JPS62201219A - Mold assembly for resin encapsulation - Google Patents

Abstract

PURPOSE:To obtain a mold assembly for resin encapsulation which allows to cut off gates with no fear for leftover gate and crack by a method wherein resins in runners are ejected upwards by runner ejector ins in the state that a loading frame is held onto a bottom force after the encapsulation of resin. CONSTITUTION:After a mold is opened in the state that resins 44a in runners 9, resins 44b in gates 10 and encapsulated items 11 are left on a bottom force 8 side, an ejector rod 28 is raised so as to move a lower ejector plate 26 upwards in order to eject runner ejector pins 12 and a cull ejector pin 33 upwards. Because the resins 44a are ejected upwards by the upper ends of the pins 12 and at the same time the cull 44c is ejected upwards by the upper end of the pin 33 in the state that the loading frame 5 is held on the bottom force 8 and at the same time the encapsulated items 11 are held on the frame 5, the encapsulated items 11 are separated from the resins 44a by being cut off at the resin 44b portions. The cutting-off is easily effected at right positions under the state that the cutting-off is easy because of encapsulating resin being not yet cooled down.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a resin encapsulation mold device used for resin encapsulation of electronic components such as diodes.

[Background technology] When encapsulating electronic components such as diodes with resin, the conventional method is to seal the resin in a mold and harden it, and then mold the resin integrally with a part of the runner from the mold. The product is taken out, and in a separate process, a part of the runner is manually cut from the sealed product at the date part to separate the sealed molded product and the part of the runner.

However, the encapsulation molded product is small and is molded in a large number of pieces, and manual gate cutting is an extremely difficult task. Furthermore, since the date cutting work is carried out after the sealing resin has hardened and time has elapsed, the cut point of the date part is not constant.
There was also the problem that problems such as large date marks remained (1) or dates were cut while cutting into the molded sealing product, causing cracks.

[Object of the Invention] The present invention has been made in view of the above-mentioned points, and it is possible to eliminate the need for manual gate cutting and to cut the date without fear of remaining dates or cracks. The object of the present invention is to provide a mold device for resin sealing that can be used.

[Disclosure of the Invention] According to the molding device for resin sealing according to the present invention, a pair of frame plates 2 each having an opening 1 can be stacked and separated in a state where the openings 1 are aligned with each other. A loading frame 5 sandwiching the lead wires 4 of the electronic component 3 between both frame plates 1 with the electronic component 3 positioned in the section 1, and a cavity 6 in which the electronic component 3 is placed. an upper mold 8 and a lower mold 8 that clamp and set the formed loading frame 5 during mold clamping;
A runner 9 and a date 10 are formed between the upper mold 7 and the lower mold 8 and supply the sealing resin to the cavity 6, and the upper mold 7 and the lower mold 8 are driven upward after the molds are opened. A runner ejector pin 12 that pushes up the resin in the runner 9 and cuts the resin in the runner 9 from the sealing molded product 11 in the cavity 6 at the date 10 portion, and the upper mold 7 and the lower mold 8. Loading frame set 5
A clamping member 13 holds both frame plates 2 in an overlapping state on the lower mold 8 and releases the overlapping holding after driving the runner ejector pin 12 upward.
After the resin is sealed and molded, the resin in the runner 9 is pushed up by the runner ejector pin 12 while the loading frame 5 is held on the lower mold 8. By doing so, the resin in the runner 9 can be cut and separated from the encapsulation molded product 11 that will be held on the loading frame 5 via the lead wire 4, and the resin in the runner 9 can be automatically separated without the need for manual work. to be able to perform separation,
Moreover, this cutting and separation can be carried out immediately after molding and before demolding, so that the resin in the runner 9 can be accurately cut and separated at the date portion.

The present invention will be explained in detail below with reference to Examples. The loading frame 5 consists of two frame plates 2 as shown in FIG. 5(a).
, 2 are pivotally connected to each other by a hinge, and by closing the frame plates 2, 2, they can be closely overlapped.

Each of the frame plates 2, 2 has a central opening 1a and a plurality of parallel side openings 1bt1b and 1b, which communicate with the central opening 1a.
..., and when both frame plates 2, 2 are closed and overlapped, the opening 1 of each frame plate 2, 2 is as shown in Fig. 5(b). So that they match each other. The lower frame plate 2 of the pair of frame plates 2, 2 has a side opening 1 as shown in FIG.
A large number of grooves 40 are provided facing the frame plate 2, and a handle 16 protrudes from the frame plate 2 for attachment. In this loading frame 5, a large number of electronic components 3 such as diodes are placed in the side opening 1b of the opening 1 with the frame plate 2° 2 open, and are made to protrude from the electronic components 3. By closing and overlapping the frame plates 2, 2 with the lead wire 4 fitted into the groove 40, the electronic component 3 can be held with the lead wire 4 sandwiched between both frame plates 2, 2. be.

Figure 1 shows the mold device of the present invention, the left half of Figure $1 shows the state seen from the operator's side, and the right half of Figure 1 shows the cross section seen from the direction perpendicular to this. show. An upper mold plate 18 is attached to the lower side of the upper mold plate 17, and the upper mold 7, which becomes the upper cavity plate, is attached to the lower surface of the upper mold plate 18. A cylindrical bot 19 is mounted on the upper template 18.
A plunger 20 is installed above the pot 19 and is inserted through the upper gouging plate 17 to be freely driven up and down. An upper ejector plate 21 is disposed below the upper guide plate 17 and above the upper die plate 18. A bottle 22 whose lower end is fixed to the upper mold plate 18 is inserted into the upper ejector plate 21, and a spring 23 provided between the upper end of the bottle 22 and the upper surface of the upper ejector plate 21 causes the upper ejector to The plate 21 is elastically urged downward, and a force is applied to the upper enoctor plate 21 to slide downward along the bin 22. The upper die 42 is configured by each of these members. Further, a lower mold plate 25 is attached to the upper side of the lower mold plate 24, and a lower mold 8, which becomes a lower cavity plate, is attached to the upper surface of the lower mold plate 25. A lower ejector plate 26 is provided between the lower ejector plate 24 and the lower mold 8 so as to be able to move up and down. An ejector rod 28 is inserted through the ejector rod 27 and can be driven vertically. The lower mold 43 is configured by each of these members.

At the parting line portion of each of the upper mold 7 and the lower mold 8, there is a cavity block 30 in which a large number of vertically opposed recesses, each of which will become a cavity 6, are formed in parallel. The upper mold 7 is provided in a portion other than the cavity block 30.
There are frame storage recesses 29, 2 on the lower surface of the lower surface and the lower surface of the lower mold 8.
9 are formed to face each other vertically. Also, the above pot 19
A cul reservoir 31 is recessed in the lower mold 8 facing the lower end, and a groove for forming a runner 9 is formed in the lower surface of the upper mold 7 so as to communicate with this cul reservoir 31. A date 10 is formed on the lower surface of the upper mold 7 to communicate the mold and the cavity 6. On the other hand, an upper runner ejector pin 32 is provided which penetrates the upper mold plate 18 and the upper mold 7 and is slidable up and down, and the upper end of the upper runner ejector pin 32 is fixed to the upper ejector plate 21. Further, a runner ejector pin 12 and a cull ejector turbine 33 are provided so as to be able to slide up and down, penetrating the lower mold plate 18 and the lower mold 8, and the runner ejector pin 12 and the cull ejector turbine 33 each have their lower ends facing downward. It is fixed to the ejector plate 26. The upper runner ejector pin 32 and the runner ejector pin 12 are arranged to face each other vertically with the lower end of the upper runner ejector pin 32 and the upper end of the runner ejector pin 12 facing the runner 9. .

A cylinder 34 such as an air cylinder is attached to the lower guide plate 24, and a loading lifter 36 is attached to the upper end of a rod 35 of the air cylinder 34. A loading frame presser 37 is disposed above the loading lifter 36, and this loading frame presser 37 and the loading lifter 3
6, the upper and lower ends of a bar 38 are rotatably connected, and a fixing member 39 and a loading frame retainer 37 are attached to the lower mold 8 and the like and are in a fixed state.
The lower end and the upper end of the bar 41 are rotatably pivoted between the bar 41 and the bar 41. The fixing member 39 can also be formed by a part of the lower mold 8. The cylinder 34, the loading lifter 36, the loading frame presser 37, and the fixing member 39 constitute the clamp soldier 13, and a pair of left and right clamp soldiers 13 are used.

In the mold apparatus formed as described above, the loading frame 5 holding a large number of electronic components 3 is moved between the upper mold 7 and the lower mold with the lower mold 43 lowered and the mold opened. The loading frame 5 is inserted between the upper mold 7 and the lower mold 8 by lifting the lower mold 43 and clamping the molds. As shown in FIG. 1, the loading frame 5 has a frame storage recess 29
The electronic component 3 that has been fitted and set and held on the loading frame 5 is housed in the cavity 6. Also, with the loading frame 5 set in this way, the loading frame 5 and the pot 19
And the positional relationship with the runner 9 is as shown in FIG. In other words, pot 19 is loading frame 5
A main runner 9a corresponding to the center of the central opening 1a of the opening 1 and communicating with the bot 19 among the runners 9.
The loading frame 5 is arranged so that the upper mold 7
and the lower mold 8. When the loading frame 5 is set in this way, the end of the loading frame 5 is clamped between the protrusion 45 of the loading lifter 36 of the clamp soldier 13 and the loading frame presser 37 as shown in FIG. , the loading frame 5 is held on the lower mold 8 with the frame plates 2, 2 closed.

After setting the loading frame 5 as described above, the sealing resin such as epoxy resin filled in the bot 19 is transferred from the bot 19 to the runner 9 by pressing the plunger 20 downward, and then from the runner 9 to the date 1.
A sealing resin is injected into each cavity 6 through 0, and the electronic components 3 in each cavity 6 are sealed with the resin to form a sealed molded product 1.
Get 1. At this time, since the runner 9 and the date 10 are formed by cutting grooves in the upper mold 8, the resin 44a filled into the runner 9 and the resin 44b filled into the date 10
is located above the lead wire 4 of the electronic component 3, as shown in FIG. After the sealing resin is injected and cured in this way, the lower mold 43 is lowered to begin mold opening, but at the beginning of mold opening, the spring 23 is activated as the lower mold 43 moves downward. The upper ejector plate 21 moves downward, and in accordance with the downward movement of the upper ejector plate 21, the upper runner ejector pin 32 also moves downward. Therefore, the resin 44a in the runner 9 provided on the lower surface of the upper mold 7 is ejected from the upper mold 7 by the upper runner ejector pin 32 and remains on the lower mold 8, and together with the resin 44a of the runner 9, the date 10 The mold opening is started so that the inner resin 44b and the molded sealing product 11 also remain on the lower mold 8.

In this way, the resin 44a inside the runner 9 is placed on the lower mold 8 side.
After completing the mold opening so that the resin 44b inside the gate 10 and the sealing molded product 11 remain, the ejector rod 2 is removed.
8 is raised to move the lower ejector plate 26 upward, and along with the upward movement of the lower ejector plate 26, the runner ejector pin 12 and the cal ejector turbine 33 are moved upward to separate their upper ends from the upper surface of the lower mold 8. It is made to protrude upward as shown in Figure 2 (shown in the same manner as Figure 1).

At this time, the loading frame 5 is held on the lower mold 8 in a clamped state between the protrusion 45 of the loading lifter 36 of the clamper 13 and the loading frame presser 37, and the molded product 11 The lead wire 4 protruding from the electronic component 3 is held between the frame plates 2 and 2 by the loading frame 5, and the encapsulation molded product 11 is fixed on the lower mold 8. The upper end of the runner ejector pin 12 pushes up part of the resin 44a of the runner, and the upper end of the cull ejector turbine 33 pushes up the cull 44e, which is the resin remaining in the cull reservoir 31. Therefore, as shown in FIG. 4(a) to FIG. 4(b), some of the resin 44a and the cull 44c have small diameters from the fixed molded molded product 11 to the run 12. The resin 44b of the date portion is cut, and the sealing molded product 11 can be separated from the resin 44a that is part of the runner. Moreover, the resin part of the runner in this date part is 44
Since the cutting a is performed immediately after the sealing molding is completed and the mold opening is completed, that is, before the sealing molded product 11 is demolded, the sealing resin has not yet been cooled and cannot be cut. It will be easy to make the cut in hot conditions and at the exact location of the date to be cut.

After the upward movement of the runner ejector pin 12 and the cal ejector turbine 33 is completed in this way, the Schilling-34
The cylinder 34 is actuated by supplying air to the rod 35, and the rod 35 is raised. The operation of the cylinder 34 may be performed automatically by an electric signal corresponding to the completion of upward movement of the ejector rod 28, or may be performed by an operator's switch operation. When the rod 35 is raised in this way, the loading lifter 36 at the upper end of the rod 35 is moved upward, and the loading frame on the lower mold 8 is moved by the loading lifter 36 as shown in FIG. 5
is lifted, and the sealed molded product 11 held on the loading frame 5 via the lead wire 4 is removed from the lower mold 8. At the same time, as the loading lifter 36 moves upward, the loading frame presser 37 is moved upward by the action of a crank mechanism using two bars 38 and 41 provided between the loading frame presser 37 and the loading lifter 36 and the fixing member 39. rotate to
The clamping of the loading frame 5 by the loading frame presser 37 is released.

Then, the loading frame 5 thus lifted onto the lower mold 8 is taken out by supporting the handle 16 by hand.

Resin 44a and cull 44c of a part of the runner separated from the sealing molded product 11 remained on the lead wire 4 held between the frame plates 2 and 2 of the loading frame 5, and these were removed. Later, loading frame 5
The frame plates 2, 2 are opened, the lead wire 4 is released from the lead wire 4, and the sealed molded product 11 is taken out to complete the work.

[Effect of the Invention 1] As described above, in the present invention, a pair of frame plates each having an opening are formed so that they can be stacked and separated with each other in a state where each frame plate is aligned with the other, and an electronic device is inserted into the opening. A loading frame that holds the lead wires of electronic components between two overlapping frame plates with the components positioned;
An upper mold and a lower mold are formed in which a cavity is formed to house the electronic components, and the loading frame is clamped and set during mold clamping, and a cavity is formed between the upper mold and the lower mold to supply sealing resin to the cavity. A runner, a date, and a runner ejector pin that is driven upward after opening the upper mold and the lower mold to push up the resin in the runner and cut the resin in the runner from the sealing molded product in the cavity at the date part. , both frame plates of the loading frame set between the upper mold and the lower mold are held on the lower mold in an overlapping state, and after the runner ejector pin is driven upward, this overlapping alignment is held. Since the loading frame is held on the lower mold by both clamps, some of the resin in the runner is pushed up by the runner ejector pin, and the resin is not connected to the loading frame via the lead wire. A part of the resin of the runner can be cut and separated from the sealed molded product held by the molding part by the date part, and it can be automatically removed from the mold without requiring manual work that increases manufacturing costs. It is possible to perform this cutting and separation immediately after molding, and it can also be carried out while the resin is still hot and easy to cut immediately after molding, and it is possible to perform this cutting and separation immediately after molding. It is possible to accurately cut the resin in a part of the runner without worrying about gate residue or cracks.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway front view of the left half of one process part in one embodiment of the present invention, and a side sectional view of the right half;
The figure is a partially cutaway front view of the left half of the other process part of the above and a side sectional view of the right half, and Figure 3 is a partially cutaway front view of the left half of the other process part of the same above. 4(a) and 4(b) are enlarged views of a part of the same, and FIGS. 5(a) and 5(b) are perspective views of the loading frame used in the same. Fig. 6 is an enlarged perspective view of a part of the loading frame, Fig. 7 is a plan view showing the positional relationship between the loading frame and the runner, and Fig. 8 is a plan view showing the positional relationship between the loading frame, the encapsulation molded product, and the runner. It is a partial plan view. 1 is an opening, 2 is a frame plate, 3 is an electronic component, 4 is a lead wire, 5 is a loading frame, 6 is a cavity, 7 is an upper mold, 8 is a lower mold, 9 is a runner, 10 is a gate, 11 is a sealed molded product, 1
2 is a runner ejector pin, and 13 is a clamp tool.

Claims (1)

[Claims] (1) A pair of frame plates, each with an opening, are stacked and separated so that the openings match, and the lead wires of the electronic component are stacked with the electronic component positioned within the opening. A loading frame that is held between both frame plates, an upper mold and a lower mold that have a cavity for storing electronic components, and which hold and set the loading frame when clamping the mold, and between the upper mold and the lower mold. A runner and a date are formed to supply the sealing resin to the cavity, and after the upper and lower molds are opened, they are driven upward to push up the resin in the runner and push the resin in the runner into the cavity at the gate part. The runner ejector pin to be cut from the sealed molded product inside and the loading frame set between the upper mold and the lower mold are held on the lower mold in a superimposed state, and the runner ejector pin is A mold device for resin sealing, comprising: a clamping tool that releases the holding of the overlapping after being driven upward.