JPS6232692A - Part positioning - Google Patents
Part positioningInfo
- Publication number
- JPS6232692A JPS6232692A JP60171100A JP17110085A JPS6232692A JP S6232692 A JPS6232692 A JP S6232692A JP 60171100 A JP60171100 A JP 60171100A JP 17110085 A JP17110085 A JP 17110085A JP S6232692 A JPS6232692 A JP S6232692A
- Authority
- JP
- Japan
- Prior art keywords
- component
- positioning
- mounting table
- velocity
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 15
- ZJPGOXWRFNKIQL-JYJNAYRXSA-N Phe-Pro-Pro Chemical compound C([C@H](N)C(=O)N1[C@@H](CCC1)C(=O)N1[C@@H](CCC1)C(O)=O)C1=CC=CC=C1 ZJPGOXWRFNKIQL-JYJNAYRXSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Control Of Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、FPP、PLCC,LC”と呼ばれる面装着
用IC等の装着における部品位置決め方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a component positioning method for mounting ICs for surface mounting called "FPP, PLCC, LC".
(従来の技術及び問題点)
従来、面装着用ICの位置決め方法としては、第4図乃
至第7図に示す方法がそれぞれ提案されている。(Prior Art and Problems) Conventionally, methods shown in FIGS. 4 to 7 have been proposed as methods for positioning surface-mounted ICs.
Pt54図の方法は、吸着ビン1と同軸に設けられた爪
2により面装着用IC3のパッケージ4の部分を4方向
より挟持して位置決めをしながらプリント基板6上に装
着するものである。この場合、面装着用IC3の寸法が
正確に規定されているのはリード5の先端であり、パッ
ケージ4を位置決めしたのではリード先端の位置精度は
悪くなる。The method shown in Fig. Pt54 is to mount the package 4 of the surface-mounted IC 3 on the printed circuit board 6 while holding and positioning it from four directions by the claws 2 provided coaxially with the suction bottle 1. In this case, the dimension of the surface-mounted IC 3 is accurately defined at the tip of the lead 5, and if the package 4 is positioned, the positional accuracy of the lead tip will deteriorate.
また、吸着ピン側の機構が複雑になり重くなるのが欠点
である。Another drawback is that the mechanism on the suction pin side is complicated and heavy.
第5図の方法は、吸着ビン1と同軸に設けられた爪2A
に上り面装着用IC3のリード5の部分を4方向より挟
持して位置決めをしながらプリント基板6上に装着する
ものである。この場合には、リード5に力が加わってリ
ード5が曲がり易く、位置決め困難である。また、吸着
ビン側の+1!構が複雑になり重くなる。。The method shown in FIG.
The lead 5 portion of the IC 3 for top surface mounting is held and positioned from four directions while being mounted on the printed circuit board 6. In this case, force is applied to the leads 5 and the leads 5 tend to bend, making positioning difficult. Also, +1 on the suction bottle side! The structure becomes complicated and heavy. .
第6図の方法は、面装着用ICの形状に合わせた凹形の
くぼみ7をつけた治具8を用意し、この治具8に面装着
用ICを入れることによって位置決めするものである。In the method shown in FIG. 6, a jig 8 having a concave recess 7 matching the shape of the surface-mounted IC is prepared, and the surface-mounted IC is placed in the jig 8 for positioning.
この方法では、面装着用ICの種別に合わせた数だけ治
具が必要で、面装着用ICL:r)種別が異なるたびに
、その都度交換する必要がある。また、面装着用ICの
出し入れのために面装着用ICと治具との間に隙間が必
要であり、位置決め精度を悪くする。This method requires as many jigs as the number of jigs that correspond to the types of surface-mounted ICs, and they must be replaced each time the type of surface-mounted ICL differs. Furthermore, a gap is required between the surface-mounted IC and the jig in order to take the surface-mounted IC in and out, which impairs positioning accuracy.
PtS7図の方法は、吸着ビンと同軸に対向する部品支
えビン9の廻r)1こ設けられた爪101こよr)第4
図の場合と同様に面装着用ICのパッケージあるいはリ
ードの部分を4方向より挟持して位置決めするものであ
る。この場合も、面装着用ICの寸法が正確に規定され
ているのはリードの先端であり、パッケージを位置決め
したのではリード先端の位置精度は悪くなり、リード先
iを挟持したのではリードを曲げ易く、挟持も不安定に
なり易す)、l
(間芯点を解決するための手段及び作用)本発明は、上
記の点に鑑み、リードがパッケージの外側に出っ張って
いる面装着用IC等の位置決めをリードを曲げることな
く正確に位置決め可能な部品位置決め方法を提供しよう
とするものである。The method shown in Fig. PtS7 consists of the parts support bin 9 facing coaxially with the suction bin, and the fourth claw 101 provided thereon.
As in the case shown in the figure, the package or lead portion of the surface-mounted IC is held and positioned from four directions. In this case as well, the dimensions of a surface-mounted IC are accurately defined at the tip of the lead, and positioning the package will degrade the positioning accuracy of the tip, while holding the lead tip i will cause the lead to In view of the above points, the present invention provides a surface-mounted IC whose leads protrude outside the package. The purpose of the present invention is to provide a component positioning method that enables accurate positioning of parts, etc., without bending the leads.
本発明では、少なくとも直交する2面を有する位置決め
部材に対し、部品を載せる部品載置台を移動自在に設け
、該部品載置台が前記2面のうちの一方の面に向かう速
度成分と他方の面に向かう速度成分の両方を含む方向に
移動しているときに、当該部品載置台上に部品を載せ、
該部品@置台の前記移動により部品が前記2面に接触し
て位置決め状態にあるときに前記部品を取り出す、二と
によって、上記従来の問題点を解決している。In the present invention, a positioning member having at least two orthogonal surfaces is provided with a movable component mounting table on which a component is placed, and the component mounting table has a velocity component directed toward one of the two surfaces and a velocity component directed toward the other surface. Place the component on the component mounting table while moving in a direction that includes both velocity components toward .
The above-mentioned conventional problems are solved by (2) taking out the part when the part comes into contact with the two surfaces and is in a positioning state due to the movement of the part @ placement table.
(実施例)
以下、本発明に係る部品位置決め方法の実施例を図面に
従って説明する。(Example) Hereinafter, an example of the component positioning method according to the present invention will be described with reference to the drawings.
第1図乃至第3図において、11は位置決め部材であり
、支持ブロック12により水平に支持固定されている。In FIGS. 1 to 3, reference numeral 11 denotes a positioning member, which is supported and fixed horizontally by a support block 12. As shown in FIG.
位置決め部材11は2つの垂直基準面13A、13Bを
有し、基準面13A、13Bは相互に直交している。The positioning member 11 has two vertical reference planes 13A and 13B, and the reference planes 13A and 13B are orthogonal to each other.
一方、位置決め部材11の下面に密接して水平面内で移
動自在に部品載置台15がステイグ16上に固定され、
該スライダ16は例えば支持ブロック17に固定された
エアーシリンダ18により、往復運動を行う。そして、
往復運動の方向は、前記直交する垂直基準面上に2辺を
有する方形を考゛えたときの対角線方向(第1図矢印P
)である。On the other hand, a component mounting table 15 is fixed on the stay 16 in close contact with the lower surface of the positioning member 11 and movable within a horizontal plane.
The slider 16 is reciprocated by an air cylinder 18 fixed to a support block 17, for example. and,
The direction of the reciprocating motion is the diagonal direction (arrow P in Figure 1) when considering a rectangle with two sides on the orthogonal vertical reference plane.
).
このような位置決めのための構成は、例えば電子部品装
着機における電子部品供給部とプリント基板を支えるト
ランス77部との間に位置決め人チージョンとして配設
される。Such a configuration for positioning is disposed, for example, as a positioner between an electronic component supply section and a transformer 77 section that supports a printed circuit board in an electronic component mounting machine.
さて、部品の位置決めは、第2図及び第3図の矢印P1
で示されるように部品載置台15が垂直基準面13A、
’13Bに近付く方向(基準面1.3Aに向かう速度成
分と基準面13Bに向かう速度成分の両方を含む方向)
に移動している期間中に行う。まず、P1方向に移動中
の部品載置台15上に吸着ビン等で面装着ルIC3を第
2図のように載置する。すると、部品載置台15の移動
により面装着用IC3はり−ド5先端が位置決め部材1
1の基準面13A、13Bのそれぞれに接触した第3図
の状態、すなわち位置決め状態となる。この際、部品?
22面15のP1方向ヘーの移動は継続されているから
、部品載置台15と面装着用IC3との間の摩擦に上り
面装着用IC3と基準面13A、13Bとの間の位置決
め状態は維持され、このときに吸着ビン等で面装着用I
CUの中心位置を保持して垂直方向に取り出す。すなわ
ち、面装着用IC3の外形寸法(リード外周までの寸法
)は既知であるから、例えばプログラムで基準面13A
、13Bよりの面装着用ICの中心点を算出し、吸着ビ
ン等を面装着用ICの中心に持っていけばよい。Now, the positioning of the parts is done by arrow P1 in Figures 2 and 3.
As shown, the component mounting table 15 is vertical reference plane 13A,
'13B direction (direction that includes both velocity components toward reference plane 1.3A and velocity components towards reference plane 13B)
Do this while you are moving to. First, as shown in FIG. 2, the surface-mount IC 3 is placed on the component mounting table 15, which is moving in the P1 direction, using a suction bottle or the like. Then, due to the movement of the component mounting table 15, the tip of the surface mounting IC 3 beam 5 is moved to the positioning member 1.
The state shown in FIG. 3 in which the device contacts each of the reference surfaces 13A and 13B of No. 1, that is, the positioning state is reached. At this time, parts?
22 Since the movement of the surface 15 in the P1 direction continues, the positioning state between the surface mounting IC 3 and the reference surfaces 13A and 13B is maintained due to the friction between the component mounting table 15 and the surface mounting IC 3. At this time, the surface mounting I
Hold the center position of the CU and take it out in the vertical direction. That is, since the external dimensions (dimensions up to the outer circumference of the leads) of the surface-mounted IC 3 are known, for example, the reference surface 13A can be set using a program.
, 13B, and move the suction bottle or the like to the center of the surface-mounted IC.
なお、前記垂直基準面13A、13Bのうちの一方の面
に向かう速度成分と他方の面に向かう速度成分とが等し
くなる方向に前記部品載置台15が移動するようにする
ことが一般には最も効率的であると考えられる。Note that it is generally most efficient to move the component mounting table 15 in a direction in which the velocity component toward one of the vertical reference planes 13A, 13B is equal to the velocity component toward the other surface. It is considered to be a target.
また、部品載置台15の駆動は、エアーシリングの代わ
りにパルスモータ−とカム機構との組み合わせ等で実行
してもよい。Further, the component mounting table 15 may be driven by a combination of a pulse motor and a cam mechanism, etc. instead of the air cylinder.
さらに、位置決め部材は角穴を有する構成とし、角穴の
直交する2面をそれぞれ基準面に設定するようにしても
よい。Further, the positioning member may have a square hole, and two orthogonal faces of the square hole may be set as reference planes.
(発明の効果)
以上説明したように、本発明の部品位置決め方法によれ
ば、次のような効果を得ることができる。(Effects of the Invention) As explained above, according to the component positioning method of the present invention, the following effects can be obtained.
(1)方形の電子部品、とくにFPP、PLCC。(1) Square electronic components, especially FPP and PLCC.
LCCと呼ばれる面装着用ICの装着における位置決め
に好適であり、リードがパッケージより突出したPPP
に効果が大きい。Suitable for positioning when installing surface-mounted ICs called LCCs, PPP with leads protruding from the package.
has a large effect on
(2)面装着用ICではリード外周の寸法精度が管理さ
れており、このリード先端を位置決めするので原理的に
高精度の位置決めができる。(2) In surface-mounted ICs, the dimensional accuracy of the outer periphery of the lead is controlled, and since the tip of this lead is positioned, high-precision positioning is possible in principle.
(3)部品載置台上の部品を摩擦力で移動させるので、
リードに無理な力を与えないで位置決めできる。したが
って、位置決めすることによってリードを曲げてしまう
ことがない。(3) Since the parts on the parts mounting table are moved by frictional force,
Positioning can be done without applying excessive force to the lead. Therefore, the leads will not be bent due to positioning.
(4)位置決め部材の基準となる2面に部品を無理なく
当てることができ、位置決め精度を向上させることがで
きる。(4) The parts can be easily applied to the two reference surfaces of the positioning member, and the positioning accuracy can be improved.
(5)位置決め部材に部品をセットすることと、位置決
めされた部品を再び取り出すことが簡単に円滑に実行で
きる。(5) It is possible to easily and smoothly set a component on the positioning member and take out the positioned component again.
(6)部品の外形寸法が異なっても、位置決め部材を交
換することなく対応できる。すなわち、部品の外形寸法
は既知であるから、例えばプログラムで吸着ビン等を部
品の中心に持ってくることができる。(6) Even if the external dimensions of the parts differ, it can be handled without replacing the positioning member. That is, since the external dimensions of the part are known, for example, a suction bottle or the like can be brought to the center of the part using a program.
第1図は本発明に係る部品位置決め方法の実施例を示す
斜視図、第2図及び第3図はそれぞれ実施例の作用を示
す平面図、第4図及び第5図はそれぞれ従来の部品位置
決め方法を示す正断面図、P!S6図及び第7図はそれ
ぞれ他の従来例を示す斜視図である。
3・・・面装着用ICl3・・・リード、11・・・位
置決め部材、13A、13B・・・垂直基準面、15・
・・部品載置台。FIG. 1 is a perspective view showing an embodiment of the component positioning method according to the present invention, FIGS. 2 and 3 are plan views showing the operation of the embodiment, and FIGS. 4 and 5 are respectively conventional methods for positioning parts. Front cross section showing the method, P! FIG. S6 and FIG. 7 are perspective views showing other conventional examples, respectively. 3...ICl3...Lead for surface mounting, 11...Positioning member, 13A, 13B...Vertical reference plane, 15...
・Parts mounting table.
Claims (2)
対し、部品を載せる部品載置台を移動自在に設け、該部
品載置台が前記2面のうちの一方の面に向かう速度成分
と他方の面に向かう速度成分の両方を含む方向に移動し
ているときに、当該部品載置台上に部品を載せ、該部品
載置台の前記移動により部品が前記2面に接触して位置
決め状態にあるときに前記部品を取り出すことを特徴と
する部品位置決め方法。(1) A component mounting table for placing a component is movably provided on a positioning member having at least two perpendicular surfaces, and the component mounting table has a velocity component directed toward one of the two surfaces and a velocity component directed toward the other surface. When the component is placed on the component mounting table while the component is moving in a direction that includes both of the velocity components toward which the component is moving, and the component is in a positioning state by contacting the two surfaces due to the movement of the component mounting table, the component is placed in the positioning state. A part positioning method characterized by taking out a part.
方の面に向かう速度成分とが等しくなる方向に前記部品
載置台が移動する特許請求の範囲第1項記載の部品位置
決め方法。(2) The component positioning method according to claim 1, wherein the component mounting table moves in a direction in which a velocity component toward one of the two surfaces is equal to a velocity component toward the other surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171100A JPS6232692A (en) | 1985-08-05 | 1985-08-05 | Part positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171100A JPS6232692A (en) | 1985-08-05 | 1985-08-05 | Part positioning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6232692A true JPS6232692A (en) | 1987-02-12 |
| JPH0346996B2 JPH0346996B2 (en) | 1991-07-17 |
Family
ID=15916979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60171100A Granted JPS6232692A (en) | 1985-08-05 | 1985-08-05 | Part positioning |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232692A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58192399A (en) * | 1982-05-07 | 1983-11-09 | 株式会社日立製作所 | Device for positioning electronic part |
-
1985
- 1985-08-05 JP JP60171100A patent/JPS6232692A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58192399A (en) * | 1982-05-07 | 1983-11-09 | 株式会社日立製作所 | Device for positioning electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346996B2 (en) | 1991-07-17 |
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