JPS6230127A - Production of paper phenolic resin laminated board - Google Patents
Production of paper phenolic resin laminated boardInfo
- Publication number
- JPS6230127A JPS6230127A JP16932285A JP16932285A JPS6230127A JP S6230127 A JPS6230127 A JP S6230127A JP 16932285 A JP16932285 A JP 16932285A JP 16932285 A JP16932285 A JP 16932285A JP S6230127 A JPS6230127 A JP S6230127A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- heat
- powder
- thermoplastic resin
- resistant thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 18
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000843 powder Substances 0.000 claims abstract description 12
- 239000002966 varnish Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000077 silane Inorganic materials 0.000 abstract description 3
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 11
- 239000000123 paper Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002383 tung oil Substances 0.000 description 3
- 239000004927 clay Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
（産業上の利用分野）
本発明は打抜加工性、寸法安定性に優れ、そり、ねじれ
の少ない紙フェノール樹脂状ノー板の製造法に関するも
のである。
（従来の技術）
一般にプリント回路用基板として使用する紙フェノール
樹脂積層板および銅張積層板は電気特性、熱的特性、機
械的特性が要求されるのは勿論であるが積層板の加工面
からみると、低温打抜加工性、そ夛、ねじれの少ないこ
と、寸法安定性の優れていることが要求されている。
従来よりこのような特性の改良方式として、フェノール
樹脂ワニスにチタン白、クレー、タルク、水酸化アルミ
ニウム等の無機質充填材を混脅し紙基材に含浸、乾燥し
成形して紙フェノール積層板を得ている。
（発明が解決しようとする問題点）
しかしながら充填剤が無機質であるため％に打抜加工性
において打抜ピンの摩耗を促進したシ、樹脂との層間接
着が弱く、層間はくシが発生しやすい。また無機質の種
類によっては積層板の透明性をそこなうという欠点を有
している。
本発明はこのような点に鑑みてなされたもので、打抜加
工性に優れ眉間はくりの生じない、しかも外観の良好な
積層板の製造法を提供するものである。
（問題点を解決するための手段）
本発明は、耐熱性熱可塑性樹脂パウダーを充填材として
５〜４０％（Ｆｉ１％以下同じ）七株加混合したフェノ
ール樹脂ワニス金紙基材に含浸、乾燥してプリプレグを
得、このプリプレグの必要枚数を加熱加圧することを特
徴とするものである。
すなわち本発明は通常の製法で作成された耐熱性熱可塑
性樹脂パウダーをフェノール樹脂(Industrial Application Field) The present invention relates to a method for producing a paper phenolic resin-like blank board that has excellent punching workability and dimensional stability, and is less warped and twisted. (Prior art) Paper phenolic resin laminates and copper-clad laminates that are generally used as printed circuit boards are required to have electrical properties, thermal properties, and mechanical properties, but also from the processing side of the laminates. As a result, it is required to have good low-temperature punching workability, low warping and twisting, and excellent dimensional stability. Traditionally, as a method for improving these properties, paper phenol laminates were obtained by impregnating a mixed paper base material with phenolic resin varnish and inorganic fillers such as titanium white, clay, talc, and aluminum hydroxide, then drying and molding. ing. (Problems to be solved by the invention) However, since the filler is inorganic, it promotes wear of the punching pin in terms of punching processability, and the interlayer adhesion with the resin is weak, causing interlayer delamination. Cheap. Furthermore, depending on the type of inorganic material, the transparency of the laminate may be impaired. The present invention has been made in view of these points, and provides a method for manufacturing a laminate that has excellent punching workability, does not cause glabellar peeling, and has a good appearance. (Means for Solving the Problems) The present invention consists of impregnating a gold paper base material with a phenolic resin varnish containing 5 to 40% (same as less than 1% Fi) of heat-resistant thermoplastic resin powder as a filler and drying it. The method is characterized in that prepreg is obtained by heating and pressurizing the required number of prepregs. In other words, the present invention uses heat-resistant thermoplastic resin powder produced by a normal manufacturing method as a phenolic resin.
【難燃性を要求される
ものに対しては難燃剤を添加もしくは反応させたもの】
に対して５〜４０％更に必要に応じてカップリング剤（
アミノシラン系、シラン系等）ｆ：充填材に対して１５
〜５重量％添加してなるフェノール樹脂ワニスを紙基材
に含浸、乾燥したフェノール樹脂含浸紙（プリプレグ）
を所要枚数積層して成形プレスにて加熱加圧成形するこ
とを特徴とするものである。用いられる熱可塑性樹脂は
耐熱性の点から融点又は熱変型温度が１６０℃以上が望
ましく、実用性レベルから２００°Ｃ以上が好ましい。
例えばポリエーテルケトンオン、ポリエーテルイミド、
ポリエーテルケトン等が用いられる。パウダーの粒度は
２５メツシュ以上でるｎばいくら細くても良いが、４０
〜６００メツシ二が好ましい。本発明において充填剤ｔ
−５〜４０％と限定した理由は、添加量が５％未満の場
合には、打抜加工性、寸法安定性に満足した結果が得ら
れず、又４０ｆｆｔ量％を超えた場合にはフェノール樹
脂ワニスの粘度が高くなシ、作業性、含浸性が悪くなり
、積層板特注に悪影響を与えるのに対して、添加量が５
〜４０３１１（童％の場合はかかる欠点がなく、本発明
の効果が達せらｎるためである。またフェノール樹脂に
シラン系カブプリング剤（アミノシランエポキシシラン
他）を充填材に対して（１５〜５％添加することが好ま
しい。また本発明は他の熱硬化性樹脂（ポリエステル樹
脂、エポキシ樹脂、メラミン樹脂地）Ｋ対し も同様の
効果がある。
実施例１
フェノール樹脂（桐油変性−Ｊｌ、５０％）：１００賞
量部
ポリエーテル丈ルホン樹脂パウダー：
５ｏ３１ｉｋ部
のワニス組Ｍ、を溶剤を用いてワニス樹脂分を４５〜５
０％に訓整し、クラフト紙に含浸乾燥し、付着柳脂貴４
８〜５２％のフェノール樹脂含浸紙を得た。所要枚数を
重ね付せ、圧力１５０ｋｇ／Ｕ、温度１６５℃で６０分
間成形して１．６ｍｍの厚さの片面鋼張り積層板を作成
した。
実施例２
フェノール樹脂（桐油変性量５０％）＝１００重量部
四フッ化エチレン樹脂パウダー：
５５重量部
のワニス組成を用いて、他は実施例１に準じて１．６ｍ
ｍ片面鋼張積層板を作成した。
比較例１
上記実施例１において充填材を重加せず、他は実施例１
に準じて１．６１片面輪張積層板全作成した。
比較例２
フェノール樹脂（桐油変性量５０％）＝１００重量部
バーゲスクレー ： ５ｓ’Ｍｆ＃Ｗ１５
のワニス組成を用いて他は実施例１に準じて１゜６１１
１１１１片面銅張ａｔ層板を作成した。
実施例、比較例により得られた片面銅張積層載の性能を
表１に示した。表１の結果より明らかなように本発明の
実施例においては、打抜加工性、寸法変化率が優れてい
るが、充填剤なしの比較例１は打抜加工性、寸法特性が
、無機充填材添加の比較例２は耐熱性、打抜加工性、打
抜ピンの摩耗が有シ、前記緒特性の何ねかに問題があり
満足すべきものとは云い難い。
ｄ−Ｆ金白
（発明の効果）
以上脱明したように耐熱性熱可塑性樹脂パウダーを充填
剤として用いた紙フェノール樹脂積ＩＯ板および銅張積
層物は、打抜加工性、寸法安定性に優れ、かつ電気的、
機械的特性が良好である。[For items that require flame retardancy, flame retardants are added or reacted]
5 to 40% of the amount, and if necessary, a coupling agent (
aminosilane type, silane type, etc.) f: 15 for filler
Phenol resin-impregnated paper (prepreg) obtained by impregnating a paper base material with ~5% by weight of phenolic resin varnish and drying it.
It is characterized by laminating a required number of sheets and molding them under heat and pressure in a molding press. The thermoplastic resin used preferably has a melting point or thermal deformation temperature of 160° C. or higher from the viewpoint of heat resistance, and preferably 200° C. or higher from a practical level. For example, polyetherketone, polyetherimide,
Polyetherketone or the like is used. The particle size of the powder can be as fine as 25 mesh or more, but 40
~600 meters is preferred. In the present invention, the filler t
- The reason for limiting the amount to 5 to 40% is that if the amount added is less than 5%, satisfactory results in punching workability and dimensional stability cannot be obtained, and if it exceeds 40 fft amount %, phenol The viscosity of resin varnish is high, and the workability and impregnation properties are poor, which has a negative impact on custom-made laminates, but the addition amount of 5
~ 40311 (Child%) does not have this drawback and the effect of the present invention cannot be achieved.Also, if the phenol resin is mixed with a silane-based coupler (aminosilane, epoxysilane, etc.) for the filler (15~5%). The present invention also has similar effects on other thermosetting resins (polyester resins, epoxy resins, melamine resins).Example 1 Phenolic resin (tung oil modified-Jl, 50% ): 100 parts polyether length sulfone resin powder: 5 o 31 ik part varnish set M, using a solvent to reduce the varnish resin content to 45 to 5
0%, impregnated into kraft paper, dried, and adhered to Yanagi Ginkaku 4
A paper impregnated with 8-52% phenolic resin was obtained. The required number of sheets were stacked and molded at a pressure of 150 kg/U and a temperature of 165° C. for 60 minutes to create a single-sided steel-clad laminate with a thickness of 1.6 mm. Example 2 Phenol resin (modified amount of tung oil 50%) = 100 parts by weight Tetrafluoroethylene resin powder: 1.6 m using 55 parts by weight of varnish composition, other than Example 1
A single-sided steel-clad laminate was prepared. Comparative Example 1 The filler was not added in Example 1, except for Example 1.
All 1.61 single-sided ring-strapped laminates were prepared according to the method. Comparative Example 2 Phenol resin (modified amount of tung oil 50%) = 100 parts by weight Burgess clay: 5s'Mf#W15
The varnish composition was 1°611 according to Example 1 except for the following.
A 1111 single-sided copper-clad AT laminate was prepared. Table 1 shows the performance of the single-sided copper-clad laminates obtained in Examples and Comparative Examples. As is clear from the results in Table 1, the examples of the present invention have excellent punching workability and dimensional change rate, but Comparative Example 1 without filler has excellent punching workability and dimensional characteristics. Comparative Example 2 in which the material was added had problems in heat resistance, punching workability, wear of the punching pin, and some of the above-mentioned properties, and could hardly be said to be satisfactory. d-F Kinpaku (Effects of the Invention) As revealed above, paper phenolic resin laminated IO boards and copper-clad laminates using heat-resistant thermoplastic resin powder as a filler have excellent punching workability and dimensional stability. Excellent and electrical
Good mechanical properties.
Claims (1)
４０重量％を添加混合したフェノール樹脂ワニスを紙基
材に含浸、乾燥してプリプレグを得、このプリプレグの
必要枚数を加熱加圧することを特徴とする紙フェノール
樹脂積層板の製造方法。 ２、パウダーの粒度が２０〜３００メッシュである特許
請求の範囲第１項記載の紙フェノール樹脂積層板の製造
法。 ３、耐熱性熱可塑性樹脂の融点又は熱変型温度が１６０
℃以上である特許請求の範囲第１項又は第２項記載の紙
フェノール樹脂積層板の製造法。[Claims] 1. Heat-resistant thermoplastic resin powder as a filler 5-
A method for manufacturing a paper phenolic resin laminate, which comprises impregnating a paper base material with a phenolic resin varnish mixed with 40% by weight, drying to obtain a prepreg, and heating and pressurizing the required number of prepregs. 2. The method for producing a paper phenolic resin laminate according to claim 1, wherein the powder has a particle size of 20 to 300 mesh. 3. The melting point or heat deformation temperature of the heat-resistant thermoplastic resin is 160
The method for producing a paper phenolic resin laminate according to claim 1 or 2, wherein the temperature is at least ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16932285A JPS6230127A (en) | 1985-07-31 | 1985-07-31 | Production of paper phenolic resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16932285A JPS6230127A (en) | 1985-07-31 | 1985-07-31 | Production of paper phenolic resin laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230127A true JPS6230127A (en) | 1987-02-09 |
Family
ID=15884395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16932285A Pending JPS6230127A (en) | 1985-07-31 | 1985-07-31 | Production of paper phenolic resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230127A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381341A (en) * | 1989-08-25 | 1991-04-05 | Nippon Steel Chem Co Ltd | Prepreg manufacturing method |
| JPH0381340A (en) * | 1989-08-25 | 1991-04-05 | Nippon Steel Chem Co Ltd | Phenolic resin prepreg |
| WO1997014281A1 (en) * | 1995-10-10 | 1997-04-17 | Alliedsignal Inc. | Reducing dusting of epoxy laminates |
-
1985
- 1985-07-31 JP JP16932285A patent/JPS6230127A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381341A (en) * | 1989-08-25 | 1991-04-05 | Nippon Steel Chem Co Ltd | Prepreg manufacturing method |
| JPH0381340A (en) * | 1989-08-25 | 1991-04-05 | Nippon Steel Chem Co Ltd | Phenolic resin prepreg |
| WO1997014281A1 (en) * | 1995-10-10 | 1997-04-17 | Alliedsignal Inc. | Reducing dusting of epoxy laminates |
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