JPS62291925A - Centrifugal drying device for semiconductor wafer - Google Patents

Abstract

PURPOSE:To alleviate the adherence of mist and dust to a wafer by feeding ultrapure water from a nozzle provided on the top of the inner wall of a semiconductor wafer centrifugal drying device to the whole surface of the inner wall. CONSTITUTION:Ultrapure water 7 is fed from the port 2 of a nozzle 1 to the whole surface of an inner wall 5, and water 13 scattered from a wafer 4 is collided with the wall 5 by mean of centrifugal force based on the rotation of a carrier 30. In this case, mist 14 is scattered toward the bottom 6 of the device according to a composite vector 12 of a vector component 11 of the water 7 and a vector component 10 of the wafer direction of the mist reflected on the wall 5, and exhausted together with the water 7 from a hole 3. A cover 20 is placed on the device. Since moisture in the device is raised, a static electricity on the wafer 4 generated by a friction with air is alleviated. According to the structure, dusts 8 in the device is cumulatively exhausted through the hole 3 together with the water to alleviate the adherence of mist and dust for causing the wafer to be contaminated.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a semiconductor wafer centrifugal drying apparatus used in a semiconductor manufacturing process.

BACKGROUND ART As shown in FIG. 3, in a conventional semiconductor wafer centrifugal drying apparatus, when a semiconductor wafer is centrifugally dried, attached water 2 flying from the semiconductor wafer 4 collides with the apparatus inner wall 1 and bounces off, forming mist. 3 and was reattached to the semiconductor wafer 4.

Problems to be Solved by the Invention When semiconductor wafers are centrifugally dried, water adhering to semiconductor wafers collides with the inner wall of the apparatus due to centrifugal force and bounces back toward the semiconductor wafer, forming mist, which then re-adheres to the semiconductor wafer. Further, static electricity is generated on the semiconductor wafer due to friction between the air inside the device and the semiconductor wafer rotating at high speed, and dust inside the device is attracted onto the semiconductor wafer. Furthermore, when semiconductor wafers are centrifugally dried one after another, the inside of the apparatus becomes cumulatively contaminated with dust. Therefore, these mist and dust cause contamination of semiconductor wafers.

The present invention aims to solve the above-mentioned problems of the conventional method and to reduce the adhesion of mist and dust to semiconductor wafers.

Means for Solving the Problems In order to achieve this object, the present invention has the following configuration. That is, the semiconductor wafer centrifugal drying apparatus according to the present invention has an ultrapure water nozzle at the upper part of the inner wall of the apparatus. is provided so that ultrapure water can be constantly flowed from the upper part of the inner wall to the lower part of the inner wall along the inner wall, preferably over the entire inner wall, including in a centrifugal drying state.

When drying semiconductor wafers by centrifugation, the ultrapure water nozzle installed at the top of the inner wall of the equipment pumps ultrapure water along the inner wall from the top of the inner wall to the bottom of the inner wall. By flowing the water over the entire surface of the inner wall, when the adhered water that has been blown away from the semiconductor wafer due to centrifugal force collides with the inner wall of the equipment, the ultrapure water flows along the inner wall from the upper part of the inner wall to the lower part of the inner wall. Due to the vector component, the splashed adhered water, ie, mist, flies toward the bottom of the device. In addition, by flowing ultrapure water along the inner walls of the equipment, the humidity inside the equipment does not increase, and static electricity generated on the semiconductor wafers due to friction between the semiconductor wafers rotating at high speed and the air inside the equipment is reduced. This makes it possible to reduce dust adhesion to semiconductor wafers. In addition, by constantly flowing ultrapure water along the inside wall of the equipment, including when semiconductor wafers are being centrifugally dried, the dust inside the equipment can be drained at the same time as the ultrapure water from the drainage port at the bottom of the inside wall of the equipment. The interior can always be kept clean with very little dust.

Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2.

When centrifugally drying a semiconductor wafer 4 placed on a carrier 30 in the main body, ultrapure water 7 is sprayed from the upper part of the inner wall to the lower part of the inner wall from the outlet 2 of the ultrapure water nozzle 1 provided at the upper part of the inner wall 5 of the apparatus main body. By flowing the flow along the inner wall 5 over the entire surface of the inner wall, centrifugal force based on the rotation of the carrier 30 by a rotary power mechanism (not shown) causes the semiconductor wafer 4 to be removed from the inner wall 6.
When the adhering water 13 that has been blown toward collides with the inner wall 6, it is caused by a vector component 11 from the top to the bottom of the ultrapure water 7 flowing along the inner wall 6 from the upper part of the inner wall to the lower part of the inner wall, and the centrifugal force. The adhering water 13 that has been blown away from the conductor wafer 4 toward the inner wall 6 collides with the inner wall 6, and the adhering water that has bounced back, that is, the vector component 10 of the mist from the inner wall 5 toward the semiconductor wafer 4 side, is synthesized. According to the vector component 12, the mist 1o flies toward the bottom 6 of the device and is drained from the drain port 3 together with the ultrapure water 7. 20 is a lid on the top of the main body and is placed on the top @ Also, by flowing ultrapure water 7 from the top of the inner wall to the bottom of the inner wall along the inner wall 5 and over the entire inner wall υ, the humidity inside the device increases. By rotating the device at high speed, it is possible to reduce static electricity that is generated on the semiconductor wafer 4 due to friction between the semiconductor wafer 4 and the air inside the device, which causes dust 8 to be attracted to the semiconductor wafer 4. Furthermore, the ultrapure water 7 is used at all times, including the centrifugal drying state of the semiconductor wafer 4.
By flowing the dust from the upper part of the inner wall to the lower part of the inner wall along the inner wall 5 along the entire inner wall, 8 liters of dust cumulatively generated in the apparatus by centrifugally drying the semiconductor wafers 4 one after another is collected from the drain port 3 together with ultrapure water. By discharging the device, the number of dust 8 that causes contamination of the semiconductor wafer 4 inside the device can be kept at a very small amount, and the device can be kept in a clean state.

Therefore, the mist 1 that causes contamination of the semiconductor wafer 4
4 and the adhesion of dust 8 to the semiconductor wafer 4 can be reduced.

Effects of the Invention The semiconductor wafer centrifugal drying apparatus according to the present invention has the above-described configuration, and the ultrapure water nozzle provided at the upper part of the inner wall of the apparatus supplies ultrapure water along the inner wall from the upper part of the inner wall to the lower part of the inner wall. By constantly flowing the semiconductor wafer over the entire surface of the inner wall, including during centrifugal drying of the semiconductor wafer, it is possible to reduce the adhesion of mist and dust, which cause contamination of the semiconductor wafer, to the semiconductor wafer. Therefore, the practical effects of the present invention are great.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor wafer centrifugal drying apparatus showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a part of the semiconductor wafer centrifugal drying apparatus showing an embodiment of the present invention, and FIG. 3 is a conventional 1 of the semiconductor wafer centrifugal dry inspection equipment! It is a square view. 1... Ultrapure water nozzle, 2... Outlet,
3...Drain port, 4,=,=semiconductor wafer,
6...Inner wall, 6...Bottom, 7...
...Ultra pure water, 8...Dust, 10...
Vector component from the inner wall of the mist to the center of the device, 11.
...Vector component from the top to the bottom of ultrapure water, 12...Synthetic vector component, 13...
・Adhesive water, 14...mist. Name of agent: Patent attorney Toshio Nakao and 1 other person 8~
Dust No. 10 n:, Figure 32

Claims (1)

[Claims] A main body having at least a cylindrical inner wall, an ultrapure water nozzle located on the upper part of the inner wall of the main body that can flow ultrapure water along the inner wall and onto the inner wall surface, a semiconductor wafer installed inside the main body and rotated, and a mist. , a drain port capable of draining dust and ultrapure water is provided, and the ultrapure water is flowed from the ultrapure water nozzle on the upper part of the inner wall to the lower part of the inner wall along the inner wall surface when drying the semiconductor wafer. Semiconductor wafer centrifugal drying equipment configured as follows.