JPS62196351U - - Google Patents
Info
- Publication number
- JPS62196351U JPS62196351U JP1986085700U JP8570086U JPS62196351U JP S62196351 U JPS62196351 U JP S62196351U JP 1986085700 U JP1986085700 U JP 1986085700U JP 8570086 U JP8570086 U JP 8570086U JP S62196351 U JPS62196351 U JP S62196351U
- Authority
- JP
- Japan
- Prior art keywords
- container
- semiconductor device
- resin
- bottom plate
- side frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の半導体装置の一例の断面図、第３図は別の
従来例の断面図、第４図は小形半導体装置の側面
図、第５図は本考案の別の実施例の斜視図である
。 １：底板、２：側枠、３：接着剤、４：複合素
子、７：注入樹脂、８：つば。
従来の半導体装置の一例の断面図、第３図は別の
従来例の断面図、第４図は小形半導体装置の側面
図、第５図は本考案の別の実施例の斜視図である
。 １：底板、２：側枠、３：接着剤、４：複合素
子、７：注入樹脂、８：つば。
Claims (1)
- 金属よりなる底板に樹脂よりなる側枠が固着さ
れた容器内に半導体素子が収容され、容器内に注
入、硬化された樹脂により封止されるものにおい
て、側枠の底板との接触部に内側に延びるつばを
備えたことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986085700U JPS62196351U (ja) | 1986-06-05 | 1986-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986085700U JPS62196351U (ja) | 1986-06-05 | 1986-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62196351U true JPS62196351U (ja) | 1987-12-14 |
Family
ID=30941340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986085700U Pending JPS62196351U (ja) | 1986-06-05 | 1986-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62196351U (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56610U (ja) * | 1979-06-15 | 1981-01-07 | ||
| JPS58184743A (ja) * | 1982-04-23 | 1983-10-28 | Hitachi Ltd | モ−ルド型半導体装置 |
-
1986
- 1986-06-05 JP JP1986085700U patent/JPS62196351U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56610U (ja) * | 1979-06-15 | 1981-01-07 | ||
| JPS58184743A (ja) * | 1982-04-23 | 1983-10-28 | Hitachi Ltd | モ−ルド型半導体装置 |