JPS62190895A - Replacement of electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A heater is attached to a cooling container fixed to the top of an electronic component, a heating medium is put in it, and the device is preheated to a predetermined temperature using a hot plate from the opposite side of the mounting surface as in the conventional method. The simple structure and method of heating the heating medium in the container using the heater facilitates the replacement of electronic components.

[Industrial application field]

The present invention relates to a method for mounting electronic components on a printed wiring board.

In particular, there is a need for a method that allows easy removal of electronic components when replacing the electronic components of a printed wiring board with a cooling container mounted thereon.

[Conventional technology]

The conventional and most widely used method for removing electronic components during replacement is to remove a cooling container (not shown) fixed to the top of the electronic component 12 that requires replacement, that is, in the direction of the solid line arrow.
As shown in FIG. 3, the opposite side of the printed wiring board 11 on which the electronic components 12 are mounted is placed on the hot plate 41 in the direction of the solid arrow to prevent thermal shock from the printed wiring board 11 and the electronic components 12. Preheating is performed to a predetermined temperature in order to reduce the temperature, and then air or inert gas heated to a high temperature is sprayed from the upper surface of the electronic component 12, that is, from the direction of the solid line arrow, using a hot gun 42 held by the worker.
The solder connecting the connection terminal 12a of the electronic component 12 and the pattern (not shown) of the printed wiring board 11 is melted, and the electronic component 12 is removed.

[Problem that the invention seeks to solve]

The problem with the conventional electronic component replacement method described above is that a hot gun is on hand that sprays air or inert gas heated to above the solder remelting temperature from above the electronic component that requires replacement. In printed wiring boards that are mounted at high density, other adjacent components are directly exposed to high-temperature gas, and the heat causes damage to other mounted components.

In view of the above-mentioned circumstances, it is an object of the present invention to provide a method for easily and inexpensively replacing electronic components without causing any damage to other mounted electronic components.

[Means for solving problems]

As shown in FIG. 1, the above problem is caused by the refrigerant in the cooling container 2 that is fixed to the top of the electronic component 12 that needs to be replaced among the electronic components mounted on the printed VA board 11.
(not shown) is removed, the upper lid (not shown) is removed, and the heating medium 32 that rises to a predetermined temperature is injected. It is immersed and fixed in the medium 32 in the direction of the solid line arrow and connected to a power source.

Then, on the upper surface of the hot plate 41 in the opposite direction of the solid line arrow, that is, on the side surface in the direction of the solid line arrow, the side opposite to the mounting of the electronic component 12 that needs to be replaced was placed in the same way as in the past, and preheated to a predetermined temperature. After that, turn on the power to the heater 31.
This problem is solved by the electronic component replacement method of the present invention, which heats the heating medium 32 to a predetermined temperature.

[Effect]

That is, in the present invention, the hot gun 42 blows high-temperature hot air onto the connection terminal 1 of the electronic component 12 that requires replacement.
Instead of melting the solder connecting the printed wiring board 2a and the printed wiring board 11, the cooling container 2 is fixed by a heater 31.
conducts high heat from the top of the electronic component 12 to the top of the electronic component 1.
Since the connecting solder of the connecting terminal 12a is melted by the conductive heat of the electronic component 2 itself, there is no direct high-temperature thermal shock to other mounted components mounted in high density, and the electronic component 12 can be easily replaced.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a sectional view of the electronic component replacement method according to this embodiment.

As shown in FIG. 1, the refrigerant used during device operation in the cooling container 2 stuck to the upper part of the electronic component 12 that needs to be removed from the printed wiring board 11, that is, in the direction of the solid line arrow, is removed. The lid (not shown) of the heating medium 32 is removed and the heating medium 32 is heated to a predetermined temperature. For example, silicone oil with a high boiling point is injected into the container 2, and the heating medium 31 is poured into the container 2.
For example, a seed of a predetermined shape that has a heat generating part in a predetermined length portion covered by a protection pipe and immersed in the heating medium 32, excluding the vicinity of the interface between air and the heating medium 32. The heater is inserted into and attached to a predetermined position of the container 2 from the side indicated by the solid line arrow, and connected to a power source (not shown) that can control the heating temperature to a predetermined temperature.

Then, the opposite side of the mounting surface of the electronic component 12 that requires removal of the printed wiring board 11 is placed on a hot plate 41 having a predetermined heating area to locally preheat a predetermined portion, and the heater 31 is heated. Turn on the power, heat the heating medium 32 to raise the temperature of the container 2 to a predetermined temperature, and transfer the heat of the container 2 to the connection terminal 12a via the electronic component 12.
, and melts the connecting solder between the electronic component 1 and the wiring board 11, thereby preventing heat shock from being applied to components other than the electronic component 12 (which can be easily replaced).

As shown in FIG. 2, as an example of another electronic component replacement method, a high-temperature heating medium 32, for example, silicone oil heated to a predetermined temperature, is inserted into the container 2 from its entrance and exit with the M21 attached as shown in the arrow. The method of circulating in □ does not require the removal of the M21, so the replacement cost is low and it can be replaced without giving any thermal shock to other electronic parts.

〔Effect of the invention〕

As explained above, according to the present invention, the configuration is extremely simple, and the electronic components can be removed together with the cooling container without damaging other electronic components, making it possible to easily replace the electronic components, resulting in economical effects. This is expected to be extremely useful industrially.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an electronic component replacement method according to an embodiment of the present invention, FIG. 2 is a sectional view showing another electronic component replacement method, and FIG. 3 is a diagram showing a conventional electronic component replacement method. In the figure, 11 is a printed wiring board, 12 is an electronic component, 12a is a connection terminal, 2 is a container, 21 is a lid, 31 is a heater, 32 is a heating medium, 41 is a hot plate, and 42 is a hot gun. Secret lamp example 1; l>脣] Part 6 罎讂方方面图 1 图I! sda〉I1 defeat-saying fItii: riIJE
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Claims (1)

[Claims] Electronic components (12) mounted on printed wiring board (11)
A cooling container (2) fixed to the upper part is equipped with a heater (31) having a heating section of a predetermined length at a predetermined location and a heating medium (32) that raises the temperature to a predetermined temperature, Preheating by a hot plate (41) from the side and heating medium (3) in the container (2) by the heater (31)
2) A method for replacing an electronic component, which comprises heating.