JPS6230350U - - Google Patents

Info

Publication number
JPS6230350U
JPS6230350U JP1985122919U JP12291985U JPS6230350U JP S6230350 U JPS6230350 U JP S6230350U JP 1985122919 U JP1985122919 U JP 1985122919U JP 12291985 U JP12291985 U JP 12291985U JP S6230350 U JPS6230350 U JP S6230350U
Authority
JP
Japan
Prior art keywords
heat dissipation
substrate
dissipation base
semiconductor device
section made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985122919U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985122919U priority Critical patent/JPS6230350U/ja
Publication of JPS6230350U publication Critical patent/JPS6230350U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07351Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors

Description

【図面の簡単な説明】
第1図はこの考案の一実施例による半導体装置
の概略断面図、第2図は従来の半導体装置を示す
概略断面図である。 1…基板、2…放熱基体、21…放熱部、22
…取付部、23…取付穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を装着した基板と、該基板を支持す
    る放熱基体を備え、この放熱基体を取付部材へ取
    付けてなる半導体装置において、前記放熱基体は
    、前記基板よりの発生熱を放熱する熱伝導性の良
    い金属からなる放熱部と、前記取付部材へ取付け
    可能に形成された前記放熱部より軽い材料からな
    る取付部とから構成したことを特徴とする半導体
    装置。
JP1985122919U 1985-08-07 1985-08-07 Pending JPS6230350U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985122919U JPS6230350U (ja) 1985-08-07 1985-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122919U JPS6230350U (ja) 1985-08-07 1985-08-07

Publications (1)

Publication Number Publication Date
JPS6230350U true JPS6230350U (ja) 1987-02-24

Family

ID=31013557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985122919U Pending JPS6230350U (ja) 1985-08-07 1985-08-07

Country Status (1)

Country Link
JP (1) JPS6230350U (ja)

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