JPS62202Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the structure of a semiconductor element holding jig.

The holding jig is used as a part of a device when a semiconductor element is assembled into a device, and as a part of a measuring jig when measuring the electrical characteristics of the element, such as thermal resistance. In this case, the jig is particularly required to have a structure that takes into account the heat dissipation of the element and to be easy to assemble. Let's take the case of measuring the thermal resistance of a diode as an example and explain its conventional structure as follows.
As shown in the figure.

As shown in FIG. 1, the conventional measurement jig has an inner conductor holder 1 inside an outer conductor holder 2, and a diode 3 in a cross-slit section provided at the bottom of the inner conductor holder 1. The structure is such that the heat sink side that acts as one electrode is pushed in, tightened and fixed with the inner conductor holder 1, the holder is screwed into the heat dissipation block 4, and the other electrode terminal is brought into contact and fixed.

In this structure, the heat dissipation characteristics vary depending on the variation in the tightening force used by the person performing the test, and if the tightening force is weak, the element may be thermally destroyed. Furthermore, work efficiency was extremely poor due to the large number of assembly steps. especially,
The measurement jig must allow easy attachment and detachment of elements.

It is an object of the present invention to provide a holding jig that overcomes these conventional drawbacks, improves assembly work efficiency, and strengthens element mounting force.

According to the present invention, the inner conductor holder has a coil spring built into the outer conductor holder, and the chuck section on which the element is mounted has a cross slot.By applying pressure to the coil spring, the chuck section is pushed down and the cross slot section is expanded. After the element is inserted into the holding jig, the outer conductor holder tightens the chuck part by removing the pressure of the coil spring, thereby electrically and mechanically holding and fixing the chuck part. You can get the ingredients.

Hereinafter, one embodiment of the present invention will be described in more detail with reference to the drawings.

FIG. 2 is a sectional view of a holding jig showing an embodiment of the present invention. 12 is a hollow outer conductor holder. One end of the hollow portion of this holder 12 is widened into a horn shape, and the other end has a larger diameter than the inside. The inner conductor holder 11 has a horn-shaped tip chuck portion that matches the horn-shaped hollow end portion of the outer conductor holder 12, and the chuck portion is provided with a cross slot. The diameter of this cross slot is
When the inner conductor holder 11 comes out from the horn-shaped hollow end of the outer conductor holder 12, it has a diameter slightly larger than the electrode diameter of the diode to be attached (10 to several tens of μm).
m). The inner conductor holder 11 is threaded on the opposite side from the tip chuck. When attaching the outer conductor holder 12 and the inner conductor holder 11, the inner conductor holder 11 is attached to the outer conductor holder 1.
The holder 11 is inserted from the side of the horn-shaped hollow end of the holder 2, and is passed inside a restoring force object, such as a coil spring 17, inserted from the side opposite to the horn-shaped hollow end.
Then, attach the spring pressure adjusting nut 15 to the inner conductor holder 11.
When the force of the coil spring 17 is absorbed by the weight of the holder 11 and the nut 15, the horn-shaped tip chuck of the holder 11 is prevented from protruding from the horn-shaped hollow end of the outer conductor holder 12. Note that a Teflon washer 16 is inserted between the nut 15 and the coil 17 in order to reduce the friction generated between them.

Next, mounting of the diode 13 will be explained.
In this installation, the spring pressure adjusting nut 15 side is placed downward, and pressure is applied to the nut 15 to push up the inner conductor holder 11. As a result, the inner conductor holder 1
The chuck portion of No. 1 protrudes from the horn-shaped hollow end portion of the outer conductor holder 12, and the cross slot opens. A heat sink acting as one electrode of the diode 13 is inserted into this relaxed chuck portion, and then the pressure applied to the nut 15 is removed. As a result, the restoring force of the spring 17 causes the inner conductor holder 11 to
is lowered, the cross slot in the chuck portion is compressed, and the diode 13 is fixed. This fixed pressure is controlled by the shape of the horn and the diameter of the cross slot, and is a constant pressure. The holder holding and fixing the diode 13 is screwed into the heat dissipation block 14 and adjusted so that the other electrode terminal of the diode 13 has electrical contact.

As a result, the holder is moved by the diode 13 with a constant force.
Since it can be fixed, the heat dissipation effect is good and the electrical characteristics can be measured stably. Moreover, not only is it extremely easy to install and remove the diode 13, but it is also ideal for automation.

The present invention can be fully applied not only to diode elements but also as a holding jig for other semiconductor elements (ICs, transistors, etc.), and is particularly effective in application to measurement devices and microwave oscillation devices. Furthermore, by manufacturing the holder to match the shape of the element, it can be used as a holding jig of any shape.
There is also no increase in contact resistance that occurs when a large current is passed through the element.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a conventional holding jig, and Fig. 2 is a sectional view of a conventional holding jig.
1 is a sectional view of a holding jig showing an embodiment of the present invention. 1, 11... Inner conductor holder, 2, 12... Outer conductor holder, 3, 13... Diode, 4, 14...
...Heat radiation block, 15...Spring pressure adjustment nut, 1
6...Teflon washsha, 17...Coil spring.

Claims (1)

[Scope of utility model registration request] The outer conductor holder has a hollow structure with one end of the hollow having a horn shape, and a tip chuck having a shape matching the horn-shaped hollow end and having a slot for inserting a semiconductor element. an inner conductor holder; and a springy object that is located inside the outer conductor holder and holds the inner conductor holder in the outer conductor holder by a restoring force; The inner conductor holder is made to protrude from the outer conductor holder, the slot in the tip chuck is opened, a semiconductor element is inserted into the opened slot, and the pressure on the inner conductor holder is removed, thereby reducing the springiness. A holding jig for a semiconductor element, characterized in that the internal conductor holder is returned to its original position by the restoring force of the object, thereby deflating the slot and fixing the semiconductor element.