JPS6219210Y2 - - Google Patents

Info

Publication number
JPS6219210Y2
JPS6219210Y2 JP12355183U JP12355183U JPS6219210Y2 JP S6219210 Y2 JPS6219210 Y2 JP S6219210Y2 JP 12355183 U JP12355183 U JP 12355183U JP 12355183 U JP12355183 U JP 12355183U JP S6219210 Y2 JPS6219210 Y2 JP S6219210Y2
Authority
JP
Japan
Prior art keywords
diamond
metal
heel
shoes
slip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12355183U
Other languages
Japanese (ja)
Other versions
JPS6031808U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12355183U priority Critical patent/JPS6031808U/en
Publication of JPS6031808U publication Critical patent/JPS6031808U/en
Application granted granted Critical
Publication of JPS6219210Y2 publication Critical patent/JPS6219210Y2/ja
Granted legal-status Critical Current

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  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)

Description

【考案の詳細な説明】 この考案は耐摩耗性および摩擦係数を大きくす
ることを目的とする靴の滑り止め金具に関するも
のである。
[Detailed Description of the Invention] This invention relates to a non-slip metal fitting for shoes that aims to increase wear resistance and coefficient of friction.

従来、靴の踵(かかと)、本底の接地部分は地
面との摩擦によつて摩耗するために、これら部分
の全面もしくは一部に特殊ゴム、金属その他耐摩
耗性のすぐれた物質からなる材料を打ち付けた
り、張り付けたりする方法が広く用いられてき
た。しかし、このような従来の方法では、歩行中
に滑つて、歩行者が転倒し、捻挫、骨折、打撲等
を起こすことがしばしばある。
Conventionally, the heel and the ground-contacting part of the outsole of shoes wear out due to friction with the ground, so all or part of these parts are made of special rubber, metal, or other highly wear-resistant materials. The method of nailing or pasting has been widely used. However, with such conventional methods, pedestrians often slip and fall while walking, resulting in sprains, fractures, bruises, and the like.

この考案は、このような問題点に注目してなさ
れたものであり、メタルボンドダイヤモンドの成
形体であることを特徴とする靴の滑り止め金具を
提供するものである。以下、実施例を示す図面を
用いて、この考案の詳細を述べる。
This invention was made in view of these problems, and provides an anti-slip fitting for shoes characterized by being a molded body of metal bonded diamond. Hereinafter, details of this invention will be described using drawings showing examples.

まず、この考案におけるメタルボンドダイヤモ
ンドとは、通常ダイヤモンド砥石に用いられてい
るものと同類のものであり、従来法はダイヤモン
ド微粒を銅合金で800〜950℃程度の還元性雰囲気
中で焼結させた軟質のもの、または、炭化タング
ステンなどの超硬合金を基礎結合剤とし、ニツケ
ル−銅合金を二次結合剤として800〜1200℃で融
結させた硬質のもの、さらにはニツケル等の金属
を電着したもの等に大別されるが、この考案に用
いるものはこれら従来法に限られるものではな
く、ダイヤモンド粉粒に対する親和性、粘結性の
ある金属もしくは合金によるダイヤモンド粉焼結
体であればよい。ここで、ダイヤモンドは天然
品、人造品のいずれでもよく、粒度は摩擦抵抗を
勘案すれば約80〜325メツシユを一応の目安にす
るとよい。ここで80メツシユよりも粒度が著しく
大きくなると、床材等に傷がつきやすく、また、
325メツシユよりも小さくなると摩擦抵抗が小さ
くなつて期待する効果が得られなくなる。なお、
ダイヤモンド砥石(カツターも含め)等における
メタルボンドとダイヤモンド粒との配合割合は製
品の機械的強度および熱伝導率等の点から、メタ
ルボンド量がダイヤモンド粒よりも多量用いられ
るのが通例であるが、この考案においては砥石の
ような機械的強度は要求されないので、メタルボ
ンド量をダイヤモンド粒の量よりも必らずしも多
量としなければならないという理由はないので、
通常の場合、等量(重量)を一つの基準にすれば
よい。ダイヤモンド粒の量が過少のときは、従来
の金属材料に近づき、この考案の効果が期待薄と
なつて好ましくないことは言うまでもないことで
ある。
First, the metal-bonded diamond in this invention is similar to that normally used in diamond grinding wheels, and the conventional method involves sintering fine diamond particles with a copper alloy in a reducing atmosphere at about 800 to 950 degrees Celsius. or hard materials made by using cemented carbide such as tungsten carbide as the basic binder and nickel-copper alloy as the secondary binder and melting them at 800 to 1200℃, or even metals such as nickel. The material used in this invention is not limited to these conventional methods, but is a diamond powder sintered body made of a metal or alloy that has an affinity for diamond powder particles and has caking properties. Good to have. Here, the diamond may be either a natural product or an artificial product, and the grain size should be approximately 80 to 325 mesh as a rough guide, taking frictional resistance into consideration. If the particle size is significantly larger than 80 mesh, it will easily damage flooring materials, etc.
If the mesh is smaller than 325 mesh, the frictional resistance will become so small that the expected effect will not be obtained. In addition,
Regarding the mixing ratio of metal bond and diamond grains in diamond whetstones (including cutters) etc., from the viewpoint of the mechanical strength and thermal conductivity of the product, it is customary to use a larger amount of metal bond than diamond grains. Since this invention does not require the mechanical strength of a grindstone, there is no reason why the amount of metal bond must necessarily be greater than the amount of diamond grains.
In normal cases, the same amount (weight) may be used as one standard. Needless to say, if the amount of diamond grains is too small, the material will approach conventional metal materials, and the effect of this invention will be diminished, which is undesirable.

つぎに、この考案のメタルボンドダイヤモンド
の成形体とは、その構造は第1図に示すように、
メタルボンド層1にダイヤモンド粒2が分散し、
いわゆる海島構造を形成しており、成形体の形状
は第2図に例示するように、踵または本底の接地
部分の全面もしくは一部に相当したものである。
すなわち、第2図イには踵全面の例を、ロには本
底の接地部全面(少し湾曲した曲面)の例を、ハ
には踵の一部の例を、ニおよびホには女性用ハイ
ヒール等の全面の例を、また、ヘには長方形の小
片の例を示したが、これらの例に限るものではな
く、スポーツ用靴のチツプ(スパイク)等任意の
形状に適応できる。各形状品も通常は2〜5mmの
厚さであれば充分であり、取り付け用の釘穴3を
適宜設けて必要箇所に釘で打ち付けるか、ねじ込
むか、または接着剤で貼り付ける。
Next, the structure of the metal-bonded diamond compact of this invention is as shown in Figure 1.
Diamond grains 2 are dispersed in the metal bond layer 1,
It forms a so-called sea-island structure, and the shape of the molded body corresponds to the entire surface or a part of the ground-contacting part of the heel or outsole, as illustrated in FIG.
In other words, Figure 2 A shows an example of the entire heel, B shows an example of the entire ground contact part of the outsole (a slightly curved surface), C shows a part of the heel, and D and E show an example of a woman's heel. An example of the entire surface of a high heel for sports and the like of a small rectangular piece are shown in F, but the present invention is not limited to these examples, and can be applied to any shape such as the tips (spikes) of sports shoes. It is usually sufficient for each shaped product to have a thickness of 2 to 5 mm, and nail holes 3 for attachment are provided as appropriate and the product is nailed or screwed into the required location, or affixed with adhesive.

このような滑り止め金具を靴底、踵等に取り付
けると、凍結面や濡れ面でも全く滑らなくなり、
床材の破損も殆んど認められなかつた。また、片
方のみが摩耗して傾くこともなくなつた。
If you attach such anti-slip fittings to the soles, heels, etc. of your shoes, they will not slip at all even on frozen or wet surfaces.
There was hardly any damage to the flooring material. Also, it no longer tilts due to wear on only one side.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は組識構造を示す断面図、第2図イ〜ヘ
はこの考案の形状を例示するための平面図であ
る。 1……メタルボンド層、2……ダイヤモンド
粒、3……釘穴。
FIG. 1 is a sectional view showing the tissue structure, and FIGS. 2A to 2F are plan views illustrating the shape of this invention. 1...metal bond layer, 2...diamond grains, 3...nail hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メタルボンドダイヤモンドの成形体であること
を特徴とする靴の滑り止め金具。
A non-slip fitting for shoes characterized by being a molded object of metal bond diamond.
JP12355183U 1983-08-08 1983-08-08 anti-slip fittings for shoes Granted JPS6031808U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12355183U JPS6031808U (en) 1983-08-08 1983-08-08 anti-slip fittings for shoes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12355183U JPS6031808U (en) 1983-08-08 1983-08-08 anti-slip fittings for shoes

Publications (2)

Publication Number Publication Date
JPS6031808U JPS6031808U (en) 1985-03-04
JPS6219210Y2 true JPS6219210Y2 (en) 1987-05-18

Family

ID=30281990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12355183U Granted JPS6031808U (en) 1983-08-08 1983-08-08 anti-slip fittings for shoes

Country Status (1)

Country Link
JP (1) JPS6031808U (en)

Also Published As

Publication number Publication date
JPS6031808U (en) 1985-03-04

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