JPS62196Y2 - - Google Patents

Description

[Detailed explanation of the idea]

The present invention relates to the processing of ceramic packages, which are formed products and sintered semi-finished products, and to structural improvements for preventing damage to the end face ridgeline portions due to collisions between the semi-finished products during the assembly process. Conventional ceramic package semi-finished products generally have a tapered surface with a chamfer 2 or an arc-shaped radius of 1 mm on the ridgeline other than the top ridgeline of the semi-finished product 1, as shown in Figure 1. It was hot. (The upper surface ridge line is not chamfered on the sur-deep package, etc. to which glass is welded.) These semi-finished products are not chamfered due to continuous feeding equipment used in post-process processing, assembly, automatic inspection, etc., or during transportation to the user or during handling. There were many cases of damage such as chips at the chamfered parts due to mutual collision with other package cages. For this reason, attempts have been made to prevent chipping by making the chamfer larger, but this results in problems with airtightness as the chamfer becomes larger. The present invention eliminates the above-mentioned drawbacks, makes it easier to perform polishing corrections due to consumption of the circular arc R part of the forming press mold, reduces the cost of molds and their modification, increases the pass rate, and meets the customer's wishes. According to the inclined view in Figure 3, the main point of this is to provide a package with an A dimension of 2 to 8 mm at the center position of the center edge of the end face of the package where the external lead is not attached. A flat part is provided, and a tapered surface with a C dimension of 0.1 to 0.5 mm smaller than the B dimension from both sides of the flat part toward both ends, and a D dimension of 0.3 mm at the ridgeline position between this tapered surface and the side surface where the lead is attached. ~
It is characterized in that it is configured with a circular arc R of 1.5 mm. The A dimension of the flat part at the center position of the end face of this invention is 2 to 8.
The reason why mm is provided is that if it is less than 2 mm, the impact force applied when the package cages collide with each other will be concentrated in one part and cause damage, but if it is more than 8 mm, the width will be almost the same as the package width W, which is the conventional method. This is because it is no different from the chamfered product. Also, the reason why we formed a tapered surface with a C dimension of 0.1 to 0.5 mm smaller than the B dimension from both sides of the flat part toward both ends is because if the C dimension is larger than the B dimension, the formed angle becomes larger, and the flat part This is because chip damage often occurs at the ridgeline position, and D dimension
The reason for forming the arc R of 0.3 to 1.5 mm is to avoid direct collision as much as possible because it is the area where chipping is most likely to occur during mutual collision, and to disperse the impact force. If the arc R has a dimension of 1.5 mm or more, airtightness will be difficult, and if the D dimension is 0.3
This is because if the thickness is less than mm, the effect of preventing chip damage is poor. Hereinafter, the results of an impact test will be shown for an article of the present invention shown in the perspective view of FIG. 2 and an article of the conventional shape shown in the perspective view of FIG. Made of alumina porcelain with alumina content of 92% by weight, A dimension 8.7 mm, B dimension 3 mm, C dimension 0.2 mm, D
Only 10 of the ceramic package cages of the present invention in the shape shown in Figure 2 with dimensions of 1.0 mm and W dimension of 14.7 mm were placed in a plastic case with a length of 500 mm in the longitudinal direction, and by rotating the package cages by 180 degrees, the package cages collided with each other. I let it happen. For comparison, a ceramic package of the shape shown in Fig. 1, which was made of the same material as the above-mentioned package of the present invention and had a 0.4 mm chamfer on the ridge line, was also caused to collide with each other in the same manner. The results of the collision are shown in Table 1. In Table 1, the denominator of the numbers indicates the number of collided samples, and the numerator indicates the number of samples in which chips occurred.

[Table] As shown in Table 1 above, the product of the present invention had 0% occurrence of chipping and breakage even after repeated extreme impact tests 100 times, and we can be confident that the quality assurance of a complete product is sufficient. Although the chamfer slope and circular arc R of the ridgeline portions of the upper and lower surfaces are omitted in the drawings of this invention, the circular arc R of the chamfer formed by the molding die or barrel polishing is
It is common sense that the thickness is between 0.1 and 0.6 mm. As mentioned above, the structural product of this invention has a large number of chips and defects due to many processes and handling from molding to the finished product, compared to products with conventional shapes, which is significantly reduced, and there is no inspection, which has a large impact on reducing production costs. There is.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional product, and FIG. 2 is a perspective view of a product of the present invention. 1, 11...Ceramic, 2...Chamfer, 3,
13... Chip tower mounting location.

Claims (1)

[Scope of utility model registration request] In a ceramic package in which a plurality of external leads are attached to opposite sides of a package constructed by stacking ceramic plates or by welding glass on ceramic plates, this end face is attached to the end face to which the external leads are not attached. A flat part with dimension A of 2 to 8 mm is provided at the center of the flat part, and a tapered surface with dimension C of 0.1 to 0.5 mm, which is smaller than dimension B, is attached from both sides of the flat part toward both ends, and this tapered surface and the lead are attached. D at the ridgeline position with the side
A ceramic package characterized in that it is constructed with an arc R having a size of 0.3 to 1.5 mm.