JPS6233057A - Soldering method for chip parts in automatic soldering device - Google Patents

Abstract

PURPOSE:To improve a soldering quality by detecting the tip of a substrate by providing a sensor, and controlling automatically a soldering condition, based on its detecting signal. CONSTITUTION:A motor driver part 2 for injecting solder is usually operated by a prescribed number of revolutions or less. A sensor 1 is provided on the upper part of a base plate carrying conveyor, and also the tip of a base plate which has been carried is detected thereby. In this case, a signal which has been sensed by the sensor 1 is sent to the motor driver part 2, a motor for injecting solder is changed immediately to a prescribed number of revolution, and thereafter, soldering is executed by a soldering condition of a chip. At the time of point of a start of soldering, the base plate is carried already to a solder tank 3, therefore, the base plate can suppress a wave of solder. Accordingly, it does not occur that the base plate is covered with a solder wave, and a soldering quality is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of soldering chip components on a board using an automatic soldering device.

(Prior art) Conventionally, as a method for soldering chip components on a board using an automatic soldering device, the soldering wave of the automatic soldering device is made high or strong in order to remove the gas that is drawn into the chip component. , agitation, etc. (hereinafter referred to as chip soldering conditions) to remove gas trapped in the chip components and to obtain good soldering.

(Problem to be Solved by the Invention) However, in the method with the above configuration, when the tip of the board that has been transferred onto the solder bath first touches the solder, a solder wave is formed on the top surface of the board (discrete component mounting surface). Sometimes it gets covered. Therefore, in order to prevent this, a solder wave prevention jig or the like is attached to the board before soldering to prevent solder waves, which requires extra man-hours and time.

This invention is an excellent chip soldering method (means for solving the problem) that does not require attaching a solder wave prevention jig or the like to the board before soldering. In order to solve the above-mentioned problems, the present invention automatically solders chips under predetermined conditions from the moment when one board starts soldering until the end of soldering, and otherwise solders the chips under the predetermined conditions. It is controlled so that

(Function) In this way, the soldering conditions are set to the specified size only from the moment when the board is carried into the soldering tank and the soldering starts until the soldering is completed, and the soldering conditions are kept low for the rest of the time. Therefore, even if the tip of the board first touches the solder, it will not be covered with solder waves. Therefore, the above problem can be eliminated.

(Example) FIG. 1 is a schematic diagram of the soldering method of the present invention, and 1 is a sensor for sensing the substrate, for example, a photo sensor.

Consists of microswitches or similar devices. Reference numeral 2 denotes a solder jet motor driver section, which normally operates at a predetermined rotation speed or less, but is adapted to operate at a predetermined rotation speed based on a signal from the sensor 1. Reference numeral 3 denotes a solder tank, which is disposed below the board conveyor 4.

Next, its operation will be explained.

A substrate (not shown) is transferred to the first substrate by a substrate conveyor 4.
It is transported from left to right in the figure. The sensor 1 senses the tip of the board being transported, sends the sensed signal to the solder jet motor driver section 2, immediately changes the solder jet motor to a predetermined rotation speed, and performs soldering according to the chip soldering conditions. Start attaching.

At this time, since the board has already been transferred to the solder bath 3, the board suppresses the solder waves, so that the board is not covered with solder waves.

Next, when the soldering is completed and the board passes over the solder bath 3, the sensor 1 returns the motor driver section 2 to its original state and waits until the next board arrives.

Note that the conveyor 4 transports the soldered board to the next process.

In this way, since the soldering conditions are controlled only when soldering the board, good soldering can be performed without taking measures to prevent solder waves.

(Effects of the Invention) As described in detail above, according to the present invention, there is no solder wave damage to the board component surface due to chip soldering conditions, and measures are taken to prevent solder wave damage. This has the effect of making good soldering possible.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the soldering method of the present invention. DESCRIPTION OF SYMBOLS 1...Sensor, 2...Motor driver part for solder jet, 3...Solder tank, 4...Conveyor for board conveyance. Figure 1 is a schematic diagram showing the method of the present invention.

Claims (1)

[Scope of Claims] In a method for soldering chip components using an automatic soldering device, (a) a sensor detects that the tip of a board on which a chip component to be soldered is attached is conveyed onto a solder bath; (b) A chip component soldering device in an automatic soldering device characterized in that the soldering conditions of the chip are automatically controlled to a predetermined size until the board passes over the solder bath by the signal from the sensor. Soldering method.