JPS6232700A - Electronic equipment box body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Table of Contents] ・Overview, Field of Industrial Use, Conventional Technology (Figure 3.4) ・Problems to be solved by the invention, Means and effects for solving the problems・Example (Fig. 1.2) ・Effects of the invention [Summary] A stepped portion having a cross-sectional shape of a letter L is provided at approximately the center of the upper part of the heat insulating casing,
A heat pipe is disposed approximately horizontally through the vertical wall that constitutes the step, and heat collecting fins and heat dissipating fins are vertically eccentric on the internal and external protrusions of the heat pipe. By attaching the electronic device through the structure, it is possible to downsize the electronic device housing, improve installation efficiency, and improve the mounting efficiency of the electronic device.

[Industrial application field]

The present invention relates to an electronic device casing for accommodating electronic devices such as repeaters installed on a pole or on the ground, and in particular to a case formed using a heat insulating wall having high heat insulation properties in order to keep the electronic device at a predetermined temperature. The present invention relates to an electronic device housing equipped with a heat vibrator for collecting and dissipating heat.

This type of electronic device housing is often installed on the ground or on a pole. For this reason, in summer and the like, the temperature of the electronic device housed within the housing increases due to solar heat and the like. However, since the guaranteed operating temperature of this type of electronic equipment is set below a predetermined temperature (for example, about 40 to 45° C.), it is necessary to cool the electronic device to below this guaranteed operating temperature. As a countermeasure against this problem, electronic device casings are often used in which a hermetic heat-insulating casing is formed using a heat-insulating wall having high heat-insulating properties and is equipped with a heat vibrator.

[Conventional technology]

3 and 4 are explanatory diagrams of the conventional example, and FIG. 3 is a front view of the conventional example (however, the front wall is removed) (A),
FIG. 4 is a front view of the fin 13 (14) shown in FIG. 3. In this case, when facing Fig. 3 (b), the left hand side is the conventional example (electronic device housing) (10) and the front side of each part, the right hand side is the rear side, and from the front side to the rear side. The left-hand side will be called the left side, and the right-hand side will be called the right side.

In FIG. 3, reference numeral 10 indicates the entire conventional example (electronic device housing). This conventional example 10 basically consists of a heat insulating casing 1
1, a heat vibrator 12 equipped with heat collection fins 13 and radiation fins 14, and a sunshade cover 15 attached to each side and top surface of the heat insulating casing (11) through gaps.
and a cover 16 with ventilation holes that covers the heat radiation fins (14) of the heat vibrator (13) to protect it from the sun and to prevent damage from third parties. In addition, 17 is an electronic device (for example, a repeater) disposed inside the heat-insulating casing (11), and 18 is an eye bolt (for lifting the casing) fixed to the top surface of the casing 11.
, 19 indicate handles fixed to the front surface of the housing 11, respectively.

The heat-insulating casing 11 includes heat-insulating walls 11a, llb, llc, and lid on the front and rear surfaces, left and right sides, and upper and lower surfaces.
, lie.

It is formed into a closed box shape starting from 11f. Front insulation wall 11
A is provided as a door that can be opened and closed, and there is a handle 1 on the front side of the door.
9 is fixedly installed. Each of these insulation walls (11a to 11f)
For example, a sandwich structure made of a heat insulating material (eg, urethane foam, etc.) and a metal plate (eg, iron plate, aluminum plate, etc.) is used.

The heat vibrator 12 penetrates the upper part of the rear heat insulating wall 11b in the front-rear direction, has a substantially horizontal shape with its rear end slightly inclined upward, and is disposed so as to protrude into and out of the housing 11. Note that a plurality of heat vibrators 12 are usually provided. The heat vibrator 12 is filled with a predetermined amount of cooling medium (for example, water), has a heat collecting fin 13 attached through its internal protrusion 12a, and a radiation fin 14 attached through its outer protrusion 12b. It is formed so that heat can be transferred only in one direction (direction of arrow F), that is, only in the outward direction in this case. The heat collecting fins 13 are arranged above the top surface of the electronic device (17). In addition, the heat collecting fin 13
As shown in FIG. 4, the heat radiation fin 14 is provided with a mounting hole 13a (14a) in the center in the vertical direction, and the heat vibrator 12 is attached through the mounting hole 13a (14a). Ru. As mentioned above, the sunshade cover 15 has each insulation wall 1 on the front, rear, left and right sides, and top surface.
1a, llb, llc, lid.

116 through a predetermined gap. The cover 16 with ventilation holes is provided to cover the external protrusion 12b of the heat vibrator 12 and the radiation fins 14 attached thereto, and has ventilation holes (
(not shown) is provided, and has both the role of a sunshade and the role of protection against third parties. The electronic device 17 is fixedly installed on the lower heat insulating wall (bottom wall) 11 of the heat insulating casing 11.

This conventional example is configured as described above, and when the temperature inside the heat insulating casing 11 rises due to the heat generated by the electronic device 17 and the heat of the outside air entering through the heat insulating walls (11a to 11f), the heat flow flows into the casing. move upwards inside the body (11);
Heat is collected (absorbed) by the heat collecting fins 13, and the collected heat is transferred to the heat dissipating fins 1 by the action of the heat pipe 120.
4, and is radiated to the outside from this radiation fin 14,
This acts to cool the electronic device 17 and keep it below a predetermined temperature.

Problems to be solved by the invention C] In the above conventional example (10), the heat pipe (12)
The external protrusion (12b) (and the radiation fins 14) is located on the outermost side of the heat insulating casing (11) (in this case, the rear heat insulating wall 1
Since it protrudes outward from the rear surface of 1b, it occupies a large amount of installation space, resulting in a large size. There is a problem in that the heat fins (12b) get in the way, making installation very difficult or impossible in some cases.
), the size (width, height, etc.) of the electronic device (17) is restricted, and as a result, there is a problem that the mounting efficiency of the electronic device (17) is not good.

The present invention was created in view of these problems, and aims to provide an electronic device casing that can be downsized and improve installation efficiency and mounting efficiency of electronic devices. There is.

[Means for solving problems]

In order to solve the above problems, the present invention uses a heat insulating wall to form a hermetically sealed heat insulating casing 21, and forms a stepped portion 21g having a cross-sectional shape approximately at the center of the upper part of the heat insulating casing 21. , a substantially vertical vertical wall portion 21h forming the step portion 21g;
The heat pipe 22 that penetrates the housing 21 and protrudes to the inside and outside of the housing 21 is arranged in a substantially horizontal manner and its external protrusion 22b.
are arranged in such a manner that they do not protrude outward beyond the outermost surface of the casing 21, a heat collecting fin 23 is attached through the internal protruding part 22a of the heat pipe 22, and a heat dissipating fin 24 is attached to the external protruding part 22b. The heat collecting fins 23 are attached with their vertical center portions 23 a eccentrically below the axis of the heat pipe 22 , and the heat dissipating fins 24 are installed with their vertical center portions 23 a eccentrically below the axis of the heat pipe 22 .
Provided is an electronic device housing characterized in that the heat pipe 22 is mounted eccentrically above the axis of the heat pipe 22.

[For production]

There is a step part (
21g) and the vertical wall part (21g) of this stepped part (21g).
1h) and protrudes into and outside of the housing (21) in a substantially horizontal manner and its external protrusion 22.
b is arranged in such a way that it does not protrude outward beyond the outermost surface of the casing (21), and the inner and outer protrusions (
22a, 22b) with heat collecting fins (23) and heat dissipating fins (
24) are installed through each other, it is possible to downsize the electronic device housing and to facilitate and ensure columnar installation.In addition, the lower surface of the stepped portion (21g) allows the heat flow to be concentrated. The heat can be guided to the heat collecting fins (23) for good heat dissipation.

〔Example〕

Figures 1 and 2 are explanatory diagrams of the embodiment of the present invention, and Figure 1 is a front view of the embodiment of the present invention (shown with the front wall removed) (a) and the arrow in (a). Side sectional view seen from direction B (
Figure 2 shows the fins 23 (24) in Figure 1.
) is a single front view. In this case, when facing Figure 1 (to), the left hand side is the present embodiment (11 slave device housing) (2
0) and the front side (front side) of each part, the right hand side is the rear side,
From the front to the rear, the left hand side will be called the left side, and the right hand side will be called the right side.

In FIG. 1, the reference numeral 20 represents the present embodiment (slave device housing).
Show the whole. This embodiment basically consists of a heat insulating casing 21, a heat pipe 22 having heat collecting fins 23 and heat dissipating fins 24, and a heat pipe 22 provided on each side surface and top surface of the heat insulating casing (21) through gaps. The attached sunshade has a cover 25. In addition, 27 is an electronic device (for example, a repeater) arranged inside the heat insulating casing (21), and 28 is the heat insulating casing (21).
An eye bolt fixed on the top surface (for lifting the case),
29 is a handle fixed on the front of the case, 30 is a heat insulating case (
21) A heat flow guide plate fixed to the upper rear end of the interior, 31
1. Indicates the mounting bracket for installation on a pole, which is fixed on the rear surface of the case.

The heat insulating casing 21 includes heat insulating walls 21 a , 21 b , 21 c on the front and rear surfaces, left and right sides, and upper and lower surfaces.
21d.

It is formed in a sealed shape from 21e and 21f. Front insulation wall 2
1a is provided as a door that can be opened and closed, and a handle 29 is fixedly installed on the front surface thereof. In the present invention, the upper heat insulating wall 21e includes:
A step portion 21g having an angular cross-section is provided approximately at the center in the front-rear direction. As shown in FIG. 1(B), the stepped portion 21g is preferably divided by dotted line portions pl and pm, and has a vertical wall portion 21h and a horizontal wall portion 21i, and is formed in a cross-sectional shape. . Note that the vertical wall portion 21h does not necessarily have to be formed vertically, and may be formed with an appropriate inclination. Each of these insulation walls (21a to 21f, 21h,
As 21 i ), a sandwich structure is used in which a heat insulating material (eg, urethane foam, etc.) is sandwiched between metal plates (eg, iron plate, aluminum plate, etc.). The heat pipe 22 passes through the vertical wall portion 21h of the stepped portion 21g in the front-rear direction, and has a substantially horizontal shape with a rear end slightly inclined upward.
and its front and rear ends protrude into the inside and outside of the casing 11, respectively, and the external protrusion (22b) does not protrude outward beyond the outer surface (outermost surface) of the rear heat insulating wall 21b of the casing 11. will be placed. Usually, a plurality of heat pipes 22 are provided. The heat pipe 22 is filled with a predetermined amount of cooling medium (for example, water), and has a plurality of heat collecting fins 2 in its internal protrusion 22a.
3 is attached through and a plurality of heat dissipating fins 24 are attached through the external protrusion 22b of the fins 24 in one direction (direction of arrow F1).
In other words, in this case, it is formed so that heat can be transferred only to the outside of the housing 11. The heat collecting fins 23 are arranged at the upper part of the top surface of the electronic device (27), while the heat dissipating fins 24 are arranged on the horizontal wall part (21i) of the stepped part 21g.
) is placed at the upper part of the top surface. The heat collecting fins 23 and the heat dissipating fins 24 are formed in the same shape as shown in FIG.
Mounting hole 23 b (2
4b) is provided. As shown in FIG. 2, the heat collecting fin 23 is attached to the heat pipe 22 (FIG. 1) with its center portion 23a eccentrically located below the attachment hole 23b. On the other hand, the heat dissipation fin 24 is in a half-turned state from the state shown in FIG.
(Fig. 1). By eccentrically attaching the heat collection and radiation fins (23, 24) in this manner, the dimensions of the vertical wall portion 21h of the stepped portion 21g can be set to the minimum size. The electronic device 27 is fixedly installed on the lower heat insulating wall (bottom wall) 21f of the heat insulating casing 21. The heat flow guide plate 30 is located at the upper rear end inside the housing (21), and its front edge is on the lower surface of the horizontal wall (21i) of the stepped portion 21g, and its rear edge is on the upper front surface of the rear insulation wall 21b. The front end edge is slanted diagonally upward. Inside the heat insulating casing 21, the heat flow is efficiently and intensively guided toward the heat collecting fins 23 by the lower surface of the stepped portion 21g, as shown by the arrow F2 in FIG. By providing the guide plate 30, the heat flow is more efficiently guided and concentrated toward the heat collecting fins 23 by the heat guide plate 30. As a result, an extremely good heat dissipation effect can be obtained.

This embodiment is configured as described above, and the electronic device 2
7 heat generation and insulation walls (21a to 21f).

When the temperature inside the heat insulating casing 21 rises due to the heat of the outside air entering through the heat collecting fins 21h and 21i), the heat flow is intensively guided toward the heat collecting fins 23, and the heat is efficiently collected (absorbed) by the heat collecting fins. This collected heat moves to the radiation fins 24 by the action of the heat pipe 22, and is radiated to the outside via the radiation fins 24, thereby cooling the electronic device 27 and keeping it at a predetermined temperature or lower. act.

Note that the present invention is not limited to the above embodiments,
For example, the step part (21g) may be formed so that the front side of the heat pipe (22) is slightly inclined upward, or the step part (21g) may be arranged so that the heat pipe (22) is arranged in the left-right direction. (21g) may be formed, and various other modifications can be applied in line with the gist of the present invention.

〔Effect of the invention〕

As explained above, according to the present invention, the heat insulating casing (21
) is provided with a step part (21g) on the upper part (top wall), and a heat collecting fin (
23) and radiation fins (24) eccentrically arranged in the vertical direction, the heat pipe (22) is arranged substantially horizontally, so that the portion protrudes outward from the outermost surface of the heat insulating casing (21). Since it is possible to remove this, it is possible to reduce the size of the entire electronic device housing, making it easier and more reliable to install it on a pole. Since the heat can be guided to the heat collecting fins (23) for good heat dissipation, the electronic equipment (27
), that is, the ratio of the volume occupied by the electronic device (27) to the internal volume of the heat insulating casing (21) can be increased.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a front view of the fin 23 (24) shown in FIG. 1,
FIG. 3 is a diagram showing a conventional example, and FIG. 4 is a front view of the fin 13 (14) shown in FIG. 3. In Fig. 1.2, 20 is an embodiment of the present invention, 21 is a heat insulating casing, 21a to 21f are heat insulating walls on the front and rear surfaces, left and right sides, and upper and lower surfaces, 21g is a stepped portion having an angular cross section; 21h is a vertical wall (insulation wall), 21i is a horizontal wall (insulation wall), 22 is a heat vibrator, 22a is an internal protrusion, 22b is an external protrusion, 23 is a heat collection fin, 24 is a heat radiation fin, 23a, 24a is a center part, 23b and 24b are mounting holes, 25 is a sunshade cover, 27 is an electronic device (for example, a repeater), and 30 is a heat flow guide plate.

Claims (1)

[Claims] 1. A sealed heat insulating casing (21) is formed using a heat insulating wall, and a stepped portion (21g) having an L-shaped cross section is formed approximately in the center of the upper part of the heat insulating casing (21). a substantially vertical vertical wall portion (21g) forming the step portion (21g);
21h) and protrudes to the inside and outside of the housing (21) in a substantially horizontal manner, and the external protruding portion (22b) thereof extends outward from the outermost surface of the housing 21. The heat collecting fins (23) are installed in such a manner that they do not protrude, and the heat collecting fins (23) are attached to the internal protruding parts (22a) of the heat pipes (22) through the external protruding parts (22).
A heat dissipating fin (24) is installed through the heat collecting fin (23) in the vertical center part (23a) of the heat collecting fin (23).
) is attached eccentrically below the axis of the heat pipe (22), and the heat dissipation fin (24) has its vertical center (24a) located below the axis of the heat pipe (22). An electronic device housing characterized in that it is mounted eccentrically upward.