JPS6231121A - Chuck for object to be exposed and reduction stepper using the same - Google Patents
Chuck for object to be exposed and reduction stepper using the sameInfo
- Publication number
- JPS6231121A JPS6231121A JP60169877A JP16987785A JPS6231121A JP S6231121 A JPS6231121 A JP S6231121A JP 60169877 A JP60169877 A JP 60169877A JP 16987785 A JP16987785 A JP 16987785A JP S6231121 A JPS6231121 A JP S6231121A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- exposed
- focus
- exposure
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は一般に半導体焼付用露光装置に関するものであ
り、特に半導体焼付用露光装置における被露光物体の矯
正チャックに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention generally relates to an exposure apparatus for semiconductor printing, and more particularly to a correction chuck for an object to be exposed in an exposure apparatus for semiconductor printing.
[従来の技術]
従来の半導体焼付用露光装置のレンズの設計では露光面
を平面とし、その平面で最良の像が得られるようにして
いたし、チャックは被露光物体を極力平面に矯正するよ
うに設計されていた。[Prior Art] In the conventional lens design of exposure equipment for semiconductor printing, the exposure surface is made flat so that the best image can be obtained on that plane, and the chuck is designed to correct the exposed object to be as flat as possible. It was designed.
ところで近来、露光装置の解像力が向上するにつれてそ
の解像力の得られる焦点深度はますます浅くなってきて
い、る。そのため露光面積全体でよい解像力を得るには
、レンズの像面湾曲も小さくする必要があり、そしてこ
のことはレンズ設計において大きな制約となっている。However, as the resolving power of exposure apparatuses has improved in recent years, the depth of focus that provides that resolving power has become shallower and shallower. Therefore, in order to obtain good resolving power over the entire exposed area, it is necessary to reduce the field curvature of the lens, and this is a major constraint in lens design.
[発明が解決しようとする問題点とその解決手段]本発
明の目的は、半導体露光装置において現在使用し得るレ
ンズの焦点深度を実質的に深くすると共に、レンズの設
計における像面湾曲についての制約を緩和できるように
することであり、そしてこの目的は本発明に従って、露
光装置の投影系により投影される像面の湾曲に一致する
曲面から成る矯正面を備える被露光物体用チャックによ
り達成される。[Problems to be Solved by the Invention and Means for Solving the Problems] An object of the present invention is to substantially increase the depth of focus of lenses currently available in semiconductor exposure equipment, and to solve constraints regarding field curvature in lens design. and this object is achieved according to the invention by a chuck for an exposed object comprising a correction surface consisting of a curved surface that corresponds to the curvature of the image plane projected by the projection system of the exposure device. .
[実施例]
第1図は本発明の被露光物体用チャックの実施例の使用
状態を示す側面図である。第2図は本発明の被露光物体
用チャックを設けた縮小投影型露光装置の斜視図であり
、第1図と同様に使用状態を示している。[Example] FIG. 1 is a side view showing a state in which an example of the chuck for an exposed object of the present invention is used. FIG. 2 is a perspective view of a reduction projection type exposure apparatus equipped with a chuck for an exposed object according to the present invention, and shows a state of use similar to FIG. 1.
これらの図において、1は露光装置の投影系部分、2は
被露光物体、3は被露光物体を矯正するチャックである
。4はある像高中心のフォーカス位置を表わし、5は別
の像高でのフォーカス位置を表わす。6は被露光物体の
保持部である。In these figures, 1 is a projection system portion of an exposure apparatus, 2 is an object to be exposed, and 3 is a chuck for correcting the object to be exposed. 4 represents a focus position at the center of a certain image height, and 5 represents a focus position at another image height. Reference numeral 6 denotes a holding section for the object to be exposed.
第1図に示すように、チャック3によって被露光物体2
を図に示すように矯正することにより、すべての像高で
フォーカスがあうことになる。また、その結果焦点深度
も深くなる。As shown in FIG. 1, the object to be exposed 2 is
By correcting as shown in the figure, the image will be in focus at all image heights. Moreover, as a result, the depth of focus also becomes deeper.
本発明の被露光用物体用チャックはどのような型式の半
導体露光装置にも適用できるが、特に半導体露光装置の
うち縮小投影型露光装置に適用する場合について説明す
る。Although the chuck for an exposed object of the present invention can be applied to any type of semiconductor exposure apparatus, the case where it is applied to a reduction projection type exposure apparatus among semiconductor exposure apparatuses will be described in particular.
その場合もちろんショット配列を考慮してチャックの矯
正面を加工することもできるが、第2図に示すようにチ
ャック3に対し被露光物体2を移動させる手段を講じ、
ショット毎に被露光物体2をチャック3に対して移動す
るようにするのが好都合である。In that case, it is of course possible to process the correction surface of the chuck in consideration of the shot arrangement, but as shown in FIG.
It is convenient to move the object 2 to be exposed relative to the chuck 3 for each shot.
すなわち、第2図に保持部6によって被露光物体2は所
定の露光位置に順次移動させられチャック3によって平
面が矯正され露光が行なわれる。That is, as shown in FIG. 2, the object 2 to be exposed is sequentially moved to a predetermined exposure position by the holder 6, the flat surface is corrected by the chuck 3, and exposure is performed.
このようにショット毎に矯正を行なえるようにすればス
テッパ一方式への矯正チャックの適用が容易となる。If correction can be performed for each shot in this way, the correction chuck can be easily applied to a single stepper type.
[発明の効果]
本発明の被露光物体用チャックの効果を列挙すると次の
ようになる。[Effects of the Invention] The effects of the chuck for an exposed object of the present invention are enumerated as follows.
1、像面湾曲を補正しているため、利用できる実質的な
焦点深度がふかくなる。1. Since field curvature is corrected, the effective depth of focus that can be used is increased.
2、レンズを設計する際に像面湾曲の許容度が大きくな
るので設計が容易になる。2. When designing a lens, the tolerance for field curvature is increased, making the design easier.
3、チャック部分と、被露光物体を移動させる部分を分
離させているためチャックを容易にステッパーに適用で
きる。 □3. Since the chuck part and the part for moving the exposed object are separated, the chuck can be easily applied to a stepper. □
第1図は本発明の被露光物体用チャックの実施例の使用
状態を示す半導体露光装置の関連部分の側面図である。
第2図は本発明の被露光物体用チャックを設けた縮小投
影型露光装置の開運部分の斜視図である。
図中:
1:露光装置の投影系部分、
2:被露光物体、
3:チャック、
6:被露光物体の保持部。FIG. 1 is a side view of relevant parts of a semiconductor exposure apparatus, showing a state in which an embodiment of the chuck for an exposed object of the present invention is used. FIG. 2 is a perspective view of the opening portion of a reduction projection type exposure apparatus equipped with a chuck for an exposed object according to the present invention. In the figure: 1: Projection system part of the exposure apparatus, 2: Object to be exposed, 3: Chuck, 6: Holder for the object to be exposed.
Claims (1)
致する曲面から成る矯正面を備えることを特徴とする被
露光物体用チャック。 2、露光装置の投影系により投影される像面の湾曲に一
致する曲面から成る矯正面を有する被露光物体用チャッ
クと、 このチャックに対し被露光物体を移動させる手段 とを備えたことを特徴とする縮小投影型露光装置。[Scope of Claims] 1. A chuck for an exposed object, comprising a correction surface formed of a curved surface that matches the curvature of an image plane projected by a projection system of an exposure apparatus. 2. A chuck for an exposed object having a correction surface made of a curved surface that matches the curvature of an image plane projected by a projection system of an exposure device, and a means for moving the exposed object with respect to the chuck. A reduction projection type exposure device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60169877A JPS6231121A (en) | 1985-08-02 | 1985-08-02 | Chuck for object to be exposed and reduction stepper using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60169877A JPS6231121A (en) | 1985-08-02 | 1985-08-02 | Chuck for object to be exposed and reduction stepper using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6231121A true JPS6231121A (en) | 1987-02-10 |
Family
ID=15894613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60169877A Pending JPS6231121A (en) | 1985-08-02 | 1985-08-02 | Chuck for object to be exposed and reduction stepper using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6231121A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57204547A (en) * | 1981-06-12 | 1982-12-15 | Hitachi Ltd | Exposing method |
| JPS5867026A (en) * | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Thin plate metamorphosis device |
| JPS5917247A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | exposure equipment |
-
1985
- 1985-08-02 JP JP60169877A patent/JPS6231121A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57204547A (en) * | 1981-06-12 | 1982-12-15 | Hitachi Ltd | Exposing method |
| JPS5867026A (en) * | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Thin plate metamorphosis device |
| JPS5917247A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | exposure equipment |
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