JPS6232158A - 導電性ペ−スト - Google Patents

導電性ペ−スト

Info

Publication number: JPS6232158A
Authority: JP; Japan
Prior art keywords: resin; conductive paste; electrically conductive; parts; epoxysilane
Prior art date: 1985-08-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP17101885A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0212509B2 (de

Inventor

Teru Okunoyama

奥野山　輝

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kyocera Chemical Corp

Original Assignee

Toshiba Chemical Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-08-05

Filing date

1985-08-05

Publication date

1987-02-12

1985-08-05 Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp

1985-08-05 Priority to JP17101885A priority Critical patent/JPS6232158A/ja

1987-02-12 Publication of JPS6232158A publication Critical patent/JPS6232158A/ja

1990-03-20 Publication of JPH0212509B2 publication Critical patent/JPH0212509B2/ja

Status Granted legal-status Critical Current

Links

229920005989 resin Polymers 0.000 claims abstract description 37
239000011347 resin Substances 0.000 claims abstract description 37
239000003822 epoxy resin Substances 0.000 claims abstract description 18
229920000647 polyepoxide Polymers 0.000 claims abstract description 18
239000000178 monomer Substances 0.000 claims abstract description 12
239000000843 powder Substances 0.000 claims abstract description 6
125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 claims description 9
239000004065 semiconductor Substances 0.000 abstract description 15
239000008188 pellet Substances 0.000 abstract description 12
238000002156 mixing Methods 0.000 abstract description 7
238000005260 corrosion Methods 0.000 abstract description 6
230000007797 corrosion Effects 0.000 abstract description 6
238000010438 heat treatment Methods 0.000 abstract description 5
DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 abstract description 3
FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 abstract description 2
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 abstract description 2
JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical group C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 abstract 2
238000005452 bending Methods 0.000 abstract 1
230000001070 adhesive effect Effects 0.000 description 12
238000000034 method Methods 0.000 description 12
239000000853 adhesive Substances 0.000 description 10
239000002904 solvent Substances 0.000 description 6
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
239000003054 catalyst Substances 0.000 description 4
229910000679 solder Inorganic materials 0.000 description 4
RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 3
UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
230000007547 defect Effects 0.000 description 3
229940019778 diethylene glycol diethyl ether Drugs 0.000 description 3
230000005496 eutectics Effects 0.000 description 3
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
230000007062 hydrolysis Effects 0.000 description 3
238000006460 hydrolysis reaction Methods 0.000 description 3
239000000126 substance Substances 0.000 description 3
XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 2
OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
241000220317 Rosa Species 0.000 description 2
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
238000004090 dissolution Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
239000000203 mixture Substances 0.000 description 2
JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
229920003986 novolac Polymers 0.000 description 2
239000003208 petroleum Substances 0.000 description 2
229910052710 silicon Inorganic materials 0.000 description 2
239000010703 silicon Substances 0.000 description 2
RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
239000000654 additive Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
239000002518 antifoaming agent Substances 0.000 description 1
125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000011109 contamination Methods 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
239000007822 coupling agent Substances 0.000 description 1
238000007872 degassing Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
125000003700 epoxy group Chemical group 0.000 description 1
239000006023 eutectic alloy Substances 0.000 description 1
238000000605 extraction Methods 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
238000004898 kneading Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
238000005259 measurement Methods 0.000 description 1
235000020014 märzen Nutrition 0.000 description 1
239000004843 novolac epoxy resin Substances 0.000 description 1
239000004848 polyfunctional curative Substances 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
238000004904 shortening Methods 0.000 description 1
238000005476 soldering Methods 0.000 description 1
241000894007 species Species 0.000 description 1
238000012360 testing method Methods 0.000 description 1
235000021419 vinegar Nutrition 0.000 description 1
239000000052 vinegar Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Landscapes

Epoxy Resins (AREA)
Paints Or Removers (AREA)
Conductive Materials (AREA)
Compositions Of Macromolecular Compounds (AREA)

JP17101885A 1985-08-05 1985-08-05 導電性ペ−スト Granted JPS6232158A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP17101885A JPS6232158A (ja)	1985-08-05	1985-08-05	導電性ペ−スト

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP17101885A JPS6232158A (ja)	1985-08-05	1985-08-05	導電性ペ−スト

Publications (2)

Publication Number	Publication Date
JPS6232158A true JPS6232158A (ja)	1987-02-12
JPH0212509B2 JPH0212509B2 (de)	1990-03-20

Family

ID=15915563

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP17101885A Granted JPS6232158A (ja)	1985-08-05	1985-08-05	導電性ペ−スト

Country Status (1)

Country	Link
JP (1)	JPS6232158A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5156771A (en) *	1989-05-31	1992-10-20	Kao Corporation	Electrically conductive paste composition
US5158708A (en) *	1989-12-01	1992-10-27	Kao Corporation	Conductive paste and conductive coating film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5229800A (en) *	1975-09-01	1977-03-05	Sumitomo Heavy Ind Ltd	Apparatus for detecting effluence of slag in molten metal
JPS60260663A (ja) *	1984-06-06	1985-12-23	Toshiba Chem Corp	導電性ペ−スト
JPS6213473A (ja) *	1985-07-12	1987-01-22	Toshiba Chem Corp	導電性ペ−スト

1985
- 1985-08-05 JP JP17101885A patent/JPS6232158A/ja active Granted

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5229800A (en) *	1975-09-01	1977-03-05	Sumitomo Heavy Ind Ltd	Apparatus for detecting effluence of slag in molten metal
JPS60260663A (ja) *	1984-06-06	1985-12-23	Toshiba Chem Corp	導電性ペ−スト
JPS6213473A (ja) *	1985-07-12	1987-01-22	Toshiba Chem Corp	導電性ペ−スト

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5156771A (en) *	1989-05-31	1992-10-20	Kao Corporation	Electrically conductive paste composition
US5158708A (en) *	1989-12-01	1992-10-27	Kao Corporation	Conductive paste and conductive coating film

Also Published As

Publication number	Publication date
JPH0212509B2 (de)	1990-03-20

Legal Events

Date	Code	Title	Description
2005-03-20	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
JPS6232158A (ja)	1987-02-12	導電性ペ−スト
JPS6261336A (ja)	1987-03-18	半導体素子
JPH07238268A (ja)	1995-09-12	接着剤及び半導体装置
JP2584424B2 (ja)	1997-02-26	樹脂封止型半導体装置
JPS62218413A (ja)	1987-09-25	半導体ペレット搭載用ペースト
JP2748318B2 (ja)	1998-05-06	半導体装置
JPS6213473A (ja)	1987-01-22	導電性ペ−スト
JP3348131B2 (ja)	2002-11-20	化合物半導体装置
JPS63120432A (ja)	1988-05-24	半導体素子
JPS60193349A (ja)	1985-10-01	半導体素子
JPH05342910A (ja)	1993-12-24	導電性ペースト
JPH04274336A (ja)	1992-09-30	化合物半導体装置
JPH04274335A (ja)	1992-09-30	絶縁ペースト
JPH0528494B2 (de)	1993-04-26
JPS63126114A (ja)	1988-05-30	導電性ペ−スト
JPH08245765A (ja)	1996-09-24	化合物半導体装置
JPH03134907A (ja)	1991-06-07	導電性ペースト
JPH04274334A (ja)	1992-09-30	導電性ペーストの製造方法
JP2003263921A (ja)	2003-09-19	導電性ペースト
JPH052915A (ja)	1993-01-08	半導体装置
JPH0465012A (ja)	1992-03-02	導電性ペースト
JPH10223660A (ja)	1998-08-21	化合物半導体装置
JP3589569B2 (ja)	2004-11-17	導電性ペースト
JPH07278273A (ja)	1995-10-24	化合物半導体装置
JPH0462941A (ja)	1992-02-27	化合物半導体装置

JPS6232158A - 導電性ペ−スト - Google Patents

Info

Links

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=15915563

Family Applications (1)

Country Status (1)

Cited By (2)

Citations (3)

Patent Citations (3)

Cited By (2)

Also Published As

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Legal Events