JPS6219261B2 - - Google Patents

Info

Publication number: JPS6219261B2
Authority: JP; Japan
Prior art keywords: solder; soldering; product; tape; soldered
Prior art date: 1978-09-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP11820778A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5545548A (en

Inventor

Masashi Yako

Hidekazu Mori

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-25

Filing date

1978-09-25

Publication date

1987-04-27

1978-09-25 Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd

1978-09-25 Priority to JP11820778A priority Critical patent/JPS5545548A/ja

1980-03-31 Publication of JPS5545548A publication Critical patent/JPS5545548A/ja

1987-04-27 Publication of JPS6219261B2 publication Critical patent/JPS6219261B2/ja

Status Granted legal-status Critical Current

Links

229910000679 solder Inorganic materials 0.000 claims description 26
238000005476 soldering Methods 0.000 claims description 25
238000007654 immersion Methods 0.000 claims description 9
238000000034 method Methods 0.000 claims description 7
239000002184 metal Substances 0.000 claims description 5
229910052751 metal Inorganic materials 0.000 claims description 5
238000010438 heat treatment Methods 0.000 description 3
239000012535 impurity Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
230000003749 cleanliness Effects 0.000 description 1
150000001875 compounds Chemical group 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000004907 flux Effects 0.000 description 1
239000007791 liquid phase Substances 0.000 description 1
239000000463 material Substances 0.000 description 1
239000007790 solid phase Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1

Landscapes

Electric Connection Of Electric Components To Printed Circuits (AREA)

JP11820778A 1978-09-25 1978-09-25 Excess solder removing method by using tape Granted JPS5545548A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP11820778A JPS5545548A (en)	1978-09-25	1978-09-25	Excess solder removing method by using tape

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP11820778A JPS5545548A (en)	1978-09-25	1978-09-25	Excess solder removing method by using tape

Publications (2)

Publication Number	Publication Date
JPS5545548A JPS5545548A (en)	1980-03-31
JPS6219261B2 true JPS6219261B2 (th)	1987-04-27

Family

ID=14730842

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP11820778A Granted JPS5545548A (en)	1978-09-25	1978-09-25	Excess solder removing method by using tape

Country Status (1)

Country	Link
JP (1)	JPS5545548A (th)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2019140841A1 (zh) *	2018-01-19	2019-07-25	深圳市海目星激光智能装备股份有限公司	一种柔性压锡尖装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5243143A (en) *	1990-11-13	1993-09-07	Compaq Computer Corporation	Solder snap bar

1978
- 1978-09-25 JP JP11820778A patent/JPS5545548A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2019140841A1 (zh) *	2018-01-19	2019-07-25	深圳市海目星激光智能装备股份有限公司	一种柔性压锡尖装置

Also Published As

Publication number	Publication date
JPS5545548A (en)	1980-03-31

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