurality of (four in this example) stick cassettes 21 arranged in parallel at a predetermined angle α (α=35° in this example) toward the front end side or downwardly.
The cassette 21 includes a plurality of sticks 22 (for example, 10 sticks) that are stacked and stored in the cassette 21.

As shown in FIG. 6, the stick 22 is made of transparent plastic and has an inverted hollow cross section and a long length (for example,
300 to 600 mm), and ICl0
A plurality of pieces (for example, about 20 to 30 pieces) are housed in series. In addition, in Fig. 3.4, the reference numeral 211 indicates the cassette 2.
The stick front end holder provided on the lower surface of 1 and movable in the front-rear direction is a member; 212 is the stick rear end holder; 21
3 is an opening provided between members 211 and 212 for allowing the empty stick 22 to pass through and fall; 214 is a gate opening/closing plate that is provided at the lower part of the front end surface of the cassette 21 and is movable up and down; 23 is an empty stick 22; The receiver of (22) is a box, 24
．． 25 indicates a cassette support frame. stick 2
The ICs housed in the cassette 21 together with the cassette 2 slide downward due to their own weight from an opening at the front end of the cassette, and are delivered to an inclined section 30, which will be described later. Then, the empty stick 22 falls into the box 23 and is stored therein.

The inclined portion 30 is inclined at an inclination angle α (α-35° in this case) similarly to the cassette t-21, and is
1, a plurality of guide rails 31 (four in this case) are provided, and an IC guide member 32, a stick stabbing member 33, and a member actuating piece 34 are provided at the upper end of the guide rail 31. A pair of cylinders 351 and 352 are provided at the intermediate portion as the IC intermittent feeding mechanism 35, and a guide plate 361 is provided at the lower end as the IC positioning mechanism 36.
and a positioning piece 362 are provided. Note that 37 is a vibration cylinder for applying impact vibration to the guide rail 31, and 38 is a guide rail support frame.

The hand portion 40 includes a rotating plate 42 rotatably supported by a pair of left and right side plates 41 via a support shaft 411, and
2, and a plurality of hand support plates 43 (in this case, 4 A cylinder 45 is fixed to the rotation plate (42) and moves the hand 44 up and down together with the hand support plate 43, and a rod 461 is connected to the rotation plate 42 and supports the support shaft 411. It has a cylinder 46 for rotationally driving the hand 44 in the front-back direction around the center.

The hand 44 is formed with an IC gripping mechanism and an IC insertion mechanism, and is positioned on a first inclined center line C2 at an inclined angle β (in this case, β=35°) with respect to the vertical center line CI. Grip the ICl0 at the rotational position P1, and
It plays the role of inserting ICl0 onto the printed circuit board 15 (in this case, onto the socket 18) at the rotational position.

The XY table section 50 has an XY table 51, moves the printed board 15 placed and fixed thereon in the XY direction, and moves the IC (10) held by the hand 44 to be inserted.
) The printed board 15 is positioned in accordance with the above. As shown in FIG. 5, the printed board 15 is formed as a test printed board, and has a connector 16 at one end, a pull-back hole 17 at the other end, and a socket 18 on the top surface. A total of 100 pieces are mounted in an 8-row configuration with 13 pieces arranged in every other row and 12 pieces arranged, and a reinforcing frame 19 with a cross-section shaped like a letter is fixed on the outer periphery.

The elevator section 60 is equipped with a pair of left and right endless chains 61 (see FIG. 4) that can be raised and lowered, and the chains 61 pull in a shelf (not shown) storing a plurality of stages (for example, 10 stages) of printed boards 15. 61, and if necessary, place the shelf on the aforementioned XY table 5.
Move up and down corresponding to 1. Note that 62 indicates an operation panel.

The printed board actuator 70 is disposed on a base 71 so as to be slidable in the left-right direction (in the direction of arrow B in FIG. are arranged correspondingly. When the shelf is placed on the cradle 72, the actuating part 70 is retracted to the side (to the right in this case) as shown in FIG. After being stored, the printed board (1
5) onto the XY table 51, and after inserting the IC, engages with the pull-back hole 17 (FIG. 5) of the printed board 15 and pulls the printed board 15 back into the shelf.

Now, this embodiment will be explained with reference to FIGS. 1 and 2. This embodiment is characterized by a positioning mechanism for the leaded IC ((leadded electronic component) 10 in the inclined portion 30 of each of the above-mentioned parts. In FIG. On the other hand, a guide rail 31 that is tilted at the same inclination angle α as the stick cassette 21 (α=35° in this example) and fixedly installed on the support frame 38 and a guide rail 31 that is disposed at an intermediate portion between the guide rail 31 an IC intermittent feeding mechanism 35;
The IC positioning mechanism 36 is provided at the lower end of the guide rail 31. In this example, four guide rails 31 are arranged in parallel corresponding to each cassette 21 (see FIG. 3) of the Tesic stock section 20, and the IC guide member 32 is arranged at the upper end thereof as described above. , a stick stabbing member 33, etc. are provided, and the upper end is configured to mechanically communicate with the cassette 21. The IC intermittent feeding mechanism 35 is disposed in the middle of the guide rail 31 and is composed of a pair of cylinders 351 and 352 provided in series on the upper surface side of the guide rail 31.

As will be described later, this intermittent feeding mechanism 35 continuously feeds the IC guide member 32 from the stick cassette 21.
It plays the role of temporarily stopping (stocking) the ICl0 that has been guided to the upper part of the guide rail 31 and sliding downward under its own weight to ensure that these are sent out one by one. The arrangement interval H between the cylinders 351 and 352 is set to about 1.5 times the length of ICl0. The IC positioning mechanism 36 basically includes a guide plate 361 and a positioning piece 3362. The guide plate 361 is provided on the upstream side of the positioning piece 362 in correspondence with the positioning piece 362, and is arranged approximately parallel to the upper surface of the guide rail 31 and at a predetermined interval (with a slight gap from the upper surface of the IC 10). , support member (not shown) in the front-rear direction (guide rail 31
The cylinder 36
Driven by 3.

The guide plate 361 receives ICl0 of 1 from the intermittent feed mechanism 35.
When the pieces are sent out one by one and slide downward, their front ends advance to the vicinity of the positioning piece 362 as shown in FIG. It serves as a rear side to prevent ICl0 from falling off and to keep ICl0 at a stable standstill, and then retreats rearward (to the upstream side of the guide rail 31) from the position shown in FIG. 1 and separates from ICl0. Positioning piece 36
2 is attached to the lower end of the guide rail in the front and back direction (guide rail 3
A pair of left and right supports adjacent to both left and right side surfaces of the guide rail 31 are provided with claws 362.
a and is driven by a cylinder 364. The positioning piece 362 is normally held at the predetermined position shown in FIG.
2a to stop the receiver and stop ICl0, and respond to a predetermined position on the slope of the guide rail 31 with this lead 11 as a reference, that is, the first rotational position of the hand 44 (Fig. 3) indicated by the symbol P1. After the ICl0 is positioned, the ICl0 is pressed and fixed by the hand 44 (FIG. 3), and then retracted to the front side. This positioned ICl0 is then gripped by the hand 44 (FIG. 3). By receiving and stopping the ICl0 lead 11 in this way and positioning the lead 11 as a reference,
The positioning position of the IC 10 can be made more accurate, and when the IC 10 comes into contact with the positioning piece 362, the lead 11 has the advantage of acting as a kind of buffer material. I is fixed to the upstream side of the intermittent feed mechanism 35 with a gap between the upper surface of ICl0 and the ICl0.
C guide plate is shown.

Next, the operation of this embodiment will be explained with reference to FIG. In addition, in Figure 2, in order to make the explanation easier to understand, specific (7)
) ICIO is indicated by the code 10-1, 10-2, 10-3, respectively. Also, reference numeral 351a.

"352a shows the retractable piston rods of the Hashilinta 351 and 352, respectively.

First, as shown in FIG. 2(a), the rod 351
a, 352a protrudes and moves ICl0-1 to ICl0-1 to 1o-3, which have been sliding downward on the guide rail 31, to the Lof F351a.
to stop it.

Next, as shown in FIG.
ICI O-1 to 10-3 are stopped by a.

Next, (c) as shown in the figure, the rod 351a protrudes and presses rcl 0-2 to fix it on the guide rail 31.

Next, as shown in Figure (d), the rod 352a retracts to release rcio-1. This allows ICl0-1
slides downward on the guide rail 31 due to its own weight, and is stopped and positioned by the positioning piece 362 as described above. After that, the rod 352a protrudes, and the loft 351a continues to retract, returning to the state shown in FIG.

(d) By repeating the operation shown in the figure, ICl0-2.
10-3 is sequentially and intermittently fed and positioned by the positioning piece 362.

Note that this embodiment is not necessarily limited to starting the positioning operation from the operation shown in FIG.
(b) You may start from the state shown in the figure if necessary.

〔Effect of the invention〕

As explained above, according to the present invention, the inclined portion (30)
The intermittent feeding mechanism (35) provided in the middle of the guide rail (31) that constitutes the guide rail (31) can reliably feed out the leaded electronic components (10) one by one.
1) The positioning mechanism (36) provided at the lower end allows the electronic component (10) to be stably and accurately placed on the guide rail (31).
It has a simple structure because it can be positioned on top.
This can contribute to making the automatic insertion operation of the leaded electronic component (10) more accurate and smooth.

[Brief explanation of drawings]

FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is an explanatory diagram of the operation of the embodiment of the present invention, FIG. 3 is a schematic side view of an electronic component insertion device equipped with an embodiment of the present invention, and FIG. Figure 3 is a perspective view of the external appearance of the electronic component insertion device, Figure 5 is a plan view of the test printed board (15), and Figure 6 is a diagram of the stain (22) for housing the leaded IC (leadded electronic component (10)). Figure 7 shows a side view (a) and an end view (b). Figure 7 is a side view of a leaded IC (leadded electronic component).
It is a figure showing a) and an end view (b). In Figures 1 to 6, 10, 10-1.10-2.10-3 are ICs with leads.
(electronic parts with leads), 11 is a lead, 15 is a printed board (for testing), 20 is a stick stock part, 21 is a stick cassette, 22 is a stick, 30 is an inclined part, 31 is a guide rail, 32 is an IC (electronic Components) Guide member, 33 is a stick stabbing member, 35 is an IC (electronic component) intermittent feed mechanism, 351, 352
is the cylinder, 351a, 352a are the piston ronds, 36 is the IC (
electronic parts) positioning mechanism, 361 is a guide plate, 362 is a positioning piece, 362a is a catch, 363, 364 are cylinders, 40 is a hand part, 44 is a hand, 50 is an XY table part, 51 is an XY table, 60 is a 70 indicates an elevator section, and 70 indicates a printed board operating section.

Claims (1)

[Scope of Claims] 1. A stick stock portion (20) of a stick 22 that accommodates leaded electronic components (10) of the same type, and a stick stock portion (20) of the stick 22 that is arranged in communication with the stock portion (20) and lowers the electronic component (10). A slope part (30) for sliding, and a slope part (30) for sliding.
0), the inclined part (30) is inclined at a predetermined angle of inclination, and its upper end is connected to the stick stock part (20). a guide rail (31) in communication with the hand part (40), the lower end of which is arranged adjacent to the hand part (40); an electronic component intermittent feeding mechanism (35) is provided in the middle part of the guide rail (31); An electronic component positioning mechanism in an inclined part of an electronic component insertion device, characterized in that an electronic component positioning mechanism (36) is provided at the lower end of a guide rail (31).