JPS62189111A - Adhesive sheet treater - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an adhesive sheet processing apparatus that processes a sheet assembly coated with an ultraviolet-sensitive adhesive by irradiating it with ultraviolet rays.

[Prior art and its problems]

In the integrated circuit (IC) manufacturing process, there is a dicing process in which a semiconductor wafer is cut into chips. In this dicing process, the semiconductor wafer is held at the center of the support frame, and the lower surfaces of the semiconductor wafers are adhered with a sheet coated with adhesive to form an integrated sheet assembly. The frame is fixed and a cutter is used to cut only the semiconductor wafer, leaving a sheet behind. This method has the advantage of preventing chips from chipping or scattering.

The adhesive must have a high adhesive strength in order to withstand the impact force during cutting. However, on the other hand, the chips must be easily peeled off from the sheet after cutting, but there is a problem in that the large adhesive force of the sheet hinders peeling.

Incidentally, recently, a UV-sensitive adhesive has been developed that has the property of decreasing its adhesive strength when exposed to UV rays. A sheet coated with this adhesive is used to adhere a semiconductor wafer and then exposed to UV rays after being cut. The above problems can be solved by irradiation.

At this time, if the support frame is irradiated with ultraviolet rays in the same way as the wafer, the support frame will peel off from the sheet and the sheet assembly will disassemble when the sheet assembly is transported to the next process after processing. There is a problem with this. On the other hand, if the support frame part is masked so that only the wafer part is irradiated with UV light, the sheet assembly will not be disassembled during transport, but the entire process will be completed and the support frame will be used again. When doing so, there is a problem in that the used sheet is difficult to peel off from the support frame.

[Purpose of the invention]

Therefore, the present invention is an apparatus for processing a sheet assembly in which a wafer for semiconductors or the like is adhered to a sheet coated with an ultraviolet-sensitive adhesive, and the sheet assembly is prevented from disassembling during FM transport. It is an object of the present invention to provide a pressure-sensitive adhesive sheet processing device capable of processing the sheet so that it can be easily peeled off when the support frame is used again after all processes are completed.

[Structure of the invention]

The adhesive sheet processing device of the present invention has a semi-transparent mirror or a semi-transparent mirror in front of a light irradiator equipped with a built-in lamp that emits light in a range from short-wavelength visible light to ultraviolet light. A glass plate formed into a filter is placed, and a support frame and a wafer placed in the center of this frame are adhered from below and integrated with a sheet made of a light-transmitting material and coated with an ultraviolet-sensitive adhesive. The resulting sheet assembly is placed on a glass plate with the supporting frame masked by the semi-transparent mirror or semi-transparent filter, and the ultraviolet-sensitive adhesive is irradiated with light from the light irradiator. It is characterized by being done.

〔Example〕

The present invention will be specifically explained below based on embodiments shown in the drawings.

As shown in FIGS. 1 and 2, a light irradiator 2 is disposed in the lower part of the device box 1. As shown in FIGS. A high-pressure mercury lamp with an emission length of 150 mn is disposed within the light irradiator 2 as a lamp 3 that emits light in a range from short-wavelength visible light to ultraviolet light. This high-pressure mercury lamp has a rating of 1.2KW and has a main wavelength of 365 nm, 254 nm,
It efficiently emits light with wavelengths such as 303 nm, 405 nm, and 436 nm. A mirror 31 is arranged behind the lamp 3, and the light of the lamp 3 in the wavelength range mentioned above is irradiated upward.

A glass plate 4 is disposed at the top of the device box 1.
As shown in FIG. 3, the upper surface of the glass plate 4, except for the central circular portion, is vapor-deposited with a substance that reflects or absorbs about 80% of ultraviolet rays to form a semi-transparent mirror 41 or a semi-transparent filter. . Therefore, the central circular portion is a fully transparent portion 42 that transmits 100% of ultraviolet rays.

As shown in FIG. 3, the seat assembly 10 has a wafer 12 placed in the center of an annular support frame 11.
It is glued together with 3. This sheet 13 is a thin plastic sheet that transmits light, and its surface is coated with an adhesive, but this adhesive is an ultraviolet-sensitive adhesive whose adhesive strength decreases when irradiated with ultraviolet rays. be. This sheet assembly 10 is a glass plate 4
The diameter of the fully transparent part 42 is larger than the outer diameter of the wafer 12 but smaller than the inner diameter of the support frame 11, and the boundary of the fully transparent mirror 41 is between the wafer 12 and the support frame 11. It is placed so that it is located in the middle of the

A shutter 6 is arranged directly below the glass plate 4, and is driven in a horizontal plane by a motor 61 to open and close the glass plate 4. A blowout lower 1 for cooling air and a suction lower 2 for forcibly sucking the cooling air are provided facing each other in the drive surface of the shutter 6 to form an air curtain. When 6 is open, the glass plate 4 is cooled. However, the shutter 6 and the glass plate 4 may be cooled only by the blower lower 1 without using an air curtain.

However, in order to process with the apparatus having the above configuration.

First, the shutter 6 is closed and the lamp 3 is turned on.

Then, the second lid 1a is opened, and the sheet assembly 10 that has undergone the dicing process is set on the glass plate 4 at the predetermined position as described above. Next, when the shutter 6 is opened for a predetermined time and the sheet assembly 10 is irradiated with ultraviolet rays, the sheet 13
The ultraviolet-sensitive adhesive that adheres the wafer 12 to the wafer 12 is irradiated with the ultraviolet light that has passed through the fully retracted portion 42, so that its adhesive strength rapidly decreases.

On the other hand, the ultraviolet-sensitive adhesive that adheres to the sheet 13 and the support frame 11 is irradiated by the ultraviolet light that has attenuated and transmitted through the semi-transparent mirror 41, so although its adhesive strength is reduced, it is still weaker than the wafer 12. Some amount of adhesive strength remains. Therefore.

The sheet assembly 10 taken out from this apparatus is conveyed to the next process, but the problem that the support frame 11 peels off from the sheet 13 and disassembles during this conveyance process does not occur. Then, in the next step, the wafer 12 cut into chips is peeled off from the sheet 13, but it is peeled off very easily since the adhesive strength is significantly reduced. Further, when all the steps are completed, the used sheet 13 is peeled off from the support frame 11 for reuse, but this can also be easily peeled off.

〔Effect of the invention〕

As explained above, in the adhesive sheet processing apparatus of the present invention, a UV ray blocking part and a semi-transparent mirror or a semi-transparent filter are formed on the glass plate on which the sheet assembly is placed, and the support frame is formed as a semi-transparent mirror or a semi-transparent filter. Since it is masked with a semi-transparent filter, the sheet assembly does not disassemble during transportation after processing, and it can be peeled off very easily during the wafer peeling process, and the support frame can be reused. It is possible to provide an adhesive sheet processing apparatus that can process used sheets 1 so that they can be easily peeled off.

[Brief explanation of drawings]

FIG. 1 is a front sectional view of an embodiment of the present invention, FIG. 2 is a side sectional view, and FIG. 3 is an exploded perspective view of the main parts.

Claims (1)

[Claims] In front of a light irradiator containing a built-in lamp that emits light in the range from short-wavelength visible light to ultraviolet light, a glass plate with the rest formed into a semi-transparent mirror or semi-transparent filter except for a predetermined area in the center is placed. A sheet assembly is formed by adhering a support frame and a wafer placed at the center of the frame from below using a sheet made of a light-transmitting material and coated with an ultraviolet-sensitive adhesive. A pressure-sensitive adhesive sheet processing device in which a support frame is placed on a glass plate while being masked by the semi-transparent mirror or the semi-transparent filter, and the ultraviolet sensitive adhesive is irradiated with light from the light irradiator.