JPS6231134A - Supersonic wire bonding method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an ultrasonic wire bonding method.

[Prior Art] Conventionally, in the manufacture of ICs, LSIs, etc., a semiconductor pellet is attached to an island part of a lead frame, and then the electrode part of the semiconductor pellet and the lead terminal of the lead frame are wire-bonded using a wire such as an Au wire. It is done by doing. The wire-bonded lead frame is resin-sealed at the bonding portion, and the resin-sealed lead frame is cut into individual chips. As a result, a chip-shaped IC or LSI having a plurality of connection terminals is manufactured.

For wire bonding between the electrode portion and the lead terminal, an ultrasonic wire bonding device disclosed in Japanese Patent Publication No. 1941113/1983 is used, for example. That is, in wire bonding using an ultrasonic wire bonding device, a wire supported by a bonding tool is vibrated by ultrasonic waves output from an ultrasonic oscillation means, and each end of the vibrated wire is connected to a pellet electrode. The pellets are placed on a table and are pressed against the lead terminals of a lead frame to which the pellets are attached. This allows the wire to connect between the electrode portion and the lead terminal.

By the way, when bonding the end of the wire to the electrode part or lead terminal, it is necessary to reliably crimp the end of the wire to the electrode part or lead terminal. Figure 8 (
A) to (C) are cross-sectional views each showing a state in which the pellet at the end of the wire is crimped to the electrode part. Of these, FIG. 8(A) shows that the end of the wire 10 is attached to the electrode part 13 of the pellet 13 on which the lead frame is placed on the heating table 11 by applying an appropriate pressure force using the bonding tool.
4 is in a state where it is securely crimped. On the other hand, if excessive pressure is applied by the bonding tool, as shown in FIG. part,
For example, there is a risk that the liquid may leak onto the wiring pattern. moreover,
If the bonding tool does not apply enough pressure,
As shown in FIG. 8(C), there is a risk that the end of the wire 10 may be poorly bonded to the electrode portion 14.

An example of a case where a poor adhesion state as shown in FIG. 8(C) occurs is when the lead frame floats up relative to the heating table 11. Possible causes of the floating of the lead frame include bending that occurs when the lead frame is die-cut, bending that occurs during transportation, etc.;
The entire lead frame is now floating above the heating table.

In other words, if floating occurs in the lead frame, the crimping force applied by the bonding tool may not be reliably transmitted from the end of the wire to the electrode or lead terminal, or heat transfer from the heating table may deteriorate. This results in poor bonding of the wire ends. As a result, in severe cases, the wires may come off, leading to a decrease in product yield and reliability.

[Problem to be Solved by the Invention J] In order to solve the above-mentioned problems, conventionally, as shown in Japanese Patent Laid-Open No. 59-227134, a lead frame is held down on a table by a holding plate, and thereby,
There is something that prevents the lead frame from floating.

However, it is difficult to prevent the lead frame from floating only by holding down the holding plate, and even though the lead frame floats, it is necessary to ensure a reliable and stable crimping state of the wire end. It is desired to develop an ultrasonic wire bonding method.

An object of the present invention is to perform wire bonding reliably and stably.

[Means for Solving the Problems] In order to achieve the above object, the great inventor, Shao, equipped a bonding tool that vibrates with ultrasonic waves output from an Oki oscillation means, and a wire supported by the bonding tool. , an ultrasonic wire bonding method in which the electrode part of a pellet and the lead terminal of a lead frame placed on a table are pressed and crimped, and the electrode part and the lead terminal are connected by a wire,
A means for detecting floating of the lead frame with respect to the table, and an ultrasonic output adjustment means for variably adjusting the output state of the ultrasonic waves output from the ultrasonic oscillation means according to the floating state. There is.

[Function] According to the present invention, it is possible to variably adjust the output state of the oscillated ultrasonic waves according to the floating state of the lead frame with respect to the table, and by this adjustment, the best method for performing crimping can be achieved. It becomes possible to obtain a vibration state in the bonding tool.

This allows wire bonding to be performed reliably and stably.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing an ultrasonic wire bonding device according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a state in which wire bonding is performed by the ultrasonic wire bonding device, and FIG. 3 is a plan view of the same. , Fig. 4 is a circuit diagram of the main part of Fig. 1, Fig. 5 (A) is a state diagram showing the driving displacement state of the capillary as a bonding tool, and Fig. 5 (B) is a state diagram showing the state in which bonding is performed normally. 5(C) is a waveform diagram showing the respective current waveforms when the capillary is in a no-load state, and FIGS. 6(A) and (B) are waveform diagrams showing the respective current waveforms when the capillary is in an unloaded state. FIGS. 7A and 7B are waveform diagrams showing each ultrasonic signal to be modulated. FIGS. 7A and 7B are waveform diagrams showing each ultrasonic signal adjusted by the amplitude time adjustment circuit of the ultrasonic output adjustment means.

The ultrasonic wire bonding device 20 includes a heating table 2
The IC lead frames 22 shown in FIG.

The IC lead frame 22 to be mounted includes an island portion 23 in the center portion, and the island portion 23 includes:
A substantially square semiconductor pellet 24 is attached. A plurality of electrode portions 25 are provided around the semiconductor pellet 24, while the IC lead frame 22 is provided with the electrode portions 25.
A plurality of lead terminals 26 connectable to 5 are provided.

A heater 27 is housed inside the heating table 21, and the heater 27 heats the upper surface of the table 21. As a result, the IC lead frame 22 on the heating table 21 is heated by the heater 27.
The plurality of electrode parts 25 and lead terminals 26 are also heated in the same way. IC placed on heating table 21
The lead frame 22 has a frame-shaped holding plate 28 shown in FIG.
This causes the table to be pressed against the top surface of the table 21.
The semiconductor pellet 24 and each lead terminal 26 are placed inside the frame-shaped holding plate 28.

Above the heating table 21, a pumping device main body 2 is provided.
9 is disposed, and the device main body 29 is movable in the XY directions by driving the xY table 30. Device body 2
9 includes a support stand 31, and a tool lifter arm 32 is disposed on the support stand 31. The tool lifter arm 32 is driven by a linear motor 34 and supported so as to be swingable in the vertical direction [direction A] around a shaft portion 33 . This linear motor 34 is composed of an electromagnet 35 disposed on the device main body 29 and a movable ring 37 that is attached downward to the lower surface of the tool lifter arm 32 and swings vertically between the gap 36 of the electromagnet 35. has been done.

The tool arm 3 is located below the tool lifter arm 32.
8 is disposed, and a capillary 40 as a bonding tool is disposed at the tip of the tool arm 38 (which serves as a horn in this embodiment). capillary 4
0 allows a wire 42 made of an Au wire or the like wound around a spool 41 to be inserted through the wire 42, and feeds the wire 42 toward the tip end side. The base end side of the tool arm 38 is held by an arm holder 43, and the arm holder 43 is attached to the lower part of the tool lifter arm 32 via a leaf spring 44. The lever allows the tool arm 38 to also swing in the direction of arrow A as the tool lifter arm 32 swings.

One end of the arm holder 43 extends upward, and an initial tension adjustment device 45 is provided at the upper part.

This initial tension adjustment device t45 includes a tension mechanism 46 and an adjustment mechanism 47. Of these, the tension mechanism 46 is composed of a spring 49 provided between the arm holder 43 and a spring support 48 provided on the tool lifter arm 32 so as to face the arm holder 43. On the other hand, the adjustment mechanism 47
is arranged between the arm holder 43 and the spring support 48. This adjustment mechanism 47 is made by using a spring (not shown) to constantly bring the spherical tip of a threaded rod 50 into contact with the inside of the arm holder 43 and moving the nut 51 in the front and back direction. The initial tension of arm 38 is adjusted.

A gap sensor 52 is disposed at the tip of the tool lifter arm 32 so as to face the tool arm 38 . The gap sensor 52 can constantly detect the distance T1 between the tool arm 38 and the gap detection circuit 53.
Changes in the interval T1 can be detected. That is, the tool arm 38 is swung in the A direction, and the capillary 4 is
When a portion of the tip of the electrode 25 or the lead terminal 26 comes into contact, the interval T1 is changed to a small value. Such a change in the interval T1 is controlled by a central processing unit 55 (hereinafter referred to as CPU) in the bonder control means 54 from the gap detection circuit 53.
55).

On the other hand, the tool lifter arm 32 swings in the direction of arrow A around the shaft portion 33, so that its swing angle θ can be detected at all times by an encoder 56 disposed on the support base 31. The swing angle θ detected by the encoder 56 is output to a tool swing position detection circuit 57. The tool swing position detection circuit 57 always maintains a swing angle of 0 of the tool arm 38 at C.
It is possible to output to PU55. The CPU 55 controls the motor driver 5 based on the change in the gap TI input from the gap detection circuit 53 and the swing angle θ of the tool lifter arm 32 input from the tool swing position detection circuit 57.
It is possible to transmit drive control signals to 8. That is, C
The PtJ 55 can control the amount of drive of the motor driver 58 by transmitting a drive control signal based on a predetermined amount of rocking. The linear motor 34 is a motor driver 58
As a result, the tool lifter arm 32 is swung to a predetermined position.

A tool arm (horn) 38 having a capillary 40 attached to its tip has a transducer 60 as a vibrator.
A slight vibration is applied in the direction of the arrow Y, and the transducer 60 causes ultrasonic vibration in the direction of the arrow Y by the drive current P output from the ultrasonic oscillator 61. The driving of the ultrasonic oscillator 61 can be controlled by the CPU 55 in the ponder control means 54.
Based on the output command sent from PU55, EIOKH
Z oscillation starts. 80K for ultrasonic oscillator 61
The Hz oscillation signal is power amplified, passes through an output transformer 62, and is caused to command the transducer 60 in the direction of the arrow. A resistor 70 for detecting the flowing current is interposed on the secondary side of the output transformer 62, and the current is detected from the voltage drop across the resistor 70.

Note that the tool arm (horn) 38 and capillary 40
Experiments have shown that the oscillation amplitude is almost proportional to the above current.

The current flowing through the secondary circuit of the output transformer 62 is fed back to the CPU 55 via the monitoring circuit 65. That is, the current signal Q is first input to a monitoring circuit 65 shown in FIG. 4, and is rectified by a diode 66. The rectified current signal Q is output to an AD converter 69 via a resistor 67 and a capacitor 68. The current signal Q output to the AD converter 69 is in an integrated state. Further, the current signal Q input to the AD converter 69 is output to the CPU 55 in a digitized state. Note that 71 in the monitoring circuit 65 is grounded.

In the bonding operation by the ultrasonic wire bonding apparatus 20, first, the xY table drive control section 72 is operated based on a command from the CPU 55, and the XY table 30 is moved by a predetermined amount. This makes it possible to position the capillary 40 at the tip of the tool arm 38 above the corresponding electrode section 25. In this state, the CPU 55 then outputs a drive control signal to the motor driver 58. As a result, the linear motor 34 is driven, and the tool lifter arm 32 and the tool arm 38 are swung downward. The swing state of the tool arm 38 is fed back from the tool swing position detection circuit 57 to the CPU 55. As the tool arm 38 swings downward, the tip of the capillary 40 comes into contact with the electrode section 25 . This state is detected by the gap sensor 52. Then the CPU
55 stops transmitting the drive signal to the motor driver 58, and the capillary 40 stops with the tip of the capillary 40 in contact with the electrode part 25. At this time, the rocking stop position of the capillary 40 is set in advance by the crimp adjustment means 73.

As a result, a prescribed pounding load is applied to the electrode section 25 by the tip of the capillary 40 whose swinging is stopped. That is, the prescribed pounding load is set by further swinging the tool lifter arm 32 after the capillary 40 contacts the electrode section 25 and controlling the amount of deformation of the spring 49.

As described above, the tip of the capillary 40 is connected to the electrode part 2.
5, the CPU 55 issues an output command to the ultrasonic oscillator 61.

Based on the output command, the ultrasonic oscillator 61 is capable of outputting a drive current P having a predetermined amplitude value set in advance by the ultrasonic output adjusting means 74. As a result, the tool arm 38 is slightly vibrated in the direction of arrow Y through the ultrasonic vibration of the transducer 60, and therefore the wire 42 held at the tip of the capillary 40 is also slightly vibrated in the direction of arrow Y. . When the wire 42 is slightly vibrated, the end of the wire 42 that is pressed against the electrode part 25 is rubbed and heated by the tension of the spring 49. Combined with the heating power of the heater 27, the end of the wire 42 melts. As a result, the tip of the wire 42 is friction-pressed to the predetermined electrode portion 25.

When one end of the wire 42 is crimped to the electrode part 25, CP
In response to the command from U55, the drive current P output from the ultrasonic oscillator 61 is stopped. At the same time, the linear motor 34 is driven to swing the tool lifter arm 32 and the tool arm 38 upward. When the tool arm 38 is swung to a predetermined upper position, the CPU 5
5 operates the XY table drive control section 72, and the XY table 30 is moved by a predetermined amount in the XY directions. Thereby, the capillary 40 at the tip of the tool arm 38 is positioned above the corresponding lead terminal 26. In this state, the linear motor 34 is operated again based on a command from the CPU 55, and the tool lifter arm 32 and the tool arm 38 are swung downward. When the tip of the capillary 40 comes into contact with the lead terminal 26 due to the swinging of the tool arm 38, this state is transmitted from the gap detection circuit 53 to the CPU 55, and the CPU 55 stops the linear motor 34. In addition, capillary 40
The rocking stop position is set in advance by the crimping adjustment means 73 so that a prescribed pounding load can be applied in the same way as explained in connection with the pounding on the electrode section 25. For this purpose, an output command will be issued. The ultrasonic oscillator 61 is capable of outputting a drive current P having a predetermined amplitude value based on the output command. As a result, the tool arm 38 is slightly vibrated in the Y direction through the ultrasonic vibration of the transducer 60. Therefore, the wire 42 held by the capillary 40 is also slightly vibrated in the Y direction. When the wire 42 held by the capillary 40 is slightly vibrated, the tension of the spring 49 causes the wire 42 crimped to the lead terminal 26 to be rubbed against the lead terminal 26 . The wire 42 being rubbed is melted in combination with the heating power of the heater 27, thereby fixing the wire 42 to the lead terminal 26. In this state, the wire 42 held by the capillary 40 is cut at the crimped portion, and one end of the wire 42 is crimped to the electrode portion 25 and the other end to the lead terminal 26.

In this way, when one electrode section 25 and the corresponding lead terminal 26 are wire-bonded, the output of the drive current P that was being output from the ultrasonic oscillator 61 is stopped according to a command from the CPU 55, and at the same time, the output of the drive current P that has been output from the ultrasonic oscillator 61 is stopped. 34 causes the tool lifter arm 32 and tool arm 38 to swing to a predetermined upper position.

The above l-cycle wire bonding process is shown in FIG.
This is represented by the diagram shown in . In this figure, the tip of the capillary 40 is moved to the electrode portion 25 by the downward drive of the tool arm 38.
The time range in which the lead terminal 26 is contacted is represented by B1, and the time range in which the lead terminal 26 is contacted is represented by B2. Further, the ultrasonic oscillation time regions corresponding to each time region Bl and B2 are represented by CI and C2 in FIG. 5(B), and the current signal when pounding is normally performed in the region The waveform of Q is shown in FIG. 5(B). On the other hand, in a state where the cavity 40 is not in contact with the pellet 24, that is, in an unloaded state, a waveform as shown in FIG. In each case, the waveform shown in FIG. 5(B) is attenuated from the waveform shown in FIG. 5(C), and also in areas other than time domain Bl and B2, the waveforms correspond to the amplitudes R1 and R2 of both waveforms, respectively. amplitude S1, B
2 may show almost the same value. This is because when the capillary 40 rubs the wire 42 against the electrode part 25 or the lead terminal 26 and presses it, a load (mechanical restraining force) is applied to the tip of the capillary 40, and the tool arm (horn) 38 resonates. This is because the state changes, and therefore both current and displacement become smaller.

Next, the lead terminal 26 of the IC lead frame 22
The case where the bottom of the lead frame 22 below the electrode section 25 is floating above the heating table 21 as shown in section Z in FIG. 1 will be described. If the IC lead frame 22 is lifted up as described above, a current signal close to the no-load waveform shown in FIG. 5(C) is input to the monitoring circuit 65 when bonding is performed. That will happen. This connects the wire 42 to the electrode section 2.
This is because the above-mentioned lifting occurs on the IC lead frame 22 when crimping the IC lead frame 22 and the lead terminal 26.
This is due to the low load resistance during crimping. That is, during crimping, the ultrasonic vibration energy output based on the drive current P is not attenuated because the load resistance of the electrode portion 25 or the lead terminal 26 is small. Therefore, if wire bonding is performed in this state, the wire 42 will be crimped incorrectly.

For this reason, when the amplitude of the current signal Q input to the monitoring circuit 65 is equal to or above a certain value close to the amplitudes S1 and B2 when the capillary 40 is in an unloaded state, the CPU 55 It is determined that the lead frame 22 is floating, and the ponder control means 54
A control signal U is transmitted to the ultrasonic output adjusting means 74 of the ultrasonic wave output adjusting means 74 .

The ultrasonic output adjustment means 74 adjusts the state of application of the pressing force by the tip of the capillary 40 based on the input control signal U. At this time, the floating state of the IC lead frame 22 relative to the heating table 21 is determined by detecting the amplitude value of the current signal Q input to the monitoring circuit 65, and the detection is performed in the time domain Bl and B2. is detected within the first 5 ms of . That is, Fig. 6 (A
) is the input waveform of the current signal Q shown in the monitoring circuit 6.
The signal is rectified by a diode 66 of No. 5, and further passes through a resistor 67 and a capacitor 68, so that it is expressed as an integral value shown in FIG. 6 (CB). When this integral value exceeds a certain slice level D, these states are output to the CPU 55 of the ponder control means 54 via the AD converter 69, and the C
The PU 55 will detect the floating state of the IC lead frame 22. In this way, the detected floating state is output from the CPU 55 to the ultrasonic output adjustment means 74. The ultrasonic output adjusting means 74 adjusts the ultrasonic vibration applied to the tool arm 38 and the capillary 40 by varying the amplitude or output time of the drive current P output from the ultrasonic oscillator 61 based on the command from the CPU 55. The amplitude or vibration time can be variably adjusted.

The amplitude of the drive current P is adjusted by operating an amplitude control circuit built into the ultrasonic output adjustment means 74. That is, when the integral value of the monitoring circuit 65 exceeds a certain slice level D as shown in FIG. 6(B), the CPU 55 detects this state as a floating state. Then, the CPU 55 outputs the signal to the single-width control circuit, which is capable of amplifying and adjusting the amplitude of the drive current P output from the ultrasonic oscillator 61.

When the amplitude of the drive current P is adjusted, the amplitude of the current signal Q is adjusted accordingly as shown in FIG. 6(A). Therefore, when the output drive current P is amplified, the ultrasonic vibration energy applied to the capillary 40 is also increased accordingly, and as a result, due to the increase in vibration energy, the wire 42 and the electrode part 25 or An appropriate frictional state can be obtained between the terminal 26 and the terminal 26. Therefore, as shown in part 2 of FIG. 1, even when the IC lead frame 22 is floating relative to the heating table 21, the increased vibrational energy applied to the capillary 40 allows the wire 42 to be in a stable friction-pressed state. This will be obtained.

On the other hand, the output time adjustment of the drive current P is performed by the operation of an output time adjustment circuit built in the ultrasonic output adjustment means 74. That is, when the integral value of the monitoring circuit 65 exceeds a certain slice level D as shown in FIG. 7(B), the CPU 55 detects this state as a floating state. Then CPU5'5
outputs the control signal U to the output time adjustment circuit, and this circuit outputs the drive current P output from the ultrasonic oscillator 61.
The output time t is extended from the state tl to the state t2 as shown in FIG. 7(A). When the output time t of the output drive current P is extended, the vibration time t of the capillary 40 is correspondingly extended, and compared to the normal vibration time t1 of the capillary 40, the wire 42 and the electrode part 2 are
5 or the lead terminal 26, an appropriate frictional state can be obtained. Therefore, as shown in part 2 of FIG. 1, even if the IC lead frame 22 is
Even in the state where the capillary 40 floats, the vibration time t of the capillary 40 is extended, so that a stable crimping state of the wire 42 can be obtained.

In this embodiment, either the amplitude control circuit or the output time adjustment circuit among the circuits built in the ultrasonic output adjustment means 74 is activated to adjust the wire 42 to the electrode section 25 or the lead terminal 26. Although a stable crimp state is obtained, it is also possible to operate both the amplitude control circuit and the output time adjustment circuit to obtain a more stable crimp state.

Next, the operation of the above embodiment will be explained.

According to the wire bonding apparatus 20 according to the above embodiment, the floating state of the IC lead frame 22 with respect to the heating table 21 is detected by the CPU 55 based on the amplitude state of the current signal Q input to the monitoring circuit 65. becomes. As a result, based on the detection of the floating state by the CPU 55, the ultrasonic output adjustment means 74 is activated,
The amplitude and output time of the drive current P output from the ultrasonic oscillator 61 are variably adjusted. Therefore, by this adjustment, it is possible to obtain the best amplitude condition for crimping at the portion of the wire 42 held in the capillary 40,
Wire bonding can be performed reliably and stably.

Note that in the above embodiment, the IC lead frame 22
Although the monitoring circuit 65 is used as a means for detecting the floating state of the robot, gap visual recognition means such as an infrared sensor or ITV may be used instead of the monitoring circuit 65.

[Effects of the Invention] As described above, the present invention includes a bonding tool that vibrates by ultrasonic waves output from an ultrasonic oscillation means, and places a wire supported by the bonding tool on the electrode part of the pellet and on the table. In an ultrasonic wire bonding method in which the pellets are placed on the table and the pellets are pressed against each of the lead terminals of the lead frame to which the pellets are attached, and the electrode portion and the lead terminals are connected by a wire, floating of the lead frame with respect to the table is detected. and an ultrasonic output adjustment means that can variably adjust the output state of the ultrasonic waves output from the ultrasonic oscillation means according to the floating state, thereby ensuring wire bonding in a reliable and stable state. It has the advantage that it can be done with

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an ultrasonic wire bonding device according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a state in which wire bonding is performed by the ultrasonic wire bonding device, and FIG. 3 is a plan view of the same. , Fig. 4 is a circuit diagram of the main part of Fig. 1, Fig. 5 (A) is a state diagram showing the drive displacement state of the capillary as a bonding tool, and Fig. 1%5 (B) shows that bonding is performed normally. Figure 5 (C)
6A and 6B are waveform diagrams showing current waveforms in capillary no-load conditions, respectively, and FIGS. 6A and 6B show each current signal controlled based on the amplitude control circuit of the ultrasonic output adjustment means. Waveform diagrams, FIGS. 7(A) and (B) are waveform diagrams showing each current signal adjusted by the output time adjustment circuit of the ultrasonic output adjustment means, and FIGS. 8(A), CB), (
C) is a cross-sectional view showing the state in which the wire end portions are crimped to the electrode portions. DESCRIPTION OF SYMBOLS 20... Wire bonding apparatus, 21... Heating table, 22-XC lead frame, 24... Semiconductor pellet, 25... Electrode part, 2
6... Lead terminal, 38... Tool arm, 40...
... Capillary [bonding tool], 42 ... Wire, 54 ... Ponder control means, 55 ... CPU,
61... Ultrasonic oscillator, 65... Monitoring circuit, 74... Ultrasonic output adjustment means. Agent Patent Attorney Osamu Shiokawa Figure 2, Figure 3, Figure 4, Page 6! Eup 2 Gyoku - Figure 8 (△) (B) (C)

Claims (3)

[Claims] (1) Equipped with a bonding tool that vibrates by ultrasonic waves output from an ultrasonic oscillator, the wire supported by the bonding tool is connected to the electrode part of the pellet and the lead of the lead frame placed on the table and to which the pellet is attached. In an ultrasonic wire bonding method in which terminals are pressed and crimped and the electrode portion and the lead terminal are connected by a wire, means for detecting floating of a lead frame relative to a table, and depending on the floating state, An ultrasonic wire bonding method comprising an ultrasonic output adjustment means that can variably adjust the output state of ultrasonic waves output from an ultrasonic oscillation means. (2) The ultrasonic wire bonding method according to claim 1, wherein the ultrasonic output adjusting means is an amplitude adjusting means of the outputted ultrasonic waves. (3) The ultrasonic wire bonding method according to claim 1, wherein the ultrasonic output adjusting means is a means for adjusting the amplitude time of the output ultrasonic waves.