JPS6231137A - Dice bonding device - Google Patents

Abstract

PURPOSE:To enable the high-speed operation and to improve the productivity exceedingly by a method wherein plural wafers are held in a state of lamination in a stocker which is moved up and down by an elevating device and a carry- out means moves an arbitrary wafer to a wafer supporting part. CONSTITUTION:On an elevating body 9, a stocker 10 which can hold plural wafer tables 12 carrying a wafer 11 in a state of lamination is placed. This stocker 10 is composed of a square frame and on the inside plane of the both side walls 13 of that, plural holding grooves 14 in which the both ends of the wafer table 12 fit are formed. A cylinder device 23 as a carry-out means for the wafer tables 12 is provided, which pushes out the wafer table 12 held in the stocker 10 and sends it to a wafer supporting part 16. At the same time, the device 23 sends the wafer table 12 which has been present in the wafer supporting part 16 out to the stocker 10 on the opposite side to hold it. Consequently, the high-speed operation becomes possible and the productivity is exceedingly improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to semiconductor wafers formed on a semiconductor wafer and individually separated. l
The semiconductor elements (referred to as dice in this specification) are removed from the wafer and placed in a predetermined position on a base such as a ceramic circuit board or a lead frame using a mounting device. The present invention relates to a die bonding device for bonding the die to a base.

BACKGROUND OF THE INVENTION Conventional die bonding equipment of this type includes a rotating disk on which a plurality of wafers are arranged at equal intervals on the circumference, and by rotating this rotating disk, arbitrary wafers can be transferred to a die separating device. The separated dice are then transferred to the position correcting means using a transfer device, and the dice whose positions have been accurately corrected by being transferred to the position correcting means are moved to a predetermined position on the base and bonded. It is configured as follows.

The problem that the invention aims to solve is that in the above configuration, the rotating disk is large (for example, about I11), which requires a large space, and it is difficult to increase the speed due to the large inertia. There is a problem.

1'1. In order to solve the above-mentioned problems, the present invention has a structure in which a plurality of wafers, each having a large number of dice, are stacked in a stacked state so that they can be taken in and out individually. A stocker for holding wafers is provided in the outer device, a wafer support is disposed on the side of the elevating device, and a loading/unloading means for loading and unloading wafers between the stocker and the wafer support is provided, and the wafers on the wafer support are The present invention provides a die bonding device that includes a transfer device for transferring and bonding arbitrary dice to a predetermined position on a base body.

Effects According to the above configuration, multiple wafers are held in a stacked state on the stocker, so even if there are many types of wafers, it does not take up space, and the stocker can be raised and lowered by the lifting device to accommodate any wafer on the wafer support section. The dice can be taken out from a desired type of wafer by positioning the die and moving it to the wafer support part using the loading/unloading device.Each operation during this time is a linear motion and the inertia is small, so high-speed operation is possible.

EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. In FIG. 1, reference numeral 1 denotes a moving table that can be accurately moved and driven in X and Y directions that are perpendicular to each other on a horizontal plane,
An X-direction moving body 4 installed on a base 2 and driven to move in the X direction by a drive device 3, and a drive device 5 installed on it
It is composed of a Y-direction moving body 6 that is driven to move in the Y-direction. Lifting devices 7a and 7b are arranged on both sides of the moving table 1 in the X direction, and each lifting device is driven by a drive device 8.
It is equipped with an elevating body 9 that is raised and lowered at. This elevating body 9 has a plurality of wafer stands 12 on which wafers 11 are installed! I
A stocker 10 that can hold the vehicle in the tWI state is installed. As shown in FIG. 3, this stocker 10 consists of a rectangular frame, and a plurality of holding grooves 14 are formed at appropriate intervals on the inner surfaces of both side walls 13, into which both side ends of the wafer table 12 are inserted. . A support 15 is erected at the center of the moving table 1 in the X direction, and a 21st
As shown in FIG. 1 (not shown in FIG. 1), a wafer support part 6 extends between the stockers 10 on both sides, and one end of the wafer stand 12 is attached to the top surface of the top end of the wafer support part 6. A guide protrusion 17 in the X direction is provided to protrude into which a guide groove 18 formed on the lower surface fits. Further, positioning pins 20 that are fitted into a pair of positioning holes 19 formed at one end of the wafer table 12 to position the wafer table 12 are arranged to be movable up and down, and are configured to be driven up and down by a shilling device 21. has been done. A support piece 22 extends outward from the stocker 10 from the outer side of the fixing machine frame of the lifting devices 7a and 7b, and a wafer stand 12 is attached to the tip of the support piece 22.
A cylinder device RA 23 is installed as a means for taking in and taking out the wafer, and it pushes out the wafer stand 12 held by the stiffener 10 to the wafer support part 16, and also moves the wafer stand 12 that was previously in the wafer support part 16 to the opposite side. It is configured such that it is delivered to and held in the stocker 10 of. A transfer device 25 is disposed below the wafer stand 12 supported by the wafer support section 16 to adsorb the separated dice formed on the wafer 11 and transfer the dice to the position correction means 26. There is. Furthermore, when transferring the dice from the wafer 11 to the position correcting means 26, this transfer device 25 also transfers the dice, which have been previously transferred to the position corrector 1'J26 and whose position has been accurately corrected, to the base body 27. It is configured to be mounted and bonded.

In the above configuration, when bonding any type of dice to the base 27, the wafer stand 12 on which the wafers 11 on which the dice are formed is moved up and down by raising and lowering each stocker 10 using the lifting device 7a or 7b. The wafer table 12 is positioned at the same height as the support part 16, and then the shilling device 23 is operated to push out the wafer table 12 toward the wafer support part 16, and the wafer table 12 is supported by the wafer support part 16. At the same time, the positioning pins 20 are inserted into the positioning holes 19 to accurately position the wafer table 12. Thereafter, by appropriately moving the moving table 1 in the X direction and the Y direction, a predetermined die is 8) Konami FP! '), 1-Place the stone on the 4th stone, operate the separation device 24 by pull casting, push up and separate the dies, and adsorb the separated dies with the transfer device 25 to correct the position. Transferred to 26th,
The die whose position has been corrected previously is bonded to a predetermined position on the base body 27. Next, when bonding dies formed on the same wafer 11, the moving table 1 is operated to position the next die directly above the separation device 24. On the other hand, when bonding dice formed on another wafer 11, the stocker 10 is raised and lowered as described above, and the corresponding wafer stand 12 is positioned corresponding to the wafer support part 16.
This wafer stand 12 is pushed out to be supported by the wafer support section 16, and the previous wafer stand 12 is pushed out and held in an empty area of the stocker 10. Thereafter, by repeating the above operations, the dice are sequentially bonded to the base 17.

In addition, in the above embodiment, the stocker 10 and the wafer support part 16
Although the wafer table 12 is pushed out from the stocker 10 by the shilling device 23 in order to take it in and out between the
For example, various devices may be employed, such as providing a mechanism for loading and unloading the wafer stand 12 on the wafer support section 16 side. Further, in order to select the dice in the wafer 11, the moving table 1 is moved in the X direction and the Y direction, and the moving table 1 is provided with lifting devices 7a, 7b, a wafer support section 16, etc. However, the elevating device and the like may be fixed and the separating device 24 and the like may be moved to select an arbitrary die.

Effects of the Invention According to the die bonding apparatus of the present invention, a plurality of wafers are held in a stacked state in the stocker as described above, so even if there are many types of wafers, it does not take up space, and it is easy to lift and lower the wafers. Since the stocker is raised and lowered by the device to position a desired wafer in the corresponding position on the wafer support, and the loading/unloading means is used to move the wafer to the wafer support, it is possible to take out the dice from the desired type of wafer, and to Since the motion is a linear motion and the inertia is small, high-speed motion is possible, which has the effect of greatly improving productivity.

[Brief explanation of the drawing]

Fig. 1 is a partially omitted perspective view of an embodiment of the present invention, Fig. 2 is a perspective view of the omitted part in Fig. 1, and Fig. 3 is a partially cutaway perspective view of a stocker. . 7a, 7b... Lifting device, 10... Stocker, 11
... wafer, 12 ... wafer stand, 16 ... wafer support section, 23 ... shilling device (loading and unloading means), 2
5... Transfer device, 27... Base body. Agent: Patent attorney Toshio Nakao (1 person) Figure 1 7a, 7b... - Shoryu-sou! 1o・・・・・Strong・、Power 11・・・・Uni 7. 16... Sea urchin 7, support part 23... Schilling device (input/output-4: r
φ)25...Transfer device 27......Iris Nobu

Claims (1)

[Claims] A lifting device is provided with a stocker that holds a plurality of wafers each having a large number of dice in a stacked state so that each wafer can be taken in and taken out individually. Dice bonding, characterized in that a loading/unloading means for loading and unloading a wafer between the supporting parts is provided, and a transfer device is provided for transferring and bonding any die of the wafer on the wafer supporting part to a predetermined position on the base body. Device.