JPS62190894A - Assembly and mounting of electronic parts - Google Patents
Assembly and mounting of electronic partsInfo
- Publication number
- JPS62190894A JPS62190894A JP3438586A JP3438586A JPS62190894A JP S62190894 A JPS62190894 A JP S62190894A JP 3438586 A JP3438586 A JP 3438586A JP 3438586 A JP3438586 A JP 3438586A JP S62190894 A JPS62190894 A JP S62190894A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mounting
- circuit board
- printed circuit
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品組立実装方法に関し、特に電子部品を
プリント基板に取付けると同時に電子部品のリードをは
んだ付けし電子機器等に利用される電子部品組立実装方
法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for assembling and mounting electronic components, and in particular, the present invention relates to a method for assembling and mounting electronic components, and in particular, to attach electronic components to a printed circuit board and simultaneously solder the leads of the electronic components. Related to component assembly and mounting methods.
従来、この種の電子部品をプリント基板へ組立実装する
方法は、電子部品を手または取付は用の機械によりプリ
ント基板上に取付け、部品のリードのはんだ付けは電子
部品を取付けた後の工程で行うようになっていた。Conventionally, the method of assembling and mounting this type of electronic component on a printed circuit board is to mount the electronic component on the printed circuit board by hand or with a mounting machine, and to solder the component leads in a process after the electronic component is mounted. I was supposed to do it.
上述した従来の電子部品をプリント基板へ組立実装する
方法においては、電子部品のみ先にプリント基板上に取
付けた後、部品のリードをはんだ付けするようになって
いるので、電子部品がプリント基板から抜ける恐れがあ
るという欠点がある。In the conventional method of assembling and mounting electronic components onto a printed circuit board as described above, only the electronic components are mounted on the printed circuit board first, and then the leads of the components are soldered. The drawback is that there is a risk of it falling out.
また、組立工程が長くなり、組立時間が多く費されるの
で、コスト高の原因となる欠点らある。In addition, the assembly process becomes long and a large amount of assembly time is consumed, resulting in high costs.
本発明の電子部品組立実装方法は、電子部品を実装し下
方に突き出た該電子部品のリード線がはんだ付されるプ
リント基板と、はんだを収納して前記プリント基板の下
方に位置し前記電子部品が前記プリント基板に実装され
ると同時に上方に上昇して前記リード線に前記はんだを
浸漬したのち再び下方に下降するはんだバスとを備えて
いる。The electronic component assembly and mounting method of the present invention includes: a printed circuit board on which an electronic component is mounted and a lead wire of the electronic component protruding downward is soldered to the electronic component; and a solder bath that rises upward to immerse the lead wires in the solder and then falls downward again at the same time as the lead wires are mounted on the printed circuit board.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）、（ｃ）は本発明の一実施例の工
程を示す断面図である。本実施例は電子部品１、プリン
１一基板２、電子部品１のリード線３、はんだ４および
はんだ４．を収納したはんだバス５を有している。FIGS. 1(a), 1(b), and 1(c) are sectional views showing the steps of an embodiment of the present invention. This embodiment includes an electronic component 1, a printed circuit board 2, a lead wire 3 of the electronic component 1, a solder 4, and a solder 4. It has a solder bath 5 containing the solder.
第１図（ａ）に示すように、電子部品１が図示しない取
付は用機械によってプリント基板２に電子部品１のリー
ド線３を介して取付けられる。それと同時に同図（ｂ）
に示すように、プリント基板２の下方にあるはんだバス
ラが矢印Ａの方向に上昇し、リード線３をはんだバスラ
の中のはんだ４で浸漬する。この時、２〜３秒間この位
置で停止したのち、はんだバス５は同図（ｃ）で示すよ
うに矢印Ｂ方向に下降し、同図（ａ＞の元の位置に戻る
。この時、電子部品のリード線３にはんだ６が付着され
固まることにより、電子部品１はプリン１〜基板２に組
立実装されることとなる２つ発明の効果〕
以上説明したように本発明は、電子部品を取付は用のＩ
Ｆ＆［によってプリン１〜基板へ取付けると同時に、下
方からはんだバスが上昇し、電子部品のリード線をはん
だ付けすることにより組立実装ができるたｙ）、電子部
品がプリン１〜基板から外れることがなく、また作業工
程が短縮でき、組立工数ら少なくできるため、コス）〜
低減ができる効果がある。As shown in FIG. 1(a), the electronic component 1 is attached to the printed circuit board 2 via the lead wire 3 of the electronic component 1 using a machine (not shown). At the same time, the same figure (b)
As shown in , the solder busler below the printed circuit board 2 rises in the direction of arrow A, and the lead wire 3 is immersed in the solder 4 in the solder busler. At this time, after stopping at this position for 2 to 3 seconds, the solder bath 5 descends in the direction of arrow B as shown in FIG. By adhering and hardening the solder 6 to the lead wire 3 of the component, the electronic component 1 is assembled and mounted on the printer 1 to the board 2. Two Advantages of the Invention As explained above, the present invention has the following advantages: Installation is for
At the same time that the solder bus is attached to the printed circuit board 1 by F& In addition, the work process can be shortened and the number of assembly steps can be reduced, resulting in lower costs) ~
It has the effect of reducing
第１図（ａ）、（ｂ）、（ｃ）は本発明の一実施例の工
程を示す断面図である。
１・・・電子部品、２・・・プリント基板、３・・・リ
ード線、４・・・はんだ、５・・・はんだバス、６・・
・付着したはんだ。
代理人 升埋士 内 県 背、ゴ１（αン
ｌ 図FIGS. 1(a), 1(b), and 1(c) are sectional views showing the steps of an embodiment of the present invention. 1...Electronic component, 2...Printed circuit board, 3...Lead wire, 4...Solder, 5...Solder bus, 6...
-Adhered solder. Agent Masu Burial Officer Inside Prefecture, Go1 (αnl Figure)
Claims (1)
線がはんだ付されるプリント基板と、はんだを収納して
前記プリント基板の下方に位置し前記電子部品が前記プ
リント基板に実装されると同時に上方に上昇して前記リ
ード線に前記はんだを浸漬したのち再び下方に下降する
はんだバスとを備えることを特徴とする電子部品組立実
装方法。A printed circuit board on which electronic components are mounted and the lead wires of the electronic components protruding downward are soldered; and a solder bath that ascends upward to immerse the solder in the lead wires and then descends downward again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3438586A JPS62190894A (en) | 1986-02-18 | 1986-02-18 | Assembly and mounting of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3438586A JPS62190894A (en) | 1986-02-18 | 1986-02-18 | Assembly and mounting of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190894A true JPS62190894A (en) | 1987-08-21 |
Family
ID=12412698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3438586A Pending JPS62190894A (en) | 1986-02-18 | 1986-02-18 | Assembly and mounting of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190894A (en) |
-
1986
- 1986-02-18 JP JP3438586A patent/JPS62190894A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62190894A (en) | Assembly and mounting of electronic parts | |
| JPS6130439B2 (en) | ||
| JPH02224393A (en) | Method of soldering mixed mounting metal core printed board assembly | |
| JPS598376Y2 (en) | Hybrid IC mounting structure | |
| JPH11186708A (en) | How to mount printed circuit boards | |
| JPS6114791A (en) | Printed board for mounting electronic part | |
| JP3694144B2 (en) | Double-sided mounting board manufacturing method | |
| JPH04125476U (en) | Printed circuit board component mounting structure | |
| JPS6197893A (en) | Mask for solder printing | |
| JPH0737332Y2 (en) | Printed board | |
| JPH01302796A (en) | Through hole structure of circuit board and method for leaving through hole in soldering process | |
| JPH04269894A (en) | How to solder surface mount components to a printed circuit board | |
| JPS635260Y2 (en) | ||
| JPS60130894A (en) | Method of mounting electronic part | |
| JPS57126108A (en) | Mounting method for coil | |
| JPS60107896A (en) | Printed board unit | |
| JPS6174394A (en) | Soldering of lead-free part | |
| JPS62163393A (en) | Method of mounting electronic parts | |
| JP2002094194A (en) | Printed wiring board for electronic equipment | |
| JPS62293688A (en) | Mounting structure of printed board | |
| JPS62136061A (en) | Lead terminal attaching method for hybrid integrated circuit module | |
| JPS62136828A (en) | Manufacture of hybrid ic | |
| JPS62120100A (en) | Method of mounting chip parts on printed wiring board | |
| JPH09186283A (en) | Hybrid IC | |
| JPH0645376U (en) | Printed circuit board for mounting integrated circuits |