JPS62260060A - ウエ−ハ操作ア−ムを組み込んだバルブ - Google Patents

ウエ−ハ操作ア−ムを組み込んだバルブ

Info

Publication number
JPS62260060A
JPS62260060A JP62089967A JP8996787A JPS62260060A JP S62260060 A JPS62260060 A JP S62260060A JP 62089967 A JP62089967 A JP 62089967A JP 8996787 A JP8996787 A JP 8996787A JP S62260060 A JPS62260060 A JP S62260060A
Authority
JP
Japan
Prior art keywords
valve
wafer
wedge
arm
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62089967A
Other languages
English (en)
Japanese (ja)
Inventor
フレデリック・ピー・レイマン
フィリップ・エム・ホブソン
ポール・エイチ・ディック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS62260060A publication Critical patent/JPS62260060A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B23Q7/043—Construction of the grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B23Q7/046—Handling workpieces or tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Warehouses Or Storage Devices (AREA)
JP62089967A 1986-04-17 1987-04-14 ウエ−ハ操作ア−ムを組み込んだバルブ Pending JPS62260060A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/853,276 US4764076A (en) 1986-04-17 1986-04-17 Valve incorporating wafer handling arm
US853276 1986-04-17

Publications (1)

Publication Number Publication Date
JPS62260060A true JPS62260060A (ja) 1987-11-12

Family

ID=25315581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62089967A Pending JPS62260060A (ja) 1986-04-17 1987-04-14 ウエ−ハ操作ア−ムを組み込んだバルブ

Country Status (4)

Country Link
US (1) US4764076A (de)
EP (1) EP0242997A2 (de)
JP (1) JPS62260060A (de)
KR (1) KR870009816A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03166365A (ja) * 1989-11-27 1991-07-18 Tokyo Electron Ltd プラズマ処理装置

Families Citing this family (325)

* Cited by examiner, † Cited by third party
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US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
US5110249A (en) * 1986-10-23 1992-05-05 Innotec Group, Inc. Transport system for inline vacuum processing
US4842683A (en) * 1986-12-19 1989-06-27 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
US5435682A (en) * 1987-10-15 1995-07-25 Advanced Semiconductor Materials America, Inc. Chemical vapor desposition system
US5156521A (en) * 1987-10-15 1992-10-20 Epsilon Technology, Inc. Method for loading a substrate into a GVD apparatus
US5092728A (en) * 1987-10-15 1992-03-03 Epsilon Technology, Inc. Substrate loading apparatus for a CVD process
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
EP0350752B1 (de) * 1988-07-15 1993-10-13 Balzers Aktiengesellschaft Haltevorrichtung für eine Scheibe sowie Anwendung derselben
EP0370188B1 (de) * 1988-11-17 1998-07-15 Balzers Aktiengesellschaft Transporteinrichtung und Vakuumkammer mit einer solchen Einrichtung sowie Verfahren zum Beschicken und Entleeren einer Bearbeitungskammer
NL8900544A (nl) * 1989-03-06 1990-10-01 Asm Europ Behandelingsstelsel, behandelingsvat en werkwijze voor het behandelen van een substraat.
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
ES2062595T3 (es) * 1990-04-20 1994-12-16 Applied Materials Inc Aparato y metodo de una valvula de hendidura.
JP2598353B2 (ja) * 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
FR2697003B1 (fr) * 1992-10-16 1994-11-18 Commissariat Energie Atomique Système de manipulation et de confinement d'objets plats dans des boîtes individuelles.
US5382126A (en) * 1992-03-30 1995-01-17 Leybold Ag Multichamber coating apparatus
DE4312406C2 (de) * 1993-04-16 1996-07-11 Mikron S A Agno Verfahren und Vorrichtung zum getakteten Transport von Werkstücken oder Werkstückträgern in Transferstraßen oder Transfermaschinen
JP3200282B2 (ja) * 1993-07-21 2001-08-20 キヤノン株式会社 処理システム及びこれを用いたデバイス製造方法
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JPH09289241A (ja) * 1996-04-22 1997-11-04 Shinkawa Ltd ウェーハ搬送装置
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JP4522139B2 (ja) * 2003-09-19 2010-08-11 大日本スクリーン製造株式会社 基板処理ユニット、基板載置状態検出方法および基板処理装置
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JPH03166365A (ja) * 1989-11-27 1991-07-18 Tokyo Electron Ltd プラズマ処理装置

Also Published As

Publication number Publication date
US4764076A (en) 1988-08-16
KR870009816A (ko) 1987-11-30
EP0242997A2 (de) 1987-10-28

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