JPS6230349U - - Google Patents

Info

Publication number
JPS6230349U
JPS6230349U JP1985122918U JP12291885U JPS6230349U JP S6230349 U JPS6230349 U JP S6230349U JP 1985122918 U JP1985122918 U JP 1985122918U JP 12291885 U JP12291885 U JP 12291885U JP S6230349 U JPS6230349 U JP S6230349U
Authority
JP
Japan
Prior art keywords
dielectric substrate
metal base
fixed
base block
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985122918U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985122918U priority Critical patent/JPS6230349U/ja
Publication of JPS6230349U publication Critical patent/JPS6230349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図はこの考案による半導体装置の一実施例
を示す断面図、第２図は従来の半導体装置の一例
を示す断面図である。 １…電界効果トランジスタ、２ａ…ゲート電極
、２ｂ…ソース電極、２ｃ…ドレイン電極、３…
半田、４…誘電体基板、５…金属基体ブロツク、
５―１…ソース電極部、６…隙間部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属基体ブロツク上に半導体素子の一つの電極
    が固着され、かつ該金属基体ブロツクをはさんで
    誘電体基板が配置固着され、該誘電体基板の表面
    に入出力用金属化層が設けられていて、該金属化
    層に前記半導体素子の他電極が固着されてなる半
    導体装置において、前記金属基体ブロツクと前記
    誘電体基板の間に隙間部を設けたことを特徴とす
    る半導体装置。
JP1985122918U 1985-08-07 1985-08-07 Pending JPS6230349U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985122918U JPS6230349U (ja) 1985-08-07 1985-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122918U JPS6230349U (ja) 1985-08-07 1985-08-07

Publications (1)

Publication Number Publication Date
JPS6230349U true JPS6230349U (ja) 1987-02-24

Family

ID=31013555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985122918U Pending JPS6230349U (ja) 1985-08-07 1985-08-07

Country Status (1)

Country Link
JP (1) JPS6230349U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01138820A (ja) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd ワイヤレス発信器
JPH01138819A (ja) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd ワイヤレス発信器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01138820A (ja) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd ワイヤレス発信器
JPH01138819A (ja) * 1987-11-26 1989-05-31 Matsushita Electric Works Ltd ワイヤレス発信器

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